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Flexras Technologies Enhances Wasga Compiler Partitioning Tool, Adds Support for Virtex-7 FPGA-based FPGA Platforms

April 16, 2013

Paris, France – April 16, 2013 – Flexras Technologies, the provider of high performance partitioning software, today announced the release 3.2 of itsWasgaTMCompiler Design Suite for FPGA-based prototyping.  This new release supports the Xilinx® Virtex®-7 FPGA and includes new features that accelerate SoC rapid prototyping.

Flexras will demonstrate Wasga Compiler for the Virtex-7 FPGA-based systems at DAC, Booth #1324, June 2-5, 2013, Austin,TX, USA.

“ … Read More → "Flexras Technologies Enhances Wasga Compiler Partitioning Tool, Adds Support for Virtex-7 FPGA-based FPGA Platforms"

Study Says 20nm SRAM Design Could Suffer from the Interplay Between Statistical Variability and Reliability

April 16, 2013

GLASGOW, Scotland, April 16, 2013 /PRNewswire/ — Gold Standard Simulations (GSS) revealed today that the interplay between the effects of statistical reliability and variability could adversely affect 20nm CMOS SRAM yield. The study also defined a new reliability simulation framework to predict variability and reliability impact that enhances yield.

The findings were presented in a paper jointly authored by GSS and … Read More → "Study Says 20nm SRAM Design Could Suffer from the Interplay Between Statistical Variability and Reliability"

Lattice Introduces Image Sensor Extender Reference Design

April 15, 2013

HILLSBORO, OR – April 11, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the SensorExtenderTM reference design that offers a low-cost approach to remotely locate image sensors up to eight meters away from the image signal processor (ISP) and transmit and receive video signals at resolutions that range up to 720p60 and 1080p30.  

The reference design uses inexpensive low-cost Cat5E cable to carry high-definition video and to … Read More → "Lattice Introduces Image Sensor Extender Reference Design"

Registration Opens for Microchip’s 17th Annual Worldwide MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers

April 15, 2013

CHANDLER, Ariz., April 15, 2013 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced it is accepting registrations for its 17th annual Worldwide MASTERs Conference at the JW Marriott Desert Ridge Resort in Phoenix, Arizona, with the Main Conference taking place from August 21-24, and a Pre-Conference on August 19 and 20, 2013.

The MASTERs Conference is a valuable resource for designing with Microchip’s products that provides design engineers with an annual forum for sharing and exchanging technical information on the … Read More → "Registration Opens for Microchip’s 17th Annual Worldwide MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers"

Laird Technologies to Demonstrate Thermobility™ Wireless Power Generators at Energy Harvesting & Storage Europe Thermobility™ Series Provides Turn-key Solution for Design Engineers

April 15, 2013

St. Louis, Missouri, USA – April 9, 2013 – Laird Technologies, Inc., a leading global technology company, announced today that it will demonstrate its Thermobility™ Wireless Power Generator series at Energy Harvesting & Storage Europe. The event will be held at the International Congress Centrum ICC Berlin in Berlin, Germany, April 17-18, 2013. Laird Technologies will exhibit at booths P7 and P8.  

ADLINK Technology in Intelligent Systems Zone at Design West

April 15, 2013

SAN JOSE, CA – April 11, 2013 – ADLINK Technology, a leading provider of Application Ready Intelligent Platforms (ARIP), invites attendees to visit Booth 1131 in the Intelligent Systems Zone during the Design West Conference & Expo from April 22 – 25 at the McEnery Convention Center in San Jose, CA. In addition to a daily giveaway of a Nexus 7 tablet, ADLINK will be featuring the following product and technology demonstrations:

RFEL launches the HALO low-power, real-time, video processing system for enhancing images for defence, security and counter terrorism surveillance

April 15, 2013

Newport, Isle of Wight, UK – 15 April 2013 – RFEL, who specialises in high performance, electronic video and signal processing solutions, will be launching HALO™, the latest addition to its award winning range of products, at the Counter Terror Expo, Olympia, London on 24-25 April 2013 and at SPIE DS&S, Baltimore Convention Center, Baltimore, MD on 29 April – 3 May 2013. HALO provides next generation, low power, real-time, video processing for image-based surveillance, which is a critical capability for counter terrorism, defence and security, and is not restricted by American ITAR export regulations as it is designed and manufactured … Read More → "RFEL launches the HALO low-power, real-time, video processing system for enhancing images for defence, security and counter terrorism surveillance"

LG Adopts In-Design Physical Verification with IC Compiler and IC Validator after Multiple Successful Tapeouts

April 15, 2013

Highlights

  • Synopsys’ In-Design physical verification with IC Validator and IC Compiler place-and-route solution accelerates LG Electronics’ manufacturing closure by two weeks
  • Multiple successful tapeouts using In-Design physical verification demonstrate accelerated manufacturing closure for high-performance core design
  • LG Electronics has adopted Synopsys’ IC Validator as part of their ARM®-based design implementation flow

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that LG Electronics, Inc. has adopted  IC Validator, … Read More → "LG Adopts In-Design Physical Verification with IC Compiler and IC Validator after Multiple Successful Tapeouts"

Meggitt Sensing Systems introduces high-temperature triaxial, piezoelectric charge output accelerometer

April 12, 2013

April 1, 2013, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has  announced the global market introduction of the Endevco® model 2280, a hermetically sealed, triaxial,  piezoelectric charge output accelerometer with high-temperature operation to +482?C (+900?F). The small package of this sensor makes it ideally suited for vibration measurements across three orthogonal axes on aircraft engines, aerospace components, ground-based turbine engines, power plant equipment, and other machinery that operate at high temperatures.

The Endevco® model 2280 shares the same piezoelectric charge sensor system as the company’s popular single axis 2248 family with 15 years of field-proven pedigree. Offered … Read More → "Meggitt Sensing Systems introduces high-temperature triaxial, piezoelectric charge output accelerometer"

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