News – Page 19 – EEJournal

Xanadu and AMD Accelerate Quantum Computing for Aerospace and Engineering

March 12, 2026

TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD high-performance computing solutions on the AMD DevCloud, Xanadu successfully demonstrated how advanced aerospace simulations can be prepared and run in … Read More → "Xanadu and AMD Accelerate Quantum Computing for Aerospace and Engineering"

NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI

March 11, 2026

First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package
Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement
Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market

NUREMBERG, Germany, March 9, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, … Read More → "NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI"

Axelera® AI Adds Kudelski Labs’ Security IP to Europa Chip to Enable Secure, High-Performance Edge AI

Collaboration integrates Kudelski Labs Security IP with Axelera AI’s Europa chip, a leading, power-efficient inference processor to deliver a secure-by-design, high-performance solution for edge AI deployments.

March 11, 2026

CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Read More → "Axelera® AI Adds Kudelski Labs’ Security IP to Europa Chip to Enable Secure, High-Performance Edge AI"

IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications

March 11, 2026

Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to help customers maintain stable, reproducible toolchains across long product lifecycles.

Across safety-critical industries including automotive, industrial automation, and medical technology, embedded software must remain maintainable, rebuildable, and updatable for many years after products enter production. Development teams are expected to deliver updates, resolve issues, and adapt to evolving requirements while maintaining consistency in tools, workflows, and build environments.

In this context, toolchain stability becomes critical, … Read More → "IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications"

BANF and Silicon Labs Digitize the “Last Analog Domain” with Intelligent Tire Monitoring Solution

Ultra-Low-Power BG22 Bluetooth SoC Enables Real-Time, Battery-Free 4 kHz Tire Data Processing for Autonomous and Fleet Applications

March 11, 2026

Seoul, South Korea and Austin, TX — March 10, 2026 — BANF, a Korean intelligent tire system company, and Silicon Labs, the leading innovator in low-power wireless, today announced a breakthrough in tire monitoring technology. By integrating Silicon Labs’ ultra-low-power Bluetooth® LE SoC, the BG22, into its in-tire sensor platform, BANF has developed a real-time, high-resolution tire data processing system designed for autonomous vehicles and connected fleet environments.

For decades, tires have represented an industry “black box.” Traditional Tire Pressure Monitoring Systems (TPMS) provide alerts only when pressure drops significantly, limiting their ability to prevent fuel inefficiency or safety risks at … Read More → "BANF and Silicon Labs Digitize the “Last Analog Domain” with Intelligent Tire Monitoring Solution"

Dukosi to Debut Novel Module-level Communication Solution using Near Field Wireless at Embedded World 2026

The DK-NFLNK™ Communication Solution is a Highly Reliable, Secure and Cost-Efficient Upgrade for Modular Battery Architectures Based on traditional Multi-channel AFEs

March 11, 2026

EDINBURGH, United Kingdom, 9 March, 2026 — Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of high-power battery systems, introduces a novel module-level communication solution with near field wireless connectivity for highly secure and more reliable battery systems than traditional wired and far field wireless designs. This innovative module communication link, DK-NFLNK™ is a simple upgrade path from traditional wired and far field wireless BMS architectures to a more reliable battery solution that offers synchronous, module-level measurements to the BMS host using Dukosi’s proprietary contactless communication protocol based on C-SynQ®. Dukosi is introducing DK-NFLNK™ at Embedded World this … Read More → "Dukosi to Debut Novel Module-level Communication Solution using Near Field Wireless at Embedded World 2026"

The Advanced Packaging International Conference Program to Feature a Presentation from NHanced Semiconductors President Robert Patti on “Foundry 2.0” – a New Paradigm for Semiconductor Manufacturing

The first conference will be held April 20 to 22 in Brussels, Belgium, featuring more than 40 expert presentations that showcase how advanced packaging is enabling semiconductor innovation

March 11, 2026

BRUSSELS, BELGIUM (MARCH 10, 2026) – At the first Read More → "The Advanced Packaging International Conference Program to Feature a Presentation from NHanced Semiconductors President Robert Patti on “Foundry 2.0” – a New Paradigm for Semiconductor Manufacturing"

MediaTek Adds New Genio Platforms to Bring AI Processing to Robotics, Drones, and Industrial IoT

New IoT chipsets combine high-performance compute and powerful AI acceleration with advanced multimedia and display support

March 11, 2026

NUREMBERG, GERMANY – March 10, 2026 – At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT products and applications: MediaTek Genio Pro, Genio 420 and Genio 360. The Genio Pro series is MediaTek’s premium offering for high-performance IoT and embedded offerings, while Genio 420 and Genio 360 bring efficient system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.</ … Read More → "MediaTek Adds New Genio Platforms to Bring AI Processing to Robotics, Drones, and Industrial IoT"

TI expands microcontroller portfolio and software ecosystem to enable edge AI in every device

New MCUs with the TinyEngine™ NPU join TI's comprehensive portfolio of AI-enabled hardware, software and tools, allowing engineers to deploy intelligence anywhere

March 10, 2026

News highlights:

TI’s integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator.
New general-purpose and real-time MCUs from TI include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems.
With integrated generative AI in TI’s CCStudio™ IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI … Read More → "TI expands microcontroller portfolio and software ecosystem to enable edge AI in every device"

Infineon and Subaru collaborate to improve driver safety by enhancing real-time performance in advanced driver assistance systems

March 10, 2026

Munich, Germany, and Tokyo, Japan – 9 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Subaru Corporation are collaborating to enhance driver safety, confidence and comfort in future Subaru vehicles. Infineon plays a key role in Subaru’s integrated electronic control unit (ECU) for next‑generation advanced driver assistance systems (ADAS) and vehicle motion control: Infineon’s latest AURIX™ microcontroller (MCU) enhances the real-time capability of this ECU compared to previous generations, supporting faster, more reliable processing of vehicle and sensor information.</ … Read More → "Infineon and Subaru collaborate to improve driver safety by enhancing real-time performance in advanced driver assistance systems"

featured blogs

Sci-Fi and Fantasy Books They Should Make into Movies

May 6, 2026

Hollywood has struck gold with The Lord of the Rings and Dune'so which sci-fi and fantasy books should filmmakers tackle next?...