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Molex Custom LED Circuit Assemblies Offer Wide Range Of High Volume Production Design Options

LISLE, IL – July 17, 2012 – Molex Incorporated has ramped up engineering and production to bring custom LED circuit assemblies into a broader range of electronic products – from appliances and computers to automotive and consumer electronics.  Molex LED solutions on printed circuit board (PCB) substrates are … Read More → "Molex Custom LED Circuit Assemblies Offer Wide Range Of High Volume Production Design Options"

RFSA2514/2524 5-Bit Serial-Controlled Digital Step Attenuators

RFMD’s new RFSA2514/2524 5-bit digital step attenuators (DSAs) feature high linearity over their entire gain control range with excellent step accuracy in 0.5dB (RFSA2514) or 1dB (RFSA2524) steps. They are programmed via a serial mode control interface that is both 3V and 5V compatible. They also offer a rugged Class 1C HBM ESD rating via on-chip ESD circuitry. The MCM package is footprint-compatible with most 24-pin, 4mm x 4mm, QFN packages.

Features

Fujitsu Semiconductor Selects Cadence Signoff Solution for Its Newest Reference Design Flow

SAN JOSE, CA–(Marketwire – July 17, 2012) – Timing signoff closure has become an increasingly significant bottleneck due to the increase in modes and corners required for analysis and the divergence of timing results between implementation and signoff timing tools. Furthermore, the complexity of today’s designs requires the ability to do complete physically-aware MMMC signoff during ECO for rapid timing closure. To accomplish this requires a deep integration between physical and signoff design tools and a fundamentally new approach to software architecture. All of this can be done today uniquely with Cadence Encounter Timing System. The Encounter Timing System’s physically … Read More → "Fujitsu Semiconductor Selects Cadence Signoff Solution for Its Newest Reference Design Flow"

Proof-of-Concept Library is compatible with IEEE Std. 1666™-2011 Standard, includes Transaction-Level Modeling

Napa, Calif., USA, 16 July 2012 — Accellera Systems Initiative announces the release of version 2.3.0 of its SystemC open source proof-of-concept library, now available at no charge to the worldwide electronic design community. Compatible with the newly revised IEEE 1666 “Standard SystemC Language Reference Manual,” announced by the IEEE Standards Association in November 2011, version 2.3.0 provides a number of important new features, including support for transaction-level modeling (TLM), a critical approach to enable high level and more efficient design of complex ICs and SoCs in a single library.

New extensive process control features enable modeling of concepts such as power domains and … Read More → "Proof-of-Concept Library is compatible with IEEE Std. 1666™-2011 Standard, includes Transaction-Level Modeling"

Cadence Encounter RTL-to-GDSII Flow Enables Sharp to Achieve 2X Improvement in Turnaround Time

SAN JOSE, CA–(Marketwire – July 17, 2012) – “Once we switched to the Cadence Encounter RTL-to-GDSII flow, we saw dramatic improvements in turnaround time and better quality designs,” said Naoya Fujita, division deputy general manager and department general manager of the Product Planning Department, Sensing Device Division in Sharp’s Electronic Components and Devices Group. “We exceeded our design requirements and expectations, and look forward to continued collaboration with Cadence to meet the growing demand for high-quality CMOS images sensors.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader … Read More → "Cadence Encounter RTL-to-GDSII Flow Enables Sharp to Achieve 2X Improvement in Turnaround Time"

Green Hills Software Announces Optimized Tools for Renesas Electronics’ New-Generation RH850 Microcontroller

SANTA BARBARA, CA and TOKYO, JAPAN — July 17, 2012 — Green Hills Software, the largest independent vendor of embedded software solutions, today announced its collaboration with Renesas Electronics Corporation, a premier provider of advanced high performance semiconductor solutions, for the development of the best-of-class automotive solution for Renesas’ new RH850 family of automotive microcontrollers (MCU). Green Hills Software’s MULTI® multicore debugger, optimizing compiler, TimeMachine™ suite and processor probes will target the advanced capabilities of the new RH850 core, including its high-speed floating-point unit (FPU), enhanced peripherals, and multicore debug and high-speed processor trace interfaces.

Today’s … Read More → "Green Hills Software Announces Optimized Tools for Renesas Electronics’ New-Generation RH850 Microcontroller"

TI introduces ultra-small boost power module for smartphones and tablets

DALLAS (July 17, 2012) – Texas Instruments Incorporated (TI) (NASDAQ:TXN) today introduced the industry’s smallest integrated step-up (boost) DC/DC power module for smartphones, tablets and other portable electronics. The new, efficient TPS81256 MicroSiP™ converter integrates the inductor and input/output capacitors to achieve a solution less than 9-mm2 and sub-1 mm height, simplifying design and saving up to 50-percent more board space versus competing solutions. For more information, samples and evaluation module, visit: www.ti.com/tps81256-pr.     

Smallest integrated boost converter</ … Read More → "TI introduces ultra-small boost power module for smartphones and tablets"

Xilinx Ships First Artix-7 FPGAs – Raising the Performance Bar for Portable and Small Form Factor Applications at the ‘Edge

SAN JOSE, Calif.July 17, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced first shipments of its Artix™-7 Field Programmable Gate Array (FPGA) family. The new devices extend the reach of FPGA technology to applications requiring performance capabilities traditionally served by Virtex® FPGAs, but the form factor of small, low-cost programmable devices. Makers of portable medical, hand-held radio, and small cellular base stations – and a host of other professional grade applications that sit at the edge of their respective technology infrastructures – … Read More → "Xilinx Ships First Artix-7 FPGAs – Raising the Performance Bar for Portable and Small Form Factor Applications at the ‘Edge"

Xilinx Demonstrates Value of Programmable Systems Integration at ESC India 2012

BANGALORE, IndiaJuly 15, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will demonstrate its Zynq™-7000 Extensible Processing Platform (EPP) and new Vivado™ Design Suite, as well as presenting two conference papers on FPGA design for software developers and System-on-Chip (SoC) integration at ESC India 2012 from July 18-20, 2012. Xilinx will show visitors how its All Programmable technologies enable flexible, scalable embedded designs for achieving increased system performance and accelerated design productivity.

Xilinx’s All Programmable technologies comprise of FPGAs, 3D ICs and SoCs featuring programmable hardware, software and … Read More → "Xilinx Demonstrates Value of Programmable Systems Integration at ESC India 2012"

Buffalo’s 802.11ac Wireless Solutions Launch In EMEA

Buffalo Technology, a global leader in the design, development and manufacturing of wired and wireless networking and network and direct attached storage solutions, today announced that the AirStation™ 1750 Wireless 802.11n+11ac Gigabit Dual Band Router WZR-D1800H-EU and AirStation™ 1300 Wireless 802.11n+11ac Gigabit Dual Band Media Bridge WLI-H4-D1300-EU wireless media bridge are now available for purchase from select online partners. Based on Broadcom’s 5G WiFi chips and first unveiled on the show floor at the 2012 International Consumer Electronics Show (CES) in Las Vegas, WZR-D1800H-EU and WLI-H4 … Read More → "Buffalo’s 802.11ac Wireless Solutions Launch In EMEA"

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