News – Page 2078 – EEJournal

ADLINK Technology Announces First Industrial-Grade “Smart Panel” Product

January 5, 2012

January 5, 2012, San Jose, CA – ADLINK Technology, Inc., a leading manufacturing of industrial computing products, announced the availability of the revolutionary new Smart Panel series of products designed to provide a new “all-in-one” concept to panel computing applications, such as factory automation equipment, transportation systems, multimedia navigation devices, advertising systems, interactive kiosks, and medical care systems. The Smart Panel series of products provides users an embedded human machine (HMI) where cloud computing is used for the Things of … Read More → "ADLINK Technology Announces First Industrial-Grade “Smart Panel” Product"

Adeneo Embedded recognized as a Freescale “i.MX development specialist” for its software expertise

January 5, 2012

Bellevue, WA, USA, and Ecully, France, January 5th, 2012 – Adeneo Embedded, a Design Alliance Member of Freescale since 2004 announces its designation as “i.MX development specialist” for Freescale Semiconductor.

As an active partner of Freescale Semiconductor for many years, Adeneo Embedded marries its deep working knowledge of i.MX technology with its Windows Embedded, Linux and Android legacy to create a breadth of expertise invaluable to OEMs. This expertise uniquely positions Adeneo Embedded to deliver superior system integration services, Board Support Packages (BSP), drivers and application development as well as performance optimizations, … Read More → "Adeneo Embedded recognized as a Freescale “i.MX development specialist” for its software expertise"

Lattice Semiconductor and Aptina Announce Dual Image Sensor Stereo Camera Reference Design for CES 2012

January 5, 2012

HILLSBORO, OR -JANUARY 5, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC), in collaboration with Aptina, today announced that it will be demonstrating a low cost, dual image sensor design at the Consumer Electronics Show (CES) in Las Vegas, January 10-13, 2012. Lattice’s private hospitality meeting suite will be located in the Las Vegas Hilton, North Hall, 28^th Floor, Suite 127.

The dual image sensor design utilizes two Aptina MT9M024/MT9M034 720P image sensors and combines the image into a single bus on which an ISP (Image Signal … Read More → "Lattice Semiconductor and Aptina Announce Dual Image Sensor Stereo Camera Reference Design for CES 2012"

Xilinx Making Immersive 3D and 4K2K Displays Possible with 7 Series FPGA System Integration

January 5, 2012

SAN JOSE, Calif., Jan. 5, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today introduced new 28nm Kintex™-7 Field Programmable Gate Array (FPGA)-based targeted reference designs and a new development baseboard for accelerating the development of next-generation, 3D and 4K2K display technologies aimed at giving consumers a rich, immersive experience. At next week’s 2012 International CES, the world’s largest consumer electronics tradeshow, attendees can visit Xilinx in suite #MP25556 in the Las Vegas Convention Center to see a demonstration of these development resources that … Read More → "Xilinx Making Immersive 3D and 4K2K Displays Possible with 7 Series FPGA System Integration"

Maxim Introduces TINI® Family of Highly Integrated Solutions for the Consumer Market

January 5, 2012

Sunnyvale, CA–January 5, 2012–Maxim Integrated Products Inc. (NASDAQ: MXIM) today announced its TINI family of highly integrated SoCs and codecs for consumer applications. Offering unparalleled functional integration, TINI products enable system designers to free board space for new differentiating features in smartphones, tablet PCs, smart TVs, and home-monitoring cameras.

“Moore’s law has been a driving force for innovation over the last half century,” explained Vijay Ullal, Group President of Consumer and Automotive Solutions at Maxim. “But as the semiconductor industry approaches the limits of … Read More → "Maxim Introduces TINI® Family of Highly Integrated Solutions for the Consumer Market"

MAZeT appears at the academix in Erfurt

January 5, 2012

Jena (Germany), January 5, 2012 – along with more than 80 other exhibitors, MAZeT GmbH participated in the “academix Thüringen” (www.academix-thueringen.de), which took place for the first time in Erfurt’s exhibition centre on December 14, 2011. The academix is Thuringia’s first state-wide careers fair for students, graduates and young professionals and was promoted throughout Germany. At MAZeT, various offers were showcased for traineeships, MA theses and permanent employment. The academix was organised and given its thematic direction by the Thuringian Agency for Specialist Recruitment (Thüringer … Read More → "MAZeT appears at the academix in Erfurt"

High-performance thin film boost for electronics research

January 5, 2012

[Tsukuba, 4 January 2012] The announcement of this breakthrough comes from a research group led by MANA Scientist Dr. Minoru Osada and Principal Investigator Dr. Takayoshi Sasaki of the International Center for Materials Nanoarchitectonics (MANA) at the National Institute for Material Science (NIMS) in Japan.

Good insulating, high-k nanofilms are expected to be key to future applications as predicted by the International Technology Roadmap for Semiconductors (ITRS).

Minoru Osada and colleagues created thin films based on titanium-niobate nanosheets (TiNbO₅, Ti₂NbO₇, Ti₅NbO< … Read More → "High-performance thin film boost for electronics research"

Combining of two Successful Modular Standards

January 4, 2012

Northwich, Cheshire, 3^rd January 2012 – Kane Computing Ltd (KCL) today reported the availability of a new prototyping platform that enables developers to combine D.Module DSP and FPGA boards with Ansi Vita S7 compliant FMC modules.

The D2-Base-FMC from D.SignT is a prototyping and evaluation platform for the D.Module2 family of DSP and FPGA boards. An Ansi Vita 57 compliant FMC LPC IO site allows it to be used with industry-standard mezzanine boards (A/D and D/A data acquisition, Video and Camera interfaces, Digital Radio frontends etc.).

EnSilica announces new design centre in India focusing on verification

January 4, 2012

Wokingham, UK – 4^th January 2012. EnSilica, a leading independent provider of IC design services and system solutions, has opened a new design centre in India (Bangalore), to complement its existing design facilities in the UK. The new design centre will be a centre of excellence for the advanced verification of complex semiconductor products and IP. Verification services will be provided for both European and local customers based on a range of methodologies but with a particular focus on UVM (the Unified Verification Methodology) and SystemVerilog.

Invensense® Showcases The Latest Motion Interface Innovations and Solutions At CES 2012

January 4, 2012

SUNNYVALE, California, January 3, 2012 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking^™ devices for consumer electronics, will showcase the company’s latest motion interface innovations for smartphones, tablets, game controllers, smart TVs, and wearable sensors at the CES 2012 tradeshow. InvenSense will also demonstrate the IDG-2020/IXZ-2020 family of gyroscopes which has been … Read More → "Invensense® Showcases The Latest Motion Interface Innovations and Solutions At CES 2012"