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Cadence Announces Updated Design and Verification IP for DDR PHY Interface

SAN JOSE, CA–(Marketwire – May 29, 2012) – “As the performance of the processors used in today’s consumer electronics devices improves, so does their need for higher-bandwidth memory. The DFI interface standard was developed to give SoC designers a way to easily incorporate high-performance memory into their SoCs,” said Marc Greenberg, director of marketing, SoC Realization, Cadence. “Through our close working relationship with the DFI Group, we are able to offer our customers design and verification IP that supports the latest version of this popular interface standard.”Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Announces Updated Design and Verification IP for DDR PHY Interface"

Test System TTsuite Expanded for all MOST® Speed Grades and Physical Layers

Munich (Germany) May 29, 2012 – Test specialist RUETZ SYSTEM SOLUTIONS extends its test system TTsuite to all available speed grades and physical layers of the networking standard MOST (Media Oriented Systems Transport) for in-car data transmission. Thus the qualified system integrator for automotive data communication now provides the optimized test system for speed grades of 25, 50 and 150 Mbit/s. The supported physical layers for MOST include POF (plastic optical fiber) and electrical physical layers: coax and shielded or unshielded twisted pair (STP/UTP) copper wires. “With the enhanced and optimized TTsuite, all test cases that have been automated once with TTsuite … Read More → "Test System TTsuite Expanded for all MOST® Speed Grades and Physical Layers"

Standardization Group for Embedded Technologies (SGET) Inaugurated

Munich, Germany, 29 May 2012  * * *  A group of embedded computing manufacturers have formed a registered association to drive standardization of embedded computing technologies called The Standardization Group for Embedded Technologies (SGET) e.V. The proclaimed aim of the association is to speed up the development of new standards for embedded hardware and software. 23 companies signed up to support the founding principles during the inaugural meeting, among them Advantech, congatec, Data Modul, Kontron, MSC and Seco.

“While there are many board manufacturers among the founding members, SGET also has a clear focus on tackling related issues such as software,” points … Read More → "Standardization Group for Embedded Technologies (SGET) Inaugurated"

NECs CyberWorkBench and Imperas OVP Fast Processor Models Integrated to Expand Hardware-Software Co-Verification Capabilities

OXFORD, United Kingdom, May 22, 2012 – Imperas today announced that its Open Virtual Platforms (OVP) OVPsim simulator and OVP Fast Processor Models have been integrated with NEC’s CyberWorkBench (CWB) SystemC cycle-accurate hardware models. OVP\’s position as the de facto source of instruction accurate processor core models provides additional value to CyberWorkBench’s complete C/SystemC SoC design flow including ANSI-C/SystemC synthesis, hardware-software (HW/SW) co-verification and C-based formal verification.

CyberWorkBench is a C-based electronic circuit design platform developed by NEC over the course of twenty years. CyberWorkBench … Read More → "NECs CyberWorkBench and Imperas OVP Fast Processor Models Integrated to Expand Hardware-Software Co-Verification Capabilities"

Mentor Graphics and GLOBALFOUNDRIES Collaborate on 20nm Fill Solutions Based on Calibre SmartFill

WILSONVILLE, Ore., May 29, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced that GLOBALFOUNDRIES will use the SmartFill facilities of the Calibre® YieldEnhancer product to enable advanced fill techniques for 20nm manufacturing processes. The multi-layer fill analysis and cell-based fill generation capabilities of the SmartFill system help designers deal with complex fill interactions at advanced nodes with minimal impact on circuit performance. Moreover, Calibre SmartFill delivers greatly reduced post-fill GDS database size and faster runtimes compared to traditional dummy fill. Used with the design kit provided by GLOBALFOUNDRIES, Calibre SmartFill allows designers to meet IC fill constraints in a single … Read More → "Mentor Graphics and GLOBALFOUNDRIES Collaborate on 20nm Fill Solutions Based on Calibre SmartFill"

Kistler Piezoelectric Accelerometers Support Aircraft, Satellite, UAV, Helicopter and Missile Ground Vibration Testing

May 24, 2012, Novi, Michigan, USA – Kistler (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has announced the availability of its piezoelectric accelerometer technologies for cost-effective, high-accuracy support of aircraft, helicopter, rotorcraft, missile, satellite and unmanned aerial vehicle (UAV) ground vibration testing (GVT), as well as large-scale MIMO and SIMO aerospace structural monitoring.

Typical aerospace GVT requirements call for the use of high-performance piezoelectric accelerometers which offer a lower per channel cost, yet which are also … Read More → "Kistler Piezoelectric Accelerometers Support Aircraft, Satellite, UAV, Helicopter and Missile Ground Vibration Testing"

Mentor Graphics, STMicroelectronics and CEA-Leti join to launch the technological R&D programs of the NanoElec IRT

GRENOBLE, France – May 24, 2012. The ANR (French National Research Agency) and the CEA (French Atomic and Renewable Energy Commission) signed an agreement forming the Grenoble Institute of Technological Research (IRT): NanoElec Program.

Based on Grenoble’s pioneering ecosystem, the IRT partners aim to conduct world-class R&D, and to share their research with all industrial sectors, especially small, medium and intermediate sized enterprises, as well as to provide training in the necessary skills in these areas, specifically micro and nano-electronics.

The technological R&D activities will focus on 3D IC integration and integrated silicon-photonics … Read More → "Mentor Graphics, STMicroelectronics and CEA-Leti join to launch the technological R&D programs of the NanoElec IRT"

Direct Conversion has the ‘Edge’ for SDR Design

Maldon, Essex – CML Microcircuits (www.cmlmicro.com), a leading innovator and provider of low-power semiconductors for global wireless and two-way radio communications markets, has increased the operating range of its CMX994 Direct Conversion Receiver. 

Through an on-going research and development programme, CML has extended the operating range of the CMX994 Direct Conversion Receiver (DCRx) IC. Now operating over an RF range of 50MHz to 940MHz, the CMX994 now addresses a wider range of Software Defined Radio (SDR) demands.

The CMX994 is a receiver Integrated Circuit (IC) … Read More → "Direct Conversion has the ‘Edge’ for SDR Design"

19-inch industrial computer with slot-CPU technology based on the Intel® Q67 chipset

Munich, May 2012 – The three new 19-inch computer models from DSM Computer’s Infinity® family are based on the compact industrial slot CPU 96M4361o of the upper performance class. The Intel® Q67 chipset and the integrated Intel® Core desktop processor of the second generation with as many as four computing cores ensure high computing and graphic performance. Compared with the Intel</ … Read More → "19-inch industrial computer with slot-CPU technology based on the Intel® Q67 chipset"

Agilent Technologies Introduces CAN Eye-Diagram Mask Testing on InfiniiVision X-Series Oscilloscopes

SANTA CLARA, Calif., May 24, 2012 – Agilent Technologies Inc. (NYSE: A) today introduced the oscilloscope industry’s first eye-diagram mask testing capability for the differential Controller Area Network serial bus. The CAN serial bus is used extensively for control and sensor monitoring in automotive applications as well as a broad range of industrial and medical equipment applications.

For years, oscilloscopes have been the primary measurement tools used to verify the signal integrity of the … Read More → "Agilent Technologies Introduces CAN Eye-Diagram Mask Testing on InfiniiVision X-Series Oscilloscopes"

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