SANTA CLARA, California – April 30, 2013 – Invarian, Inc., a premier provider of full-chip concurrent sign-off analysis solutions for complex integrated circuit (IC) designs, has developed advanced algorithms that enables fast and accurate full-chip analysis for large capacity designs. The company’s R&D team takes a holistic approach for tackling  analog and digital designs with concurrent analysis of power, signal timing, electromigration, voltage, temperature, and die/ packaging parameters.

Previous generation physical design tools have not kept pace with today’s designs. Inaccurate and inconsistent results lead to expensive re-spins; it … Read More → "Invarian: Revolutionizing Full-chip Sign-off Analysis for Complex ICs"

SAN JOSE, Calif., April 29, 2013—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has collaborated with Cadence® to provide pattern classification data for manufacturing processes of 20 and 14 nanometers. GLOBALFOUNDRIES is using the Cadence Pattern Classification and Pattern Matching Solutions because they enable up to four times faster design for manufacturing (DFM), which is key to improving customers’ silicon yield and predictability.

“We have integrated Cadence pattern classification technologies to classify yield detractors into pattern families based on pattern similarity, including inexact patterns, to maximize the efficiency … Read More → "Cadence and GLOBALFOUNDRIES Collaborate to Improve DFM Signoff for 20- and 14-Nanometer Nodes"