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TI’s flyback controller surpasses Energy Star 5 standby power requirementsfor 10- to 65-W AC adapters

March 20, 2013

DALLAS (March 19, 2013) – Expanding its line of energy-efficient, no-load adapter power controllers, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the industry’s first flyback controller that exceeds Energy Star 5 standby power requirements for 10- to 65-W AC/DC adapters used with notebooks, motor control, smart meters, micro-inverters and other high-powered applications. Used in conjunction with TI’s award-winning WEBENCH® online design tool, the LM5023 flyback controller simplifies and speeds high-voltage DC/DC designs. For more information, visit: Read More → "TI’s flyback controller surpasses Energy Star 5 standby power requirementsfor 10- to 65-W AC adapters"

RoweBots MCU Wireless Connectivity Becomes Latest Addition to the Embedded Software Store

March 20, 2013

WATERLOO, Canada, March 18, 2013— RoweBots Research Inc., a leading supplier of tiny, embedded, Linux-compatible real-time operating system (RTOS) products, today announced the availability of its Unison™ OS wireless components on the Embedded Software Store (ESS). These components provide out of the box support for Wi-Fi, Bluetooth, UHF, cellular networks and 6loWPAN for wireless connectivity in just 10 minutes for either free evaluation or commercial licensing.

Wireless protocols provide one of the key building blocks embedded designers need to implement Internet of Things (IoT) applications focused on the edge, that require both sensor technologies and low energy MCU devices.

< … Read More → "RoweBots MCU Wireless Connectivity Becomes Latest Addition to the Embedded Software Store"

Remcom Announces Breakthrough MPI + GPU Technology for High-Performance Simulation of Massive Electromagnetic Calculations In XFdtd

March 20, 2013

State College, PA (PRWEB) March 20, 2013

Remcom announces a breakthrough in current industry standards for electromagnetic simulation performance with MPI + GPU technology and unlimited memory support for XFdtd® Electromagnetic Simulation Software (XF7). These capabilities are now available with the latest version of XF7, Release 7.3.1. By combining Message Passing Interface (MPI) technology with XStream® GPU Acceleration, multiple high-performance graphical processing units (GPUs) in separate computers can be linked … Read More → "Remcom Announces Breakthrough MPI + GPU Technology for High-Performance Simulation of Massive Electromagnetic Calculations In XFdtd"

New Ericsson power interface modules integrate digital communication abilities to simplify energy monitoring

March 20, 2013
  • New I2C- and PMBus-compliant Power Interface Modules optimized for AdvancedTCA Blade and embedded computing systems
  • Integrated input-current monitoring negates need for additional components
  • PIM delivers output power up to 648W
  • Optimized for high efficiency – typically 98.7% at 10A output load

Ericsson has announced an extension of its 3E digital power module family with two new digital-communication-bus-enabled 540-648W low-profile quarter-brick Power Interface Modules (PIMs). Compliant with the 300W de facto industry-standard footprint and offering both I2C- and PMBus-based serial bus communications, … Read More → "New Ericsson power interface modules integrate digital communication abilities to simplify energy monitoring"

Tektronix Real-Time Oscilloscopes to Achieve 70 GHz Performance

March 20, 2013

BEAVERTON, Ore., March 19, 2013 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that lab testing has shown that its next generation performance oscilloscopes – due for availability in 2014 – will deliver real-time bandwidth of 70 GHz, with significant upside potential. The new oscilloscope platform will deliver the performance and signal fidelity needed for applications such as 400 Gbps and 1 Tbps optical communications and fourth generation serial data communications. Tektronix also announced an investment program that will give customers a cost-effective migration path to the new platform.

The extraordinary gain in bandwidth performance, with improved signal fidelity, … Read More → "Tektronix Real-Time Oscilloscopes to Achieve 70 GHz Performance"

Silicon Craft Technology Introduces the Best Performing Half-Duplex Transponder Integrated Circuit

March 20, 2013

Silicon Craft Technology (SIC), a leading designer and supplier in the RFID IC industry, has proudly added the innovative and advanced SIC7999 product to its Life Form Identification line, which is compliant to the ISO 11784/5 Animal Id data structure.

The SIC7999 is a fully integrated Half-Duplex Radio Frequency Identification (RFID) ASIC IC, designed by taking advantage of SIC’s patented Energy Harvesting technique, which can achieve a 15% longer read range than its previous generation IC. According to the test results at the PTEC (Electrical and Electronics Product testing center), SIC7999 tags have been tested … Read More → "Silicon Craft Technology Introduces the Best Performing Half-Duplex Transponder Integrated Circuit"

Cypress’s PSoC® 4 Architecture Delivers the Industry’s Most-Flexible, Lowest-Power ARM® Cortex™-M0-Based Devices for Embedded Designs

March 20, 2013

SAN JOSE, Calif., March 20, 2013 – Cypress Semiconductor Corp. (NASDAQ: CY) today unveiled the PSoC® 4 programmable system-on-chip architecture, which combines Cypress’s best-in-class PSoC analog and digital fabric and industry-leading CapSense® capacitive touch technology with ARM®’s power-efficient Cortex™-M0 core. The truly scalable, cost-efficient architecture delivers PSoC’s trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components™—“virtual chips” represented by icons in Cypress’s PSoC Creator™ integrated design environment. The new PSoC 4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices. … Read More → "Cypress’s PSoC® 4 Architecture Delivers the Industry’s Most-Flexible, Lowest-Power ARM® Cortex™-M0-Based Devices for Embedded Designs"

Element Six and the University of Warwick Announce Development of New Boron-Doped Synthetic Diamond Electrode for Extreme Electroanalysis Sensing Applications

March 19, 2013

PHILADELPHIA—Mar. XX, 2013—AT PITTCON 2013, Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced that it has engineered DIAFILM EA (Electroanalysis grade) in collaboration with The University of Warwick. The free-standing, solid boron doped microwave chemical vapor deposition (CVD) diamond electrode is expected to transform sensing technologies, allowing the development of next generation advanced electroanalysis sensing systems to benefit … Read More → "Element Six and the University of Warwick Announce Development of New Boron-Doped Synthetic Diamond Electrode for Extreme Electroanalysis Sensing Applications"

Tektronix Enters Power Analyzer Market

March 19, 2013

BEAVERTON, Ore., March 18, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced that it will enter the power analyzer instrument market and introduce a full new product line in the coming months. To facilitate this move, Tektronix has implemented a technology transfer agreement which includes power analyzer intellectual property, patents and product designs from its partner Voltech, which will exit the power analyzer segment of its business by September 30, 2013.

“This is an aggressive move by … Read More → "Tektronix Enters Power Analyzer Market"

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