News – Page 1884 – EEJournal

Altera Demonstrates Industry’s First QPI 1.1 FPGA Home Agent for Enhanced Server Capabilities

April 10, 2013

San Jose, Calif., April 10, 2013—Altera Corporation (NASDAQ: ALTR) today announced the industry’s first demonstration of an FPGA Home Agent enabled by the Intel QuickPath Interconnect (QPI) protocol 1.1. Connecting to Intel’s Sandy Bridge XEON processors, the demonstration leverages an Altera® Stratix® V FPGA configured as the Home Agent, and it supports both the Caching Agent and Home Agent in a Pactron Vigor Development Platform. This solution is ideal for designers of low-latency signal-processing, packet processing and embedded applications, such as high-frequency trading and big data that needhigher … Read More → "Altera Demonstrates Industry’s First QPI 1.1 FPGA Home Agent for Enhanced Server Capabilities"

Microsemi and Virtual Extension Team to Enable Lowest Power Sub-GHz Mesh Network for Coin Cell Powered and Energy Harvest Applications

April 10, 2013

ALISO VIEJO, Calif.—April 10, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Virtual Extension, a leading wireless mesh networks company based in Beit-Dagan, Israel, today announced a two-chip wireless mesh network chipset and reference design that brings a new level of performance and signal robustness to applications requiring networks with high performance and ultra-low power consumption. The reference design features Microsemi’s ZL70250 chip scale package (CSP) radio frequency (RF) transceiver for industrial, scientific and medical (ISM) band applications and Virtual Extension’s VE209M wireless mesh controller. … Read More → "Microsemi and Virtual Extension Team to Enable Lowest Power Sub-GHz Mesh Network for Coin Cell Powered and Energy Harvest Applications"

New Freescale Freedom Development Platform for the Kinetis K20 MCU available globally from Premier Farnell

April 10, 2013

April 10, 2013 CHICAGO – Premier Farnell is pleased to announce the global availability of Freescale Semiconductor’s newest Freedom Development Platform for evaluating Kinetis K20 MCUs at element14.

The new FRDM-K20D50M Development Platform is form-factor compatible with the Arduino™ R3 pin layout, providing a broad range of expansion board options. The on-board interfaces include an RGB LED, a 3-axis digital accelerometer, capacitive touch slider and ambient light sensor. The FRDM-K20D50M features the Freescale open standard embedded serial and debug … Read More → "New Freescale Freedom Development Platform for the Kinetis K20 MCU available globally from Premier Farnell"

ADLINK aTCA-9300 ATCA® Processor Blade Delivers Telecom Grade Performance with Optimum Cost Efficiency

April 9, 2013

SAN JOSE, CA – April 9, 2013 – ADLINK Technology, a renowned provider of robust telecom-grade processor blades, rolls out the newest member of its AdvancedTCA® blade family, the aTCA-9300. The aTCA-9300 delivers high performance, high-throughput connectivity, versatile and rich I/O, reliability at a cost-effective price, and is suitable for high-end applications such as network monitoring or media streaming.

The aTCA-9300 features dual 4-core Intel® Xeon® Processor E3-1275V2/1225V2 running at up to 3.5/3.2 GHz respectively, combined with the Intel® C216 Chipset, four channel DDR3 memory up to 32GB, and 300W power supply subsystem. … Read More → "ADLINK aTCA-9300 ATCA® Processor Blade Delivers Telecom Grade Performance with Optimum Cost Efficiency"

New Miniaturization Record by STMicroelectronics Makes More Room for Mobile Functionality

April 9, 2013

Geneva, April 8, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world’s largest supplier of Transient Voltage Suppression (TVS) protection components, has introduced the world’s smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.

As the first such device to be offered in the industry’s smallest standard surface-mount outline of 0.45 x 0.2mm, the ESDAVLC6-1BV2 is one size smaller than today’s 0.6 x 0.3mm devices.</ … Read More → "New Miniaturization Record by STMicroelectronics Makes More Room for Mobile Functionality"

Bluetooth low energy temperature sensor platform brings low cost smart monitoring to consumers and commercial users using a smartphone

April 9, 2013

Oslo, Norway – April 9, 2013 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-based National Electronics & Watch Co. Ltd (NEWCO) – a leading wireless OEM/ODM (Original Equipment/Design Manufacturer) of wireless monitors and associated products (such as watches, GPS navigators, and 2.4GHz RFID) for top global outdoor and sports & fitness consumer brands – has announced a Bluetooth® low energy temperature sensor platform that could dramatically reduce the cost and complexity of installing smart ambient temperature monitoring networks into homes and commercial buildings by using the simplicity of a smartphone.

Plessey is first to release GaN on silicon LEDs

April 9, 2013

Plymouth, ENGLAND – 8th April 2013 – Plessey announced that samples of its Gallium Nitride (GaN) on silicon LED products (p/n PLW111010) are available today. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world. Plessey is using its proprietary large diameter GaN on silicon process technology to manufacture the LEDs on its 6-inch MAGIC™ (Manufactured on GaN I/C) line at its Plymouth, England facility. The use of Plessey’s MAGIC GaN line using standard semiconductor manufacturing processing provides yield entitlements of greater than 95% and fast processing … Read More → "Plessey is first to release GaN on silicon LEDs"

TI introduces lowest-power AISG modem transceiver

April 9, 2013

DALLAS (April 9, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a fully-integrated, on-off keying modem transceiver that is compliant with the Antenna Interface Standards Group (AISG) v2.0 specification. The SN65HVD62 reduces power consumption by up to 50 percent compared to the competition. The transceiver modulates and demodulates signals between the logic (baseband) and a frequency suitable for long coaxial media such as AISG coaxial links between base station and tower- mounted equipment, tower-mounted amplifiers, remote electrical tilt units and control links on microwave towers. For more information and to order samples, visit Read More → "TI introduces lowest-power AISG modem transceiver"

Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers

April 9, 2013

JÄRFÄLLA, Sweden and San Jose, Calif., April 8, 2013 – Silex Microsystems, the world’s largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing. Leveraging the advanced interposer co-design methodology and system integration expertise of BroadPak with the proven interposer manufacturing capabilities of Silex, this new solution delivers a cost-effective, ultra-high performance, reliable and high-yield silicon interposer … Read More → "Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers"

IAR Embedded Workbench certified for functional safety development

April 9, 2013

Uppsala, Sweden—April 9, 2013— IAR Systems®, the world’s leading supplier of development tools for embedded systems, today announced that the build chain of the tool suite IAR Embedded Workbench® for ARM® has been certified by TÜV SÜD as a qualified tool for development of safety-related applications. In conjunction, IAR Systems also announced the availability of a special support agreement for customers working with safety-critical development.

IAR Embedded Workbench for ARM has been tested and approved according to the requirements on support tools put forth in International Electrotechnical Commission (IEC) 61508, the international umbrella … Read More → "IAR Embedded Workbench certified for functional safety development"

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