News – Page 1883 – EEJournal

Dual 750mA/250mA Linear LDO Regulator with Independent Inputs Offers Ultralow Noise

March 13, 2013

MILPITAS, CA – March 13, 2013 – Linear Technology Corporation announces the LT3030, a dual low noise, low dropout regulator with independent inputs and independent shutdown control for each channel. The device delivers continuous output current up to 750mA on one channel and 250mA on the other channel, with a low dropout voltage of only 300mV at full load. The LT3030 features a wide 1.8V to 20 … Read More → "Dual 750mA/250mA Linear LDO Regulator with Independent Inputs Offers Ultralow Noise"

HDL Design House Announces PCS IP Core

March 12, 2013

Belgrade, Serbia – March 12^th, 2013 – HDL Design House, provider of high performance digital and analog IP cores and SoC design and verification services, has announced availability of its Physical Coding Sublayer (PCS) IP core (HIP 500) which enables transmission and reception of data via 8-Lanes SerDes interface. It is able to multiplex a synchronous data stream over 8 Lanes, while guaranteeing data alignment and super-frame synchronization.

The PCS is responsible for generation of idle characters, lane striping and encoding on transmission and decoding, lane alignment and restriping on reception. … Read More → "HDL Design House Announces PCS IP Core"

Open source RF hardware project to further innovation using wireless communications spectrum

March 12, 2013

12 March 2012, Guildford, UK: Lime Microsystems has launched an open-source RF initiative to widen the community of developers and aid RF innovation.

Launched as a non-profit initiative, Myriad-RF aims to give both hobbyists and experienced design engineers a range of low-cost RF boards and free design files available for general use. Future board designs will come from the wider Myriad-RF community, with the first board (Myriad-RF 1) designed by Taiwanese distributor Azio Electronics.

Myriad-RF boards use field programmable RF (FP-RF) transceivers to operate on all mobile broadband standards – LTE, HSPA+, CDMA, 2G – … Read More → "Open source RF hardware project to further innovation using wireless communications spectrum"

Digi-Key Corporation and E Ink Sign Global Distribution Agreement

March 12, 2013

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, today announced a global distribution agreement with E Ink. This partnership … Read More → "Digi-Key Corporation and E Ink Sign Global Distribution Agreement"

TI introduces smart bypass diode with industry’s lowest power dissipation

March 12, 2013

DALLAS (Mar. 12, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a smart bypass diode in a standard surface-mount package with 15-A current handling capability and the industry’s lowest power dissipation. In a typical application, each SM74611 lowers power dissipation by 80 percent and reduces the operating temperature inside the junction box by 50 degrees C when compared with a similar box using three conventional … Read More → "TI introduces smart bypass diode with industry’s lowest power dissipation"

FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm

March 12, 2013

COPENHAGEN, Denmark, March 13th, 2013 – Teklatech®, an industry leader in EDA solutions for achieving dynamic power integrity and power noise closure in System-on-Chip (SoC) designs, today announced the release of version 3.5 of its FloorDirector® tool. FloorDirector enables Dynamic Power Shaping™ leading to reduced peak current demand, dynamic voltage drop and digital power noise in ASIC designs. Version 3.5 provides significant speed-ups, major usability enhancements, and an innovative new Pulse Softening™ capability, helping designers at 28 nm and below to achieve benefits on primary design targets such as yield, area and performance.

Dr. Tobias Bjerregaard, CEO and Founder of Teklatech, comments: “ … Read More → "FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm"

Cadence Acquires Tensilica

March 12, 2013

SAN JOSE, CA., 12 Mar 2013

HIGHLIGHTS:

Tensilica® dataplane processing units (DPUs) combined with Cadence® Design IP will deliver more optimized IP solutions for mobile wireless, network infrastructure, auto infotainment and home applications.
Tensilica IP complements industry-standard processor architectures, providing application-optimized subsystems to increase differentiation and get to market faster.
More than 200 licensees, including system OEMs and seven of the top 10 semiconductor companies, have shipped over 2 billion Tensilica IP cores.

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today … Read More → "Cadence Acquires Tensilica"

EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology

March 11, 2013

ST. FLORIAN, Austria, March 5, 2013 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature. This breakthrough technology will be available on a new equipment platform, called EVG580® ComBond®, which will include process modules that are designed to perform surface preparation processes on both semiconductor materials and metals. EVG built on its decades of experience with plasma activated wafer bonding to create a novel process through which the treated surfaces form strong bonds at … Read More → "EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology"

Renesas Electronics Expands the RX600 Microcontroller Series for Network, Industrial and Smart Metering Applications

March 11, 2013

Santa Clara, Calif., March 11, 2013 – Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the expansion of its 32-bit RX microcontroller (MCU) platform, with the introduction of 120 new models for the successful RX631 and RX63N product groups within Renesas’ RX600 series of MCUs.

These new products in the RX63N/RX631 groups offer up to 256 KB embedded RAM, doubling today’s available RAM size of 128 KB. Thanks to the RX platform concept, these new products are pin-to-pin compatible with existing models, and therefore recommended as a drop-in replacement for customers with larger RAM … Read More → "Renesas Electronics Expands the RX600 Microcontroller Series for Network, Industrial and Smart Metering Applications"

Smallest 14-Bit, 4.5Msps SAR ADC Integrates Precision Reference in 8mm² TSOT-23 Package

March 11, 2013

MILPITAS, CA – March 11, 2013 – Linear Technology Corporation introduces the LTC2314-14, a 14-bit 4.5Msps successive approximation register (SAR) ADC in a tiny 8-lead TSOT-23 package, offering up to 90% reduction in size over competing solutions for space-conscious applications. This small SAR ADC integrates a precision 2.048V/4.096V reference with 7ppm/°C typical and guaranteed 20ppm/°C maximum temperature coefficient into an 8mm² footprint. The LTC2314-14 operates from a 3V or 5 … Read More → "Smallest 14-Bit, 4.5Msps SAR ADC Integrates Precision Reference in 8mm² TSOT-23 Package"