News – Page 2036 – EEJournal

Ericsson Extends 3E Gold Design Kit with New Development Boards

April 30, 2012

World-Class 3E design kit helps power architects to develop the next generation of energy-efficient systems
3E Gold Edition design kit enables easy implementation of Ericsson’s Advanced Bus Converters and the PMBus-compliant Point-of-Load DC-DC regulators
Two new development boards include support for Single-Inline-Package versions of Point-of-Load DC-DC regulators and heavily paralleled operation for high current carrying capability applications

Ericsson has announced an extension to its 3E Gold Design Kit with the launch of two new development board kits.</ … Read More → "Ericsson Extends 3E Gold Design Kit with New Development Boards"

KEMET Continues Sponsorship of TUfast Electric Car Racing Team

April 30, 2012

KEMET has announced the continuation of its sponsorship of the TUfast e-Technology Racing Team at the Technical University of Munich, for the 2012 racing season.

As part of the sponsorship agreement, KEMET has become a Premier Sponsor and will assist with the development of the 2012 Formula Student Electric Competition race car as well as provide financial support along with a number of major German automotive companies. As the leading manufacturer of DC link film capacitors, KEMET will provide technical expertise in electric vehicle energy conversion and supply all capacitance solutions required for … Read More → "KEMET Continues Sponsorship of TUfast Electric Car Racing Team"

congatec Introduces Entry-Level Module for COM Express Type 2 With New Intel® Atom™ Dual-Core Processors

April 30, 2012

San Diego, California, April 30, 2012 * * * congatec Inc, a leading manufacturer of embedded computer modules, announced today the conga-CCA, an entry-level model of its Type 2 Pin-out COM Express module range. The conga-CCA is available in three variants of the new Intel® Atom™ dual-core processor generation, which are manufactured in 32nm technology – the Intel® Atom™ N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel® Atom™ N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel® Atom™ D2700 processor (1M Cache, 2.13 GHz) with 10W TDP and up to 4GB single-channel DDR3 memory (1066 MHz). The chipset module, which is based on … Read More → "congatec Introduces Entry-Level Module for COM Express Type 2 With New Intel® Atom™ Dual-Core Processors"

Heliatek sets new world record efficiency of 10.7 % for its organic tandem solar cell

April 30, 2012

Dresden, Germany, April 27, 2012 – Heliatek GmbH, technology leader in the field of organic solar films, continues to set new world records for organic solar cells. The company has commissioned SGS, an accredited and independent testing facility, with a measurement campaign of its latest organic photovoltaic (OPV) cells. The result of this campaign is a new world record for OPV with 10.7 % cell efficiency on 1.1 cm2. It also confirms the superior low light and high temperature performances of OPV compared to traditional solar technologies.

The key to Heliatek’s success is the family of small organic molecules – oligomers – developed and … Read More → "Heliatek sets new world record efficiency of 10.7 % for its organic tandem solar cell"

Napatech announces 1G platform refresh

April 30, 2012

ANDOVER, Massachusetts, April 27 – Napatech today announced a comprehensive refresh of the existing family of 4×1 Gbps intelligent network adapters. The planned refresh will take advantage of the latest feature enhancements available on Napatech 10 Gbps and 40 Gbps intelligent network adapters as well as providing the capacity to support future product and feature enhancements. This ensures that Napatech customers can provide a uniform, high performance offering from Megabits to 40 Gigabits per second and beyond.

“While there is a lot of justified focus on 40 Gbps and 100 Gbps, we have to remember that there is still a lot of customers and applications … Read More → "Napatech announces 1G platform refresh"

StarChip Announces the Sampling of the SCF335H, its New Generation of SIM Controllers

April 30, 2012

MEYREUIL, April 26th, 2012- StarChip®, experts in designing, qualifying and industrializing Smart Card ICs today announced that it is currently sampling its SCF335H product, the new generation of SIM controllers designed to cover demands of USIM Java CardTM applications. The SCF335H is the first product of a new family that will fully encompass the Telecom Smart Card ICs market. With this very competitive new generation, StarChip planned to cover SIM native, USIM Java Card, LTE and High-end SIM/NFC applications. The SCF136H covering the Native market, … Read More → "StarChip Announces the Sampling of the SCF335H, its New Generation of SIM Controllers"

Express Logic’s ThreadX RTOS Outshines Competition in 2012 Embedded Developer Survey

April 30, 2012

San Diego, CA – April 30, 2012 – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that Express Logic’s ThreadX® RTOS ranked above competitive RTOSes in percentage of projects completed on time or ahead of schedule, according to data from the 2012 Embedded Market Forecasters’ (EMF) survey of embedded developers. The survey showed that nearly 80% of ThreadX-based projects were completed on … Read More → "Express Logic’s ThreadX RTOS Outshines Competition in 2012 Embedded Developer Survey"

Cadence Announces TripleCheck IP Validator for Faster IP Compliance Testing

April 30, 2012

SAN JOSE, CA–(Marketwire – April 30, 2012) – “PCI-SIG® is the industry leading organization responsible for development and management of the PCI Express specification,” said Al Yanes, president and chairman, PCI-SIG. “We are delighted that Cadence continues to advance the PCI Express 3.0 specification with their innovative verification IP products and methodologies.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced TripleCheck IP Validator, a new addition to the Read More → "Cadence Announces TripleCheck IP Validator for Faster IP Compliance Testing"

Samsung Electronics Tapes out Gigahertz+ ARM Cortex-A15 Processor with Synopsys IC Compiler

April 30, 2012

MOUNTAIN VIEW, Calif., April 30, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced the successful collaboration between Synopsys and Samsung Electronics on the implementation of an ARMCortex-A15 MPCore™ processor. The processor core was implemented by Samsung Austin Research Center (SARC) using Synopsys IC Compiler place-and-route technology, a cornerstone of the Synopsys Galaxy™ Implementation Platform. Running at operating speeds in excess of a gigahertz on Samsung’s 32nm low power process, the hardened core has already been deployed in the … Read More → "Samsung Electronics Tapes out Gigahertz+ ARM Cortex-A15 Processor with Synopsys IC Compiler"

Quad µModule Analog-to-Digital Converters with Integrated Signal Conditioning Reduce Size, Power & Time-to-Market for Imaging & Base Station Designs

April 25, 2012

MILPITAS, CA – April 24, 2012 – Linear Technology introduces the LTM9012, a quad 14-bit, 125Msps µModule® analog-to-digital converter (ADC) with integrated fixed gain drivers, passive filtering and bypass capacitance. The integrated µModule converters offer dramatic reduction in board space for high channel-count applications as diverse as medical imaging systems and MIMO (multiple input multiple output) 4G base stations. This high level of integration enables smaller boards with greater density, … Read More → "Quad µModule Analog-to-Digital Converters with Integrated Signal Conditioning Reduce Size, Power & Time-to-Market for Imaging & Base Station Designs"