News – Page 1859 – EEJournal

TI introduces industry’s fastest 4-channel, 14-bit ADC at 250 MSPS

May 29, 2013

DALLAS (May 29, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s fastest 4-channel, 14-bit analog-to-digital converter (ADC), clocking in at 250 MSPS. The high-density ADS4449 enables receiver systems to support up to 125 MHz of instantaneous bandwidth in extremely small forms, such as multiple input and multiple output (MIMO) base stations and munitions guidance, or in greater density applications, such as active electrically scanned array (AESA) and other phased-array radars. For more information and to purchase evaluation modules (EVMs), visit Read More → "TI introduces industry’s fastest 4-channel, 14-bit ADC at 250 MSPS"

Free CodeReviewer Makes SmartBear One-Stop Code Review Shop for Development Organizations of All Sizes

May 29, 2013

Beverly, Mass. – May 29, 2013 – SmartBear Software, provider of software quality tools used by more than one million developers and testers worldwide, today is making its simple, efficient, award-winning code review technology available in two new solutions for the SoapUI community of over one million users, as well as small companies and development teams. CodeReviewer allows development teams with up to 10 members to code review at no cost. For teams of up to 25 developers, CodeReviewer Pro is available with extensive code review functionality and full technical support at … Read More → "Free CodeReviewer Makes SmartBear One-Stop Code Review Shop for Development Organizations of All Sizes"

Cadence Design Tools Certified for TSMC 16nm FinFET Process and for TSMC 20nm Process

May 29, 2013

SAN JOSE, CA–(Marketwired – May 29, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS – Cadence Design Systems, Inc. (NASDAQ: CDNS)

DRM and SPICE model V0.1 tool certification provides chip designers early access to TSMC 16-nanometer FinFET process
Full flow certification achieved for TSMC 20-nanometer process

Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Design Tools Certified for TSMC 16nm FinFET Process and for TSMC 20nm Process"

EnSilica launches the eSi-ZM1 System-on-Module for faster, lower risk and smarter embedded systems development

May 29, 2013

Wokingham, UK – 29^th May 2013. EnSilica, a leading independent provider of IC design services and system solutions, has launched the eSi-ZM1, a small form factor System-on-Module designed to facilitate faster, lower risk development of smarter embedded systems that demand real-time hardware performance, all without sacrificing differentiation, integration or flexibility.

The eSi-ZM1 is EnSilica’s first product in a new range of eSi-Modules and is built around the Xilinx Zynq Extensible Programming Platform. Combining a powerful dual core ARM Cortex A9 MPcore subsystem running embedded Linux together with the Xilinx Series-7 FPGA fabric, it is ideal for … Read More → "EnSilica launches the eSi-ZM1 System-on-Module for faster, lower risk and smarter embedded systems development"

Synopsys Collaboration with ACE Associated Compiler Experts Aids Compiler Technology for Processor Designer

May 29, 2013

In the world of application-specific processor design, architects require highly automated software development tools to efficiently architect their design. To aid architects in their design challenges, Synopsys and ACE Associated Compiler Experts have extended their multi-year collaboration to integrate ACE’s optimized compiler technology with Synopsys’ Processor Designer product line. The system Synopsys is licensing is ACE’s complete CoSy advanced compiler development system. CoSy represents hundreds of years of combined compiler expertise, spanning a wide range of processor architectures including RISC, DSP, and VLIW. ACE’s dedicated compiler experts will be working alongside Synopsys’ application experts in projects … Read More → "Synopsys Collaboration with ACE Associated Compiler Experts Aids Compiler Technology for Processor Designer"

Innodisk to Showcase Embedded Industry’s Smallest SSD – nanoSSD at Computex 2013

May 29, 2013

May 29, 2013, Taipei, Taiwan – Innodisk, a provider of industrial-embedded flash and DRAM storage technologies for commercial and industrial applications, will be at Computex 2013 from June 4 to June 8, 2013. Innodisk invites all interested parties to visit their booth (#K0915A at the Nangang Exhibition Hall 1F)and experience the wide range of customized DRAM and flash storage solutions that Innodisk has to offer.

The main feature of Innodisk’s exhibit will … Read More → "Innodisk to Showcase Embedded Industry’s Smallest SSD – nanoSSD at Computex 2013"

Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon West 2013

May 29, 2013

Regensburg, Germany, 29May 2013 — Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year’s Semicon West to demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus. Amicra will exhibit at Moscone North Hall in Booth 5884.

Amicra’s high-accuracy NOVA Plus and AFC system are perfectly suited for die and flip-chip processing including 3D and stack-die, covering the full scope of high-volume micro/nano assembly applications. They are laid … Read More → "Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon West 2013"

Mentor Graphics and TSMC Collaborate to Improve and Expand 20nm IC Physical Verification Offering

May 29, 2013

WILSONVILLE, Ore., May 28, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations. This joint effort has reduced Calibre® nmDRC™ 20nm signoff runtimes by at least a factor of 3X and memory requirements by 60% compared to initial design kits released last year. In addition, Calibre PERC™ N20 design kits are now available to TSMC customers as part of the companies’ ongoing collaboration for IC reliability improvement. The collaboration will continue as mutual customers ramp their releases of N20 production designs, with the goal of maintaining rapid turnaround … Read More → "Mentor Graphics and TSMC Collaborate to Improve and Expand 20nm IC Physical Verification Offering"

Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy And Automation Breakthroughs

May 28, 2013

CARY, North Carolina – May 28, 2013 – Coventor^®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced immediate availability of theSEMulator3D^® 2013 software platform. SEMulator3D 2013 brings unprecedented physical accuracy and predictive modeling capabilities to process development and integration. This milestone release expands the value of ‘virtual fabrication’ to the broader semiconductor … Read More → "Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy And Automation Breakthroughs"

ULIS launches thermal sensor array product line, within scope of European MIRTIC project

May 28, 2013

ULIS will demonstrate Micro80P, the first in a new generation of thermal sensor arrays, at Sensor & Test in Nuremburg, Germany, May 14 – 16, 2013 at stand 12502.

Veurey-Voroize, France, May 14, 2013 – ULIS, a manufacturer of high quality infrared (IR) imaging sensors for thermography, security & surveillance, automotive and military applications, announces today it will conclude the first of two phases in the MIRTIC (Micro Retina Thermal Infrared) project with the launch of the Micro80P™ thermal sensor array. The launch will take place at the Sensor & Test Fair in Nuremburg, Germany, May 14 – 16, 2013.

Micro80P is the first 80×80 … Read More → "ULIS launches thermal sensor array product line, within scope of European MIRTIC project"

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