News – Page 2098 – EEJournal

MSC presents further ARM based Qseven Module Family

January 27, 2012

Stutensee, Germany – With the compact MSC Q7-TI8168 module the MSC Vertriebs GmbH expands its offering of ARM^®based embedded boards in compliance with the Qseven™ standard 1.20. The powerful platform integrates the Integra C6A8168 processor from Texas Instruments (TI) with an ARM^® Cortex-A8 core with up to 3000 DMIPS and a digital signal processor (DSP). The 10 GMACS / 7,2 GFLPOS DSP @1.25 GHz C674x supports 32/64-bit single/double precision floating point.

The MSC Q7-TI8168 Qseven™ module is special designed for demanding image processing functions e.g. … Read More → "MSC presents further ARM based Qseven Module Family"

Microsemi Acquires Timing, Synchronization and Synthesis Business from Maxim Integrated Products

January 27, 2012

ALISO VIEJO, Calif.—Jan. 19, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has acquired the telecom clock generation, synchronization, packet timing and synthesis business from Maxim Integrated Products, Inc. (Nasdaq: MXIM). The terms of the transaction were not disclosed.

The acquired product lines and technology are vital to the effective and efficient delivery of time-sensitive voice, data and multimedia traffic over wireless and wired networks, and will further provide Microsemi’s customers with the critical synchronization components required to … Read More → "Microsemi Acquires Timing, Synchronization and Synthesis Business from Maxim Integrated Products"

ACE announces ABI testing in Rembrandt Release of the SuperTest compiler test and validation suite

January 27, 2012

Amsterdam – 27 January 2012 – ACE Associated Compiler Experts bv, world leader in tools and services for professional compiler development and validation, announces the availability of the SuperTest Rembrandt Release. Already the world’s most comprehensive test and validation suite providing unsurpassed quality testing of C, C++, Embedded C and DSP-C compilers, this release of SuperTest incorporates a substantial number of new tests, extended stress testing and an Application Binary Interface (ABI) integration testing framework.

Very rapidly, improvement of software quality and security are becoming the key success factors in all industries. Compilers … Read More → "ACE announces ABI testing in Rembrandt Release of the SuperTest compiler test and validation suite"

Meggitt Sensing Systems Introduces Endevco® Radiation Hardened Accelerometers Operating to +399°C

January 26, 2012

January 26, 2012, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco® model 2273A series, a family of radiation hardened piezoelectric accelerometers for vibration measurements within nuclear and power generation environments.

Offered with a high sensitivity of 10 pC/g, even with its high-temperature operation, the Endevco® model 2273A series is available in both top (model 2273AM20) and side connector (model 2273AM1) versions. Both are radiation hardened for exposures to gamma flux up to 6.2 x 10¹⁰ and integrated neutron flux up to 3.7 x 10¹⁸N/ … Read More → "Meggitt Sensing Systems Introduces Endevco® Radiation Hardened Accelerometers Operating to +399°C"

Bilayer Graphene Works as an Insulator

January 26, 2012

RIVERSIDE, Calif. – A research team led by physicists at the University of California, Riverside has identified a property of “bilayer graphene” (BLG) that the researchers say is analogous to finding the Higgs boson in particle physics.

Graphene, nature’s thinnest elastic material, is a one-atom thick sheet of carbon atoms arranged in a hexagonal lattice. Because of graphene’s planar and chicken wire-like structure, sheets of it lend themselves well to stacking.

BLG is formed when two graphene sheets are stacked in a special … Read More → "Bilayer Graphene Works as an Insulator"

Build Secure Applications with ITTIA DB SQL

January 26, 2012

January 25, 2012 — Bellevue, WA — Developers of mission-critical applications and business intelligence solutions can experience critical safety vulnerabilities if malicious systems on the network or malware applications intercept access to confidential data. These faults can be caused by lack of security for data management and data distribution.

The new release of ITTIA DB SQL is a significant step forward, as its new security and authentication features offer flexible data safety techniques to address these problems. Using these comprehensive features, software developers can achieve the greatest level of data security in embedded applications by encrypting both network … Read More → "Build Secure Applications with ITTIA DB SQL"

Advantech selects Innovasic Semiconductor’s Industrial Ethernet Solution for their Profinet Communication Coupler

January 26, 2012

ALBUQUERQUE, NM, USA, January 2012 – Innovasic Semiconductor is pleased to announce that Advantech has selected the Innovasic fido1100 System on a Chip (SoC) solution to provide Profinet connectivity in their new APAX-5071 Profinet Communication Coupler.

“Innovasic’s fido1100-based Industrial Ethernet platforms enable Industrial Ethernet communications quickly and cost-effectively,” said Jordon Woods, Innovasic CTO. “By utilizing these platforms, customers are spared the burden of understanding the implementation of these communication protocols allowing them instead to focus on their differentiating applications thus reducing time to market,” he concluded.

< … Read More →

Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates Newest 28nm 7 Series FPGAs at DesignCon 2012

January 26, 2012

SAN JOSE, Calif., Jan. 26, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at DesignCon 2012 in Santa Clara, from January 30 – Feburary 2, at the Santa Clara Convention Center, Booth #732. Xilinx Corporate Vice President, FPGA Development and Silicon Technology, Liam Madden, will jumpstart Xilinx’s activities by discussing the benefits and drawbacks of 3D IC standards in the Why Do We Need 3D Design Standards? panel. Xilinx industry experts will also present papers on Stacked Silicon interposer technology and the design benefits of using the Zynq™-7000 Extensible Processing Platform (EPP). Throughout the week, Xilinx … Read More → "Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates Newest 28nm 7 Series FPGAs at DesignCon 2012"

LPI Joins the Linux Foundation

January 26, 2012

(Sacramento, CA, USA: January 26, 2012) The Linux Professional Institute (LPI), the world’s premier Linux certification organization (http://www.lpi.org), announced that it had become a member of the Linux Foundation (http://www.linuxfoundation.org/).

“LPI represents many Linux professionals from around the globe and we have been promoting the professional use of Linux and Open Source since < … Read More → "LPI Joins the Linux Foundation"

Elliptic Technologies Debuts Security Engine For 4G LTE Mobile Backhaul Applications

January 26, 2012

January 25, 2012 – Ottawa, Canada: Elliptic Technologies, a leading supplier of security semiconductor IP and software has announced the release of its IPsec Security Protocol Processor, SPP-230, to address the security needs of the 4G LTE mobile backhaul networks. This unique security engine accelerates IPsec packet processing to allow for multi Gbps performance by providing complete IPv6 ESP and AH packet transforms support.

“Elliptic is delivering yet another highly integrated security product targeted at IP/Ethernet based mobile backhaul applications”, said Elliptic President … Read More → "Elliptic Technologies Debuts Security Engine For 4G LTE Mobile Backhaul Applications"

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