News – Page 2097 – EEJournal

Saelig Introduces Tiny DIP Oscilloscope Module

February 23, 2012

Pittsford, NY, USA: Saelig Company, Inc. (www.saelig.com) has introduced Xminilab – an amazingly sophisticated miniature combination of three electronic instruments: a mixed signal oscilloscope, an arbitrary waveform generator, and a protocol sniffer. Measuring only 3.3″ x 1.75″, it can be mounted directly on a breadboard or pcb for in situ testing and verification. A graphic 2.4″ 128×64 pixel OLED display is mounted on the … Read More → "Saelig Introduces Tiny DIP Oscilloscope Module"

Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products

February 23, 2012

San Jose, California – February 22, 2012- Arasan Chip Systems, Inc. (“Arasan”),a leading provider of Total Semiconductor IP Solutions, announced today that it is experiencing rapid growth in its MIPI IP product line. “Our MIPI product line experienced 3x growth in 2 years”, stated, Andrew Haines VP of marketing. “We see a more diverse mix of customers buying a broader selection of MIPI interfaces including CSI-2, DSI, D-PHY, M-PHY SLIMbus and RFFE.”

The momentum in the MIPI IP market … Read More → "Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products"

Agilent Technologies Announces GS-8800 LTE Conformance Platform; Meets Test Platform Approval Criteria on Band 13

February 23, 2012

SANTA CLARA, Calif., Feb. 22, 2012 – Agilent Technologies Inc. (NYSE: A) today announced that its U1901A GS-8800 LTE conformance test platform, registered with the Global Certification Forum, has met the Test Platform Approval Criteria (TPAC) for Band 13. In addition, the GS-8800 design verification system now has the ability to do TDD LTE RF measurements.

TPAC certification means the Agilent GS-8800 LTE conformance test platform … Read More → "Agilent Technologies Announces GS-8800 LTE Conformance Platform; Meets Test Platform Approval Criteria on Band 13"

Movea Launches MotionCore™ at MWC 2012: The Industry’s First Motion Processing IP Cores Designed for Mobile Devices

February 23, 2012

Grenoble, France – 23 February, 2012 – Movea, a world leader in motion-processing and data fusion technology, announced today its new MotionCore product line: a family of motion processing IP Cores designed for mobile devices. MotionCore architectures are optimized for motion sensing and data fusion applications and run implementations of Movea’s proprietary SmartMotion®algorithms. For sensor-enabled mobile devices, MotionCore delivers increased performance with dramatically reduced power consumption at a significantly lower cost than software only solutions.

The combined market for MEMS accelerometers, gyroscopes and magnetometers and pressure sensors in mobile devices has demonstrated dramatic growth in recent years … Read More → "Movea Launches MotionCore™ at MWC 2012: The Industry’s First Motion Processing IP Cores Designed for Mobile Devices"

SPIRIT DSP Takes Cross-platform, Multi-point HD Video Calling to Mobile World Congress 2012

February 23, 2012

MOSCOW, Russia – February 22, 2012 – SPIRIT DSP, the world’s top voice and video over IP engines provider, has announced today its plans to demonstrate live multi-point, cross platform mobile HD VVoIP (Voice&Video Over IP) calling at Mobile World Congress 2012 in Barcelona, Feb. 27-March 1.

In booth #2H11 (Hall 2), SPIRIT will demonstrate the following award-winning software solutions:

TeamSpirit^®& … Read More → "SPIRIT DSP Takes Cross-platform, Multi-point HD Video Calling to Mobile World Congress 2012"

LSI Expands Axxia Platform to Deliver Power-Efficient Mobile Networks

February 23, 2012

MILPITAS, Calif., February 23, 2012 – LSI Corporation (NYSE: LSI) today announced a significant enhancement of its proven Axxia^® platform that dramatically accelerates performance for next-generation wireless infrastructure. LSI will bring ARM^® processors, long the standard for power efficiency in mobile devices like smartphones and tablets, to mobile networks. The new wireless platform will be the first to combine the latest cores from ARM with hardware accelerators, resulting in a system on a chip uniquely suited to building intelligent, heterogeneous networks.

The new Axxia wireless platform … Read More → "LSI Expands Axxia Platform to Deliver Power-Efficient Mobile Networks"

Renesas Electronics Launches RL78/I1A DC/DC LED Control Demonstration Kit to Facilitate Digital LED Driver Design

February 23, 2012

Dusseldorf, February 23, 2012 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced its new DC/DC LED control demonstration kit based on the RL78/I1A microcontroller (MCU). The RL78/I1A MCU series of five application-specific standard products (ASSP) are designed for lighting applications. The RL78/I1A DC/DC LED control demonstration kit enables system designers to experience the benefits of MCU-based solutions for LED driver development. They can also learn about LED constant current control and various methods of dimming using … Read More → "Renesas Electronics Launches RL78/I1A DC/DC LED Control Demonstration Kit to Facilitate Digital LED Driver Design"

Nordic Semiconductor launches the µBlue™ nRF8002 – a low cost, ultra-low power, uniquely easy to design-in single chip solution for Bluetooth Smart tags and accessories

February 23, 2012

Sampling to customers now, the nRF8002 extends Nordic Semiconductor’s Bluetooth low energy offering with a cost-optimized, ultra-low power, and uniquely easy to design-in single chip solution for Bluetooth Smart (as Bluetooth low energy will now be marketed to consumers) tags and accessories. Nordic Semiconductor will showcase demos of nRF8002-based designs working with both iPhone^® 4S and Android™ based smartphones at the upcoming Mobile World Congress in Spain from February 27 through March 1, 2012

Oslo, Norway – February 22, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA ( … Read More → "Nordic Semiconductor launches the µBlue™ nRF8002 – a low cost, ultra-low power, uniquely easy to design-in single chip solution for Bluetooth Smart tags and accessories"

TI pushes speed threshold with industry’s fastest 16-bit digital-to-analog converter at 1.5 GSPS

February 23, 2012

DALLAS (February 23, 2012) – Continuing to push the limits of data converter performance, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s fastest 16-bit digital-to-analog converter (DAC). The quad DAC34SH84 is 50-percent faster and uses 50-percent less power than the closest 16-bit DAC alternative, clocking in at 1.5 GSPS and consuming just 362 mW per channel. The DAC34SH84 provides an easy, pin-compatible upgrade from the 1.25-GSPS DAC34H84 for customers wanting to maximize speed in 3G, LTE, GSM and WiMAX wireless base stations and repeaters; microwave point-to-point radio; software defined radio; and waveform generation systems. For … Read More → "TI pushes speed threshold with industry’s fastest 16-bit digital-to-analog converter at 1.5 GSPS"

New record low-power multi-standard transceiver for sensor networks

February 22, 2012

San Francisco, Calif., February 22, 2012 – Imec and Holst Centre announce a 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards (IEEE802.15.6/4/4g and Bluetooth Low Energy). The transmitter has been fabricated in a 90nm CMOS process, and consumes only 5.4mW from a 1.2V supply (2.7nJ/bit) at 0dBm output. This is 3 to 5 times more power-efficient than the current state-of-the-art Bluetooth-LE solutions. These results have been obtained in collaboration with Panasonic, within imec and Holst Centre’s program for ultralow-power wireless communication.

Applications for wireless sensor networks, personal healthcare, … Read More → "New record low-power multi-standard transceiver for sensor networks"

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