industry news archive
Subscribe Now

BEEcube Will Be Presenting at SAME 2011

FREMONT, Calif., Oct. 4, 2011 /PRNewswire/ — BEEcube will be presenting at the Sophia Antipolis MicroElectronics (SAME) October 12th at Sophia Antipolis, France.  The presentation “FPGA Based Prototyping Issues, A State of Affairs” is part of the Prototyping, Verification, Validation, Test Technical Conference.

Chen Chang, CEO and Founder, and Joseph Rothman, Sr VP of Marketing and Business Development will do the presentation.  It will cover the current state of the art of FPGA prototyping technology as it relates to new high-speed applications and chip designs including Mixed Signal applications. Some of the topics that will be addressed are: … Read More → "BEEcube Will Be Presenting at SAME 2011"

First Industry-Wide Web Portal for Transaction-Level Model Access Welcomes Model Developers and Users

MOUNTAIN VIEW, Calif., September 29, 2011 –Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced the launch of TLMCentral, the first industry-wide web portal for developers and users of transaction-level model (TLM) technology. TLMCentral aggregates information about free and commercial system-level models of common system-on-chip (SoC) components from leading semiconductor IP vendors, tool providers, service companies and universities. TLMCentral is an open portal that will ease and accelerate the development of virtual … Read More → "First Industry-Wide Web Portal for Transaction-Level Model Access Welcomes Model Developers and Users"

Kistler Introduces K-Beam® MEMS Capacitive Accelerometer Family for Automotive, Aerospace and Civil Engineering Applications

October 4, 2011, Novi, Michigan, USA – Kistler (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced its K-Beam® high-sensitivity, low-noise MEMS capacitive accelerometer family. The K-Beam® family is designed to support single axis and triaxial measurement requirements within automotive, aerospace, civil engineering, OEM, R&D and in-laboratory test applications, particularly those in which the use of an instrument-grade accelerometer for high-precision, low-frequency measurements is required.

The K-Beam® family is … Read More → "Kistler Introduces K-Beam® MEMS Capacitive Accelerometer Family for Automotive, Aerospace and Civil Engineering Applications"

BEEcube Will Be Exhibiting at Milcom 2011

FREMONT, Calif., Oct. 4, 2011 /PRNewswire/ — BEEcube will be exhibiting at Milcom 2011 from Monday, November 7 to Thursday, November 10th at booth #1206 at the Baltimore Convention Center.

BEEcube is presenting the BEE4-W, the ultimate EW (Electric Warfare) and signal intelligence FPGA based prototyping platform.  Not only does it support full speed mixed signal systems with its high speed low noise DAC and ADC combo FMC cards, but it prototypes various real-time video image augmentation schemes.  For mission critical unmanned vehicle digital prototyping nothing comes close to the BEE4-W, the ultimate sandbox.

BEEcube will … Read More → "BEEcube Will Be Exhibiting at Milcom 2011"

X-FAB Qualifies Cadence Physical Verification System for All Process Nodes

SAN JOSE, CA–(Marketwire – October 05, 2011) – “Creating an advanced mixed-signal SoC presents significant challenges,” said Dr. Jens Kosch, chief technology officer at X-FAB. “Our customers welcome any opportunity to streamline the development process, so we were pleased to qualify and endorse the Cadence Physical Verification System for our process technologies at X-FAB.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that X-FAB, a leading foundry group for analog/mixed-signal semiconductor applications, has qualified the Cadence® Physical … Read More → "X-FAB Qualifies Cadence Physical Verification System for All Process Nodes"

ZMDI 14-Bit Capacitive Sensor Conditioning IC Raises Bar on Accuracy, Linearity, and Temperature for Pressure Sensors

  • ZSSC3123 low power capacitive sensor conditioning IC enables first-pass calibration
  • Delivers 14-bit resolution and 0.25 % accuracy
  • Low power consumption at 60uA with sleep mode to lower to <1uA
  • Available today at 2.65 EUR, or USD 3.71, for 1kpc

Dresden, Germany — October 5, 2011 – ZMD AG (ZMDI), a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, and medical applications, has expanded its family of capacitive sensor signal conditioning devices with the wide-dynamic-range ZSSC3123 integrated circuit (IC).  The chip delivers 14-bit resolution and 0.25 % accuracy over a wide range … Read More → "ZMDI 14-Bit Capacitive Sensor Conditioning IC Raises Bar on Accuracy, Linearity, and Temperature for Pressure Sensors"

Kilopass Non Volatile Memory XPM Intellectual Property Core Holds Configuration Data in Haier Digital TV Decoder

Santa Clara, Calif. October 4, 2011 —  Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that its XPM IP is integrated into a Haier Set Top Box (STB) decoder SoC targeting the global high-growth STB market. Configuration data for mixed signal components are programmed in Kilopass XPM IP for each Haier SoC during final test and can be reprogrammed once installed to accommodate wear in the mixed signal components over time.

“We are pleased with our choice of the Kilopass XPM IP,” said Peijia Liang, IC design department design manager … Read More → "Kilopass Non Volatile Memory XPM Intellectual Property Core Holds Configuration Data in Haier Digital TV Decoder"

Fuji Electric Cuts Development Time 25 Percent With Cadence Virtuoso Accelerated Parallel Simulator

SAN JOSE, CA–(Marketwire – October 05, 2011) – “More and more leading companies are recognizing the time-to-market advantages they can attain by using the Cadence Virtuoso Accelerated Parallel Simulator,” said John Pierce, product marketing director, custom simulation, Silicon Realization at Cadence. “Integrating tightly and seamlessly with the Virtuoso Analog Design Environment, the simulator beats baseline SPICE simulation performance and enables companies like Fuji Electric to conduct more thorough, comprehensive verification, reducing risk and improving quality.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic … Read More → "Fuji Electric Cuts Development Time 25 Percent With Cadence Virtuoso Accelerated Parallel Simulator"

austriamicrosystems new 132 LED driver features industry’s highest efficiency and smallest size

Unterpremstaetten, Austria (October 4, 2011) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has announced the AS1130, the most advanced and smallest dot-matrix LED driver (channels vs. PCB space) available. The AS1130 drives 132 LEDs but requires only 5 mm² PCB space. It also reduces external component count, allows use of cheap connectors and requires fewer PCB (printed circuit board) layers. Benefits for end users include up to 80% longer battery lifetime, more colorful effects and smoother running animations.

Using a 12×11 cross-plexed technique, austriamicrosystems’ AS1130 LED driver is targeted for dot-matrix displays in mobile … Read More → "austriamicrosystems new 132 LED driver features industry’s highest efficiency and smallest size"

Industry’s Smallest, Most Integrated IO-Link Transceiver Fits in Industrial Applications When Other Solutions Will Not

SUNNYVALE, CA—October 3, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX14821, the smallest IO-Link(R) physical-layer (PHY) transceiver in the industry. Encased in a 2.5mm x 2.5mm WLP, the MAX14821 saves more than 60% compared to competitors’ packages and enables designs to fit in tiny housings. An extra set of a digital output and input plus dual integrated low-dropout linear regulators provide added flexibility with complex sensor modules. This IO-Link transceiver is optimized for point-to-point communication between industrial controllers and sensor modules and actuators. 

IO-Link Sets a New Standard for Industrial Automation

< … Read More → "Industry’s Smallest, Most Integrated IO-Link Transceiver Fits in Industrial Applications When Other Solutions Will Not"
featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...