News – Page 1861 – EEJournal

Quantenna Announces Availiability of The World’s Fastest Wi-Fi Chipset

May 27, 2013

FREMONT, Calif. – May 22, 2013 – Quantenna Communications, Inc., the leader in ultra-reliable Wi-Fi networking for whole-home entertainment, has redefined wireless performance and quality once again with the first commercially-available 4×4 MU-MIMO 802.11ac chipset – the QSR1000 family. The only Wave 2 802.11ac chipset, Quantenna’s 1.7Gbps QSR1000 solution transmits faster, reaches farther and serves more devices more reliably than any other Wi-Fi solution ever created.

S2C Debuts Low-Cost Rapid SoC Prototyping Hardware – K7 TAI Logic Modules

May 27, 2013

San Jose, CA – May 28, 2013 – S2C Inc., a leading rapid SoC/ASIC prototyping solutions provider, announced today a new family of its fifth-generation product, the K7 TAI Logic Module, based on Xilinx’s 28-nm Kintex-7 FPGA devices. The K7 TAI Logic Module provides up to 4.1 million ASIC gates of capacity, 432 external I/O and 16 channels of Gigabit Transceivers capable of running up to 10Gbps. K7 TAI Logic Module is shipped with TAI Player Pro runtime software and starts at an affordable list price.

““FPGA-based prototyping is a critical step for a successful … Read More → "S2C Debuts Low-Cost Rapid SoC Prototyping Hardware – K7 TAI Logic Modules"

Oski Technology to Showcase its Industry-Proven Formal Sign-off Methodology at DAC

May 27, 2013

MOUNTAIN VIEW, CALIF. –– May 23, 2013 –– (reminder June 3 at 8:45am ET)

WHO: Oski Technology (www.oskitech.com), the world’s only dedicated formal verification services provider

WHAT: Will demonstrate Oski Formal Sign-off Methodology during the 50th Design Automation Conference (DAC) in Booth #718

WHEN: Monday, June 3, through Wednesday, June 5, from 9 a.m. until 6 p.m. daily

WHERE: </ … Read More → "Oski Technology to Showcase its Industry-Proven Formal Sign-off Methodology at DAC"

Docea Power to present unique solutions for modelling and simulation of dynamic thermal management strategies at DAC

May 27, 2013

Grenoble, France and San Jose, CA – May 23 , 2013 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, will exhibit at the 50^th Design Automation Conference (DAC) on June 3 to 6 in Austin, TX.

Docea Power will be showcasing its unique solutions for:

Early architecture level exploration of power consumption and thermal behavior at System-on-Chip and platform … Read More → "Docea Power to present unique solutions for modelling and simulation of dynamic thermal management strategies at DAC"

Cadence Completes Acquisition of Cosmic Circuits

May 24, 2013

SAN JOSE, CA–(Marketwired – May 23, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it has completed the acquisition of Cosmic Circuits Private Limited, a leading provider of analog and mixed signal intellectual property (IP) cores. Cosmic Circuits offers silicon-proven IP solutions in connectivity and advanced mixed-signal technologies in the 40nm and 28nm process nodes, with 20nm and FinFET development well underway.

The completion of this transaction further expands Cadence’s IP portfolio, strengthening its solutions … Read More → "Cadence Completes Acquisition of Cosmic Circuits"

Europractice, Lime Microsystems partnership takes flexible RF technology to universities across EU

May 24, 2013

24 May 2012, Guildford, UK: Universities and research establishments across the EU are set to gain access to the open source RF hardware platform, MyriadRF, and configurable transceiver technology following a deal between Lime Microsystems and Europractice, a project of the UK Science and Technology Facilities Council (STFC).

Under the terms of the deal, Europractice will promote Lime’s LMS6002D field programmable RF transceiver and associated boards for use in research and teaching of wireless technology to its member establishments throughout Europe. This will begin immediately.

The list of boards includes both Lime’ … Read More → "Europractice, Lime Microsystems partnership takes flexible RF technology to universities across EU"

SFT Introduces Critical Semiconductor Design Products for ESD & Electro-Thermal Analysis

May 24, 2013

Campbell, CA – May 24, 2013 – Silicon Frontline Technology, Inc. (SFT), a leader in 3D parasitic extraction and semiconductor device analysis, is announcing two semiconductor analysis products – ESRA and Ethan – and first-time demonstrations at the 50^th Design Automation Conference (DAC) in Austin, Texas next month at booth #2133.

ESRA offers designers comprehensive verification and optimization strategies to improve electrostatic discharge (ESD) protection. Ethan provides electro-thermal simulation of power devices including packages.

“We are using DAC to introduce our … Read More → "SFT Introduces Critical Semiconductor Design Products for ESD & Electro-Thermal Analysis"

Hillcrest Labs and TCL Sign New Multi-Year Agreement to Bring Unique Freespace Motion Technology to Smart TVs

May 24, 2013

Hong Kong and Rockville, Maryland, USA — May 23, 2013 — Hillcrest Labs today announced that TCL Multimedia has signed a new multi-year agreement to extend the use of Hillcrest’s patented Freespace(R) in-air pointing and motion control software in TCL’s Internet-connected Smart TVs. Freespace enables small in-air movements of remote controls to move a cursor around the TV screen. This allows users to navigate their TV user interface with point-and-click controls, just like they do on computers, smartphones and tablets.

In May of 2012, Hillcrest announced a partnership with TCL and introduced the V7500 Smart TV. … Read More → "Hillcrest Labs and TCL Sign New Multi-Year Agreement to Bring Unique Freespace Motion Technology to Smart TVs"

Synopsys Delivers VDK for Renesas RH850 MCUs

May 24, 2013

MOUNTAINVIEW, Calif., May 23, 2013 /PRNewswire/ —

Highlights:

New VDK for Renesas’ RH850 MCU accelerates software development, system integration and test for a broad range of automotive applications
Seamless integration with tools such as Mathworks’ Simulink® product, Synopsys’ Saber and Vector’s CANoe enables virtual Hardware-in-the-Loop (HIL) and fault testing
VDK can be customized to represent any RH850 MCU including the F1x, E1x, C1x and P1x series with the Synopsys Virtualizer™ tool set

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, … Read More → "Synopsys Delivers VDK for Renesas RH850 MCUs"

Imperas™ Delivers Next Generation Embedded Software Development Suite Based On ToolMorphing™ Technology

May 23, 2013

OXFORD, United Kingdom, May 22nd, 2013 – Imperas Software Ltd (www.Imperas.com), a pioneer of advanced embedded software development systems using virtual platforms, today announced the release of its 2nd generation virtual platform development and multicore software design kit product offerings. These new products provide extended development capabilities operating at high performance levels.

The new Developer range and Multicore Software Development Kit products utilize a simulator that leverages a Just-In-Time code morphing mechanism. Imperas’ breakthrough ToolMorphing technology extends this mechanism to generate tool and model code together.

ToolMorphing allows Imperas’ customers to easily build models of … Read More → "Imperas™ Delivers Next Generation Embedded Software Development Suite Based On ToolMorphing™ Technology"

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