industry news
Subscribe Now

Quantenna Demonstrates World’s First 4×4 Four Stream Dual-band 2.4 GHz and 5 GHz Wi-Fi Chipset Solution at International CES 2013

Las Vegas, January 7, 2013 – International CES — Quantenna Communications, Inc., a leader in ultra-reliable Wi-Fi networking for whole-home entertainment, announced it will demonstrate the world’s first dual-band (2.4 GHz and 5 GHz) 4×4 MIMO (four streams) technology optimized for service providers and retail applications at this week’s International Consumer Electronics Show (CES), January 8-11 in Las Vegas.

Quantenna’s new dual-band, multi-standard-based 4×4 MIMO Wi-Fi technology delivers unmatched reliability and performance over Wi-Fi in both 2.4 GHz and 5 GHz bands. The Quantenna dual-band solution solves the main issue of service providers today, which is the support for legacy Wi-Fi devices ? while enabling wire-like, superior video distribution over wireless with unrivaled range at more than 200 feet, including through concrete walls and multiple floors superior video quality.  In addition, this will enable deployment of Quantenna based solutions for all applications including the use of Wi-Fi hotspots for cellular offload.

“Service providers’ Holy Grail of coverage, performance and quality for legacy devices is finally realized by Quantenna’s offering a dual-band, 2.4GHz and 5 GHz Wi-Fi solution,” said Dr. Sam Heidari chief executive officer for Quantenna. “Users can now enjoy the same reliability offered previously on the 5 GHz band, now with their 2.4GHz legacy devices. For the first time, enhanced performance of the 2.4 GHz products is achieved based on full Wi-Fi standards.”

In addition, a number of leading service providers and retail manufacturers at CES will be demonstrating devices that deliver superior Wi-Fi video performance using Quantenna’s 4×4 MIMO technology.

Whether it’s streaming HD video anywhere in the home or need for more bandwidth, service providers and retail manufacturers have one thing in common, they are choosing Quantenna’s superior Wi-Fi.
Recently named an International CES Innovations 2013 Design and Engineering Awards winner in the Enabling Technologies category, Quantenna’s chipsets enable the convergence of TV and multimedia to deliver IPTV services with wire-like quality and reliability.

Quantenna’s dual-band 2.4 and 5 GHz chipset fully supports the IEEE 802.11 standard with advanced features including 4×4 Multiple Input Multiple Output (MIMO), dynamic digital beamforming and wireless channel monitoring and optimizing.  Quantenna’s chipset is the industry’s only commercially available, carrier-grade 4×4 MIMO solution capable of distributing multiple high-definition (HD) video streams to multiple TVs and displays anywhere in the home at full, 1080p resolution.  It is designed to help enable a new generation of converged broadcast and Internet-based entertainment services that require an ultra-reliable, high-performance Wi-Fi connection in any size home.

Visit Quantenna at CES International 2013

Quantenna’s 4×4 MIMO Wi-Fi family will be displayed during the 2013 International CES, January 8-11, 2013, in the company’s suite in the North Tower at the LVH. To schedule a meeting please contact Lionel Bonnet at 510-743-2282 or lbonnot@quantenna.com

About Quantenna Communications, Inc.

Quantenna Communications, Inc. is a fabless semiconductor company developing standards-based 802.11n and 802.11ac MIMO chipsets that deliver the highest levels of performance, speed and reliability for wireless networks and devices. Headquartered in Fremont, Calif., Quantenna has assembled a management and engineering team with a long track record of start-up success, and is backed by leading venture capital firms, including Sequoia Capital, Venrock, Sigma Partners, Southern Cross Venture Partners, DAG Ventures, Rusnano, Swisscom Ventures, Grazia Equity, and Telefónica Digital. Quantenna was recently named to Wall Street Journal’s 2012 list of top 50 start-ups. For additional information, please visit www.quantenna.com.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
28,010 views