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First Embedded RTOS Provider to Announce USGv6 Conformity

SANTA BARBARA, CA — January 18, 2012 — Green Hills Software, the largest independent vendor of embedded software solutions, today announces new US Government IPv6 (USGv6) support for its INTEGRITY® real time operating system (RTOS) and Platform for Secure Networking. Green Hills Software is the first RTOS provider to announce this support.

Green Hills Software joins the ranks with other major networking vendors to add support and test with an accredited lab as outlined in the USGv6 test program. However, Green Hills Software is the first embedded RTOS provider to announce their USGv6 conformity and … Read More → "First Embedded RTOS Provider to Announce USGv6 Conformity"

IAR Systems releases complete starter kit for Texas Instruments Hercules safety device

Uppsala, Sweden—January 18, 2012—IAR Systems today announces that IAR KickStart Kit™ for Texas Instruments Hercules™ RM48 MCU is released and available for order.

The Hercules safety microcontroller platform from Texas Instruments Incorporated (TI) has built-in hardware safety features, making it suitable for development of systems with high requirements on functional safety, for example within medical, industrial, and transportation applications areas. The Hercules safety platform consists of three ARM® Cortex™-based microcontroller families: TMS470M, TMS570 and RM4x. The RM4x family provides the highest performance, and … Read More → "IAR Systems releases complete starter kit for Texas Instruments Hercules safety device"

Swissbit: New 8GB DDR3 modules for high end industrial PCs and servers

Bronschhofen, Switzerland – January 18, 2012 – Swissbit extends its INDUSTRIAL family of high performance / high reliability SDRAM memory products by three new 8GB density modules: the 8GB DDR3 SODIMM, the 8GB DDR3 SO-UDIMM with ECC and the 8 GB Registered DIMM. These modules offer highest DDR3 memory capacity on the smallest possible system area and enable applications with high need of main memory running on latest multi-Core CPUs.

The three module types are using the latest Samsung 4Gb … Read More → "Swissbit: New 8GB DDR3 modules for high end industrial PCs and servers"

Carbon Extends IP Exchange to Include Virtual Reference Platforms

ACTON, MASS. –– January 17, 2012 –– Carbon Design Systems™, the leading supplier of virtual platform and secure model solutions, today announced immediate availability of virtual reference platforms on its Carbon IP Exchange Web Portal, found at www.carbonipexchange.com.

“Carbon’s virtual reference platforms have been used successfully by multiple designers to quickly get up and running,” remarks Bill Neifert, chief technology officer at Carbon. 

Read More → "Carbon Extends IP Exchange to Include Virtual Reference Platforms"

SuVolta Expands Commitment to Magma’s FineSim SPICE

SAN JOSE, Calif., January 17, 2012 — Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today that SuVolta, Inc., a developer of scalable low-power CMOS technologies in Los Gatos, Calif., has expanded its business relationship with Magma by entering into a licensing agreement to use the FineSim™ SPICE multi-CPU circuit simulator. 

SuVolta’s PowerShrink™ low-power platform reduces the power consumed by integrated circuits (ICs) by 50 percent or more while maintaining the same performance levels by minimizing the electrical variation of the millions of transistors on a chip. … Read More → "SuVolta Expands Commitment to Magma’s FineSim SPICE"

Green Hills Software to Exhibit at the DistribuTECH Conference 2012 in San Antonio, TX

SANTA BARBARA, CA — January 17, 2012 — Green Hills Software, the largest independent vendor of embedded software solutions, will demonstrate its latest technology at DistribuTECH Conference, January 24 – 26, 2012, at the Henry B. Gonzalez Convention Center, San Antonio, Texas, booth #1745.
The company will be demonstrating its Platform for Smart Energy, a comprehensive, scalable solution for the design, construction, and deployment of secure, resilient, Smart Energy devices from small-footprint, high-performance devices to robust and secure utility applications.  On display:

EMA Automates PCB Footprint Generation With New App for Allegro PCB Design

Rochester, NY (January 17, 2012) – EMA Design Automation™ (www.ema-eda.com), a full-service provider of mechanical and electrical CAD tools, today announced the release of FootprintGen – an app which accurately automates the generation of complex PCB footprint (land pattern) models in a fraction of the time compared to typical manual methods. Both user-defined and the IPC-7351 standard settings are fully supported across a broad range of component families.

“Footprint creation is a constant challenge for PCB designers,” said Manny Marcano, president and CEO of … Read More → "EMA Automates PCB Footprint Generation With New App for Allegro PCB Design"

Holst Centre and imec launch research program on flexible OLED displays

Eindhoven (NL) and Leuven (B) – January 17, 2012 – Holst Centre and imec launch a new research program on next-generation flexible OLED (organic light emitting diode) displays. It builds on their proven technology track record and solid base of existing research partners in related fields such as Organic and Oxide Transistors and Flexible OLED Lighting. The primary objective of the new program is to develop an economically scalable route to high-volume manufacturing of flexible active-matrix OLED displays. The shared program will bring together partners from across the value chain to tackle challenges such as high resolution, low power consumption, large … Read More → "Holst Centre and imec launch research program on flexible OLED displays"

Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs

SAN JOSE, CA–(Marketwire – January 17, 2012) – “With the march toward greater design complexity showing no sign of abating, comprehensive verification is essential for a company to achieve its profitability goals,” said Hao Fang, IP design manager at LSI. “‘Advanced Verification Topics’ will be an important reference book for teams responsible for verifying complex mixed-signal IP and SoCs that utilize low-power, verification IP (VIP), transaction-level models (TLM), acceleration, and similar techniques to reduce risk while getting end products into working silicon faster.”Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs"

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