News – Page 2009 – EEJournal

Quad Independent Resistor Networks with Guaranteed CMRR Matching of 0.005% from -40°C to 125°C

May 12, 2011

MILPITAS, CA – May 11, 2011 – Linear Technology introduces the LT5400, its first family of precision matched resistors designed for high performance signal conditioning applications in difference amplifiers, precision dividers, references and bridge circuits. Three resistor network options are in full production today with resistor ratios of 1:1 and 10:1 quad 10K resistors, quad 100K resistors and dual 10K / … Read More → "Quad Independent Resistor Networks with Guaranteed CMRR Matching of 0.005% from -40°C to 125°C"

Synopsys’ DesignWare SATA 6Gb/s IP Solutions Receive SATA-IO Certification

May 12, 2011

MOUNTAIN VIEW, Calif., May 12, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that its DesignWare® SATA IP solutions, including Host and Device Digital Controllers and mixed-signal PHY IP, have successfully passed the Serial ATA International Organization (SATA-IO) 6G certification. To achieve certification, the DesignWare SATA solutions maintained a 6 Gigabit per second (Gb/s) data transfer rate and passed more than 200 tests that span electrical, digital and system interoperability as defined in the SATA Revision 3.0 specification. Synopsys’ fully certified DesignWare SATA IP solutions support … Read More → "Synopsys’ DesignWare SATA 6Gb/s IP Solutions Receive SATA-IO Certification"

TI’s digital temperature sensor cuts power consumption, size more than 75 percent

May 12, 2011

DALLAS (May 12, 2011) – Texas Instruments Incorporated (TI) (NYSE:TXN) today unveiled the industry’s smallest, most power-efficient digital temperature sensor. The TMP103 consumes 97 percent less power and is 75 percent smaller than the next closest competitor. It also provides global read/write functionality to ease thermal profiling. Using a single command, eight TMP103 devices mounted on the board can simultaneously identify and monitor hotspots. The TMP103 simplifies thermal profiling while enabling longer battery life and smaller form factors for portable consumer electronics such as smartphones, tablets, laptops and netbooks. For more information or to place an … Read More → "TI’s digital temperature sensor cuts power consumption, size more than 75 percent"

Press-fit pins for solder-less assembly of power modules

May 12, 2011

May 11th 2011 – Solder pins have been the interface of choice for power modules for many years. In this day and age, when cost saving very often leads to compromises in quality, Vincotech’s new Press-fit technology goes against the trend. The new Press-fit pin takes the assembly properties of Vincotech power modules a step further: the solder-less assembly of the modules, equally easy on both sides of the PCB, leads to higher reliability and design flexibility, and drastically reduces production costs.

The aim of the development was an interconnect technology that would eliminate the … Read More → "Press-fit pins for solder-less assembly of power modules"

Cadence to Unveil OrCAD Capture Marketplace With Industry-First Online Apps; Puts a PCB Design ‘Universe’ at Engineers’ Fingertips

May 12, 2011

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today unveiled OrCAD Capture Marketplace, a unique Web-enabled environment that brings a complete PCB ecosystem — including an industry-first online store for applications — to engineers’ fingertips. Accessible within the new version of the Cadence® OrCAD® Capture schematic design tool, the marketplace fundamentally changes the way PCB designers can access design data, stay informed and discover new resources, including apps to customize and extend the OrCAD environment.

The OrCAD … Read More → "Cadence to Unveil OrCAD Capture Marketplace With Industry-First Online Apps; Puts a PCB Design ‘Universe’ at Engineers’ Fingertips"

Maxim to Demo Real-Time Power Efficiency Inside LED Ballast at LIGHTFAIR with Teridian Energy-Measurement SoC

May 12, 2011

SUNNYVALE, CA—May 11, 2011—Next week at LIGHTFAIR(R) International in Philadelphia, Teridian Semiconductor, a subsidiary of Maxim Integrated Products (NASDAQ: MXIM), will demonstrate both AC- and DC-power measurement suitable for high-power LED-lighting ballasts. Using the Teridian/Maxim 78M6613 energy-measurement system-on-chip (SoC), the demo, located at Maxim’s booth #3351, will validate the interoperability of various components to create a ballast capable of measuring its own power efficiency.

Targeted for applications such as warehouse, architectural, garage, parking lot, street, and highway lighting, the demo will feature a lighting ballast that has both Digital Addressable Lighting Interface ( … Read More → "Maxim to Demo Real-Time Power Efficiency Inside LED Ballast at LIGHTFAIR with Teridian Energy-Measurement SoC"

Quantum3D Thermite Tactical Visual Computers Integrated into AAI Man-Portable Aircraft Survivability Trainer

May 12, 2011

SAN JOSE, Calif. – May 11, 2011 – Quantum3D, Inc., a leading provider of visual computing solutions for government and commercial applications, today announced its Thermite^® TL tactical visual computer has been integrated into the Man-portable Aircraft Survivability Trainer (MAST) developed by AAI Test & Training, an operating unit of Textron Systems, a Textron Inc. (NYSE: TXT) company. Recently selected by the U.S. Army Program Executive of Office for Simulation, Training and Instrumentation (PEO STRI) for strategic training initiatives, MAST replicates effects of an infrared (IR) threat-based weapon and activates aircraft survivability equipment … Read More → "Quantum3D Thermite Tactical Visual Computers Integrated into AAI Man-Portable Aircraft Survivability Trainer"

Tanner EDA to Give One-day Hands-on Training at Workshop on Affordable Design and Production of Mixed-signal ASICS for SMEs in Switzerland

May 12, 2011

MONROVIA, California – May 12, 2011 — Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs), will give one-day hands-on training on schematic entry, simulation, IC layout, and DRC/ LVS at the Workshop on Affordable Design and Production of Mixed Signal ASICs for Small and Medium Enterprises (SMEs) in Windisch, Switzerland on May 18^th, 2011. The Workshop, which takes place on May 17^{th</ … Read More → "Tanner EDA to Give One-day Hands-on Training at Workshop on Affordable Design and Production of Mixed-signal ASICS for SMEs in Switzerland"}

Green Hills Software Announces Support for Multicore Processors in INTEGRITY-178B High-Assurance Multi-Level-Secure Real-Time Operating System

May 11, 2011

SANTA BARBARA, CA — May 11, 2011 — Green Hills Software, the proven worldwide leader in FAA/EASA- and NSA-certified high-assurance operating systems, today announced that its newest version of the INTEGRITY-178B real-time operating system (RTOS) supports multicore processors with initial availability on Freescale Semiconductor’s family of QorIQ™ processors. Green Hills Software has raised the bar by offering the embedded computing markets a safety- and security-critical operating system for multicore processors from a trusted and reliable supplier of high-assurance operating systems. This update of INTEGRITY-178B maintains its exceptional support for robust partitioning, yet now provisions this … Read More → "Green Hills Software Announces Support for Multicore Processors in INTEGRITY-178B High-Assurance Multi-Level-Secure Real-Time Operating System"

Microchip Introduces Accessory Development Kits for Android™

May 11, 2011

CHANDLER, Ariz., May 10, 2011 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced its Accessory Development Starter Kits for Android™, which enable accessory development for Google’s Android platform. Specifically, Android versions 2.3.4 and 3.1 and later include a new framework that allows apps to communicate directly with an accessory connected to a smartphone or tablet, via USB. The kits consist of a development board and a software library, available via free download from http://www.microchip. … Read More → "Microchip Introduces Accessory Development Kits for Android™"

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