News – Page 2029 – EEJournal

LAPIS Semiconductor Announces an Ultra-Low Power, Ultra-Compact Sensor Hub Microcontroller for Smartphones & Accessories

June 11, 2012

SAN DIEGO, Calif. – June 6, 2012 – LAPIS Semiconductor (formerly OKI Semiconductor), a ROHM Group company, announces the development of the ML610Q792 Sensor Hub Microcontroller—the industry’s smallest ultra-low-power microcontroller designed for integrated, low-power control of multiple sensors in smartphones.

The ML610Q792 makes it possible to deploy new cloud-based features and services in smartphones that would otherwise be prohibitive due to increased power consumption. It logs user environment data and detects user activity without disturbing the host processor. And its remarkably low power consumption not only prolongs battery life, but enables support for wireless communication in compact … Read More → "LAPIS Semiconductor Announces an Ultra-Low Power, Ultra-Compact Sensor Hub Microcontroller for Smartphones & Accessories"

IAR Systems provides unmatched complete support for ARM Cortex cores

June 11, 2012

Uppsala, Sweden—June 11, 2012—IAR Systems® announces that its powerful C/C++ compiler and debugger tool suite IAR Embedded Workbench® for ARM® provides the world’s broadest support for the complete range of ARM Cortex™ cores.

IAR Systems supplies development tools for more ARM devices than any other embedded development tools vendor, offering its customers the opportunity to standardize their development environment. The offer is now strengthened even further with support for five additional cores. The latest additions include the energy-efficient ARM Cortex-M0+ core, and the high-end cores ARM Cortex-R5, ARM Cortex-R7, ARM Cortex-A7, … Read More → "IAR Systems provides unmatched complete support for ARM Cortex cores"

New Ruggedised 300W 3U CompactPCI Power Supplies from Gresham Power Electronics

June 11, 2012

Gresham Power Electronics, the Salisbury based Defence and Commercial power conversion specialist, has launched ruggedised versions of its highly successful 300W, 3U cPCI power supply. Available in 24VDC, 48VDC and universal AC input versions the new power supply range has a conformal coating making it suitable for extreme industrial, MIL/COTS and marine applications.

Fully compliant to the PICMG 2.11 Power Interface Specification the AC 3U 300R provides 300W maximum power in standard 3U x 8HP shelf space with interconnection via a Positronic 47 pin connector. The new cPCI power supplies are hot-swap and parallel redundant enabled. Extra-high power … Read More → "New Ruggedised 300W 3U CompactPCI Power Supplies from Gresham Power Electronics"

Tohoku University and imec Partner to Enhance Research and Collaboration Efforts

June 11, 2012

Tokyo (Japan) – June 11, 2012 – Today Tohoku University (Sendai, Japan) and imec signed a collaboration agreement in the presence of his Royal Highness Prince Philip of Belgium during the Belgian economic mission to Japan. Under the agreement, Tohoku University and imec will work closely together in various common areas of research, learning from each other’s expertise and leveraging each other’s strengths.

The collaboration agreement sets the framework for future collaboration projects between imec and Tohoku University where students, research staff, and professors will be exchanged between both organizations. Moreover, the agreement enables the exchange of samples between … Read More → "Tohoku University and imec Partner to Enhance Research and Collaboration Efforts"

Avnet Electronics Marketing Americas Expert to Present on Software Validation at Freescale Technology Forum

June 11, 2012

PHOENIX—June 11, 2012 — For most engineers, meeting stringent regulatory requirements for software validation can be a downright demanding process. To help save valuable time and money, Jim Carver, technical director of advanced architectures for Avnet Electronics Marketing Americas, a business region of Read More → "Avnet Electronics Marketing Americas Expert to Present on Software Validation at Freescale Technology Forum"

Lattice Programmable Power Manager Device Reduces Cost Of Power Failure Protection For Solid State Drives

June 11, 2012

HILLSBORO, OR – June 11, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced power management solutions that will greatly simplify and increase the reliability of power failure protection circuitry in Solid State Drives (SSD). The power failure protection circuitry prevents data loss in the event of input power failure by using the on-board hold-up capacitor to provide supplemental power during that critical period when the data is fully saved into the Flash memory. These circuits traditionally use either a super capacitor or a tantalum capacitor bank along with a voltage boost converter to … Read More → "Lattice Programmable Power Manager Device Reduces Cost Of Power Failure Protection For Solid State Drives"

Synopsys’ LightTools Offers New Solutions for Lighting Systems Design and Analysis

June 11, 2012

MOUNTAIN VIEW, Calif., June 11, 2012 /PRNewswire/ —

Highlights:

Introduces a utility for designing and optimizing roadway lighting systems
Leverages leading-edge metrics to augment analysis of light source color performance
Delivers enhanced phosphor modeling for the design of warm-light LEDs
Simplifies and speeds design management with a centralized optical property manager
Accelerates large model simulations with performance enhancements

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today … Read More → "Synopsys’ LightTools Offers New Solutions for Lighting Systems Design and Analysis"

Energy Micro launches free sample program for EFM32 Gecko microcontrollers

June 11, 2012

Oslo, Norway, 11 June, 2012 – Energy Micro, the energy friendly microcontroller and radio company, today announced a new program that gives designers around the world quick and easy access to free samples of the EFM32 Gecko series microcontrollers (MCUs).

Part of the company’s focus on simplicity, the sample program is aimed at designers wanting to test the latest and most energy efficient MCU technology. In addition to the free Simplicity Studio developers’ suite, engineers wishing to order their free samples simply need to visit http:// … Read More → "Energy Micro launches free sample program for EFM32 Gecko microcontrollers"

Maxim’s RF-DAC Technology Delivers Software-Defined Radio Benefits to Macro- and Small Cell Base Stations

June 11, 2012

Sunnyvale, CA—June 11, 2012—Maxim Integrated Products (NASDAQ: MXIM) announces the MAX5879 multi-Nyquist RF digital-to-analog converter (RF DAC) that delivers a fully digital software-defined radio (SDR) transmitter, enabling a common hardware platform for multicarrier, multiband, and multistandard base stations.

Working with FPGA-based direct digital synthesis (DDS), the MAX5879 RF DAC architecture shifts the functions of the analog quadrature modulator and agile local oscillator (LO) used in current architectures into the digital domain. This eliminates in-phase and quadrature errors, and LO feedthrough, commonly associated with analog upconversion. The MAX5879 dramatically simplifies RF design and improves reliability for base-station transmitters.</ … Read More → "Maxim’s RF-DAC Technology Delivers Software-Defined Radio Benefits to Macro- and Small Cell Base Stations"

ESCATEC now offers Package-on-Package capability

June 11, 2012

Heerbrugg, Switzerland – 11 June, 2012 – ESCATEC, the EMS innovator, has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland. PoP enables one BGA package, such as a memory chip, to be soldered on top of another BGA, such as a processor.

Martin Muendlein, ESCATEC’s Engineering Manager, explained, “Until now, PoP has only been used in high volume applications such as mobile phones, where it provides high density packaging, low power and high performance. We believe that we are one of the first contract manufacturers in Europe to offer this as a low volume option to … Read More → "ESCATEC now offers Package-on-Package capability"

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