News – Page 1854 – EEJournal

GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology

June 4, 2013

GLOBALFOUNDRIES announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs). Manufactured using GLOBALFOUNDRIES’ leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today’s electronic devices.

TSVs are vertical vias etched in a silicon wafer that are … Read More → "GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology"

Epitaxial SiC Films Grown on 300mm Si Wafers

June 4, 2013

NEWPORT, England and BRISBANE, Australia — The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on 300mm silicon wafers. This breakthrough is the result of over 10 years research at QMF on low temperature SiC deposition on silicon and the joint development by QMF and SPTS of a commercial reactor to extend the epitaxial growth process to commercial scale production of SiC coated silicon wafers.

ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor

June 4, 2013

June 4, 2013 – SAN JOSE, CA – Today ADLINK Technology, Inc., a leading provider of embedded computing products and application-ready intelligent platforms, announced availability of its initial offerings on the 4th generation Intel® Core™ processor family (formerly codenamed “Haswell”) with Intel® 8-series chipsets. The first products featuring the new generation processor are the Express-HL and Express-HL2 (COM Express®), NuPRO-E42 (PICMG 1.3), cPCI-3510 (CompactPCI®), and Matrix MXE-5400, enabling enhanced embedded applications in medical, defense, transportation, and industrial automation.

“The 4th generation Intel® Core™ processor-based platform allows ADLINK Technology to deliver up to double the graphics performance over … Read More → "ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor"

Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform

June 4, 2013

WATERLOO, Ontario – June 4, 2013 – Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices. The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

“Our MIDIS™ platform is a break-through … Read More → "Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform"

Microchip Introduces World’s First Programmable USB2 Controller Hubs; Adds Simultaneous Support for USB2 and HSIC, Low-Power Modes

June 4, 2013

CHANDLER, Ariz., June 4, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the expansion of the USB2 Controller Hub (UCH2) portfolio it gained from the recent SMSC acquisition. The seven new UCH2 ICs across three families are the world’s first to provide programmability, enabling the developers of PCs and mobile devices to configure their designs without external memory. Additionally, these are Microchip’s first UCH2s to support both USB2 and USB High Speed Interchip (HSIC) connectivity, maximum battery … Read More → "Microchip Introduces World’s First Programmable USB2 Controller Hubs; Adds Simultaneous Support for USB2 and HSIC, Low-Power Modes"

Real-Time Hypervisor for the 4th Generation Intel® Core(tm) Processors available now

June 4, 2013

Ravensburg, June 4, 2013 – Real-Time Systems, a member of the Intel® Intelligent Systems Alliance and a leader in embedded virtualization and real-time hypervisor technology, today announced Real-Time Hypervisor support for the 4th generation Intel® Core(tm) processors (formerly codename ‘Haswell’). The RTS Hypervisor allows the parallel execution of multiple, independent operating systems on a single hardware platform based on processors with the new Intel® microarchitecture.

The dual- and quad-core 4th generation Intel® Core(tm) processors with their enhanced support for virtualization lends itself to be partitioned using an embedded Hypervisor where each partition containing one or … Read More → "Real-Time Hypervisor for the 4th Generation Intel® Core(tm) Processors available now"

ESCATEC helps Azuri bring light and power to Africa

June 4, 2013

Heerbrugg, Switzerland – 4 June, 2013 – ESCATEC, the EMS innovator, has helped commercialise a novel design of solar power charging station for its client Azuri Technologies. The Indigo™ unit has a solar panel, two LED lamps and control unit with a charging point for a mobile phone. It has already won several major awards and is now in mass production in ESCATEC’s Malaysian production facilities.

In rural Africa, the typical source of light is a kerosene lamp, which is not only unhealthy and dangerous, but also expensive. It is not uncommon for people to be … Read More → "ESCATEC helps Azuri bring light and power to Africa"

ACE announces SuperTest qualification suite

June 4, 2013

Stuttgart – 4 June 2013 – ACE Associated Compiler Experts bv, world leader in tools and services for professional compiler development, announce the availability of the SuperTest qualification suite for use in software tool qualification kits and services.

Safety standards like ISO 26262 require that adequate confidence and quality levels are demonstrated in software tools. C/C++ compilers translate software to hardware architectures and are complicated tools by nature thus requiring qualification and validation when used for safety critical applications. For this purpose, ACE has developed the SuperTest qualification suite which is derived from its proven and established SuperTest … Read More → "ACE announces SuperTest qualification suite"

congatec presents its fastest COM Express module based on 4th Generation Intel® CoreT processors

June 4, 2013

San Diego, California, June 4th, 2013 * * * congatec, Inc., a leading manufacturer of embedded computer modules, announces the availability of the conga-TS87, a Type 6 COM Express module featuring 4th Generation Intel® CoreT processors. The COM Express module offers outstanding performance, featuring improved vector processing, more efficient floating point calculation and amazing graphics without an increase in power consumption.

Improvements to the previous architecture have led to efficiency gains that also boost performance. This is particularly evident in the embedded graphics, where the number of integrated graphics units (execution units) has been increased, resulting in higher 3D performance in the … Read More → "congatec presents its fastest COM Express module based on 4th Generation Intel® CoreT processors"

FPGA Design in the Cloud — Try It, You’ll Like It, Says Plunify

June 4, 2013

AUSTIN, TX–(Marketwired – Jun 4, 2013) – With the chip design community converging on Austin this week for DAC, new ideas, trends and technologies are sure to be the subject of many conversations. Joining the discussions to offer a fresh perspective on the design process is innovative start-up Plunify. Plunify’s approach utilizes the cloud as a platform, which allows FPGAdesigners to dramatically accelerate chip design workflows — and save time and money in … Read More → "FPGA Design in the Cloud — Try It, You’ll Like It, Says Plunify"

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