News – Page 1853 – EEJournal

Microchip Announces Arduino™ Compatible chipKIT™ Boards With Prototyping-Friendly 32-bit MCU Packages

May 15, 2013

CHANDLER, Ariz., May 15, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Bay Area Maker Faire in San Mateo, Calif. the expansion of its Arduino™ compatible chipKIT™ platform ecosystem, with new tools from partners Digilent, Inc., the Fair Use Building and Research (FUBAR) Labs, and Schmalz Haus LLC. These new tools are based on Microchip’s 32-bit PIC32 microcontrollers (MCUs) in prototyping-friendly, low pin count SOIC or … Read More → "Microchip Announces Arduino™ Compatible chipKIT™ Boards With Prototyping-Friendly 32-bit MCU Packages"

Renesas Electronics America Adds Powerful Debugging and Enhanced Usability with Next-Generation of e2studio Integrated Development Environment

May 14, 2013

Santa Clara, Calif., May 14, 2013 – Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today announced an enhanced version of its Eclipse-based integrated development environment (IDE), e²studio, designed to provide a flexible development platform for its market-leading microcontrollers (MCUs). e²studio version 2.0 offers a variety of new features, including support for the new Renesas RX100 series of MCUs with True Low Power^TM technology, … Read More → "Renesas Electronics America Adds Powerful Debugging and Enhanced Usability with Next-Generation of e2studio Integrated Development Environment"

ACE’s latest CoSy compiler development system optimizes for extreme architectures

May 14, 2013

Amsterdam – 14 May 2013 – ACE Associated Compiler Experts bv, world leader in tools and services for professional compiler development, announces the availability of the 2013 Spring Edition of its CoSy compiler development system. Integral support for complex architecture features allows compiler developers now to build, optimize and tune compilers for compute-intensive application domains and extreme architectures.

Standard architectures and their software tools are not adequate to reach the required performance and power levels for application specific domains like audio, video and for new domains like next generation communication standards and embedded vision. Instead, dedicated architectures or extensions to existing architectures … Read More → "ACE’s latest CoSy compiler development system optimizes for extreme architectures"

Forte Design Systems Announces Cynthesizer 5 SystemC High-Level Synthesis

May 14, 2013

SAN JOSE, CALIF. –– May 14, 2013 –– Forte Design Systems™ (www.ForteDS.com), the #1 provider of software to enable design at a higher level of abstraction, today unwrapped its enhanced Cynthesizer™ SystemC-based high-level synthesis (HLS) product.

The new version includes low power synthesis capabilities, core synthesis algorithms, and a new SystemC integrated development environment (IDE).

“Power efficiency is necessary across the spectrum of … Read More → "Forte Design Systems Announces Cynthesizer 5 SystemC High-Level Synthesis"

TI introduces industry-leading ultra-low noise, high PSRR linear voltage regulators

May 14, 2013

DALLAS (May 14, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two high-current, low-dropout (LDO) linear voltage regulators with excellent noise and power supply rejection ratio (PSRR) performance in very small, easy-to-use packages. The 250-mA LP5907 and 800-mA LP38798 LDOs feature less than 10-µVrms output noise over the 10-Hz to 100-kHz bandwidth, … Read More → "TI introduces industry-leading ultra-low noise, high PSRR linear voltage regulators"

Vicor Corporation Expands Picor Isolated Cool-Power ZVS DC-DC Converter Module Line Up With New High Density (334 W/in3) Solutions

May 14, 2013

Power Conversion Intelligent Motion (PCIM) 2013 Conference – Nuremberg, Germany – May 14, 2013 – Vicor Corporation (NASDAQ: VICR) today announced the expansion of its ultra high density Picor Cool-Power® PI31xx series of isolated, ZVS-based DC-DC converters optimized for 24 V industrial, 28 V aerospace/defense and/or demanding wide temperature applications. The new Cool-Power PI31xx converters retain the product series’ signature 0.87″ x 0.65″ x 0.265″ surface-mount package profile to provide up to 334 W/in3 power density and 2,250 V input to output isolation. At less than 50% the size of a conventional isolated 1/16th brick, Cool-Power PI31xx converters provide exceptional performance in an IC package for use … Read More → "Vicor Corporation Expands Picor Isolated Cool-Power ZVS DC-DC Converter Module Line Up With New High Density (334 W/in3) Solutions"

ADLINK Launches Powerful Embedded Vision System, EOS-1220

May 14, 2013

SAN JOSE, CA – April 23, 2013 – ADLINK Technology, Inc., a leading provider of machine vision platforms and boards, announced the release of its new EOS-1220 GigE Vision-compliant embedded vision system, featuring 3rd generation Intel^® Core™ i7 quad-core processors, four independent PoE (power over Ethernet) ports, full compatibility with GigE Vision cameras and support for smart PoE APIs, allowing remote switching of PoE status. With high-end CPUs and multi-channel connectivity in a compact housing, the EOS-1220 is ideally suited to multi-camera imaging applications such as 3D robot guidance.

Combining … Read More → "ADLINK Launches Powerful Embedded Vision System, EOS-1220"

Cree’s New Power Module Enables Higher Performance, More Reliable and Lower Cost Power Conversion Systems Compared to State-Of-The Art Silicon Modules

May 14, 2013

DURHAM, N.C., May 14, 2013 – Cree, Inc. (Nasdaq: CREE) is introducing the industry’s first commercially available silicon carbide (SiC) six-pack power module in an industry standard 45mm package. When replacing a silicon module with equivalent ratings, Cree’s six-pack module can reduce power losses by 75 percent, which leads to an immediate 70 percent reduction in the size of the heat sink or a 50 percent increase in power density. The new six-pack SiC module unlocks the … Read More → "Cree’s New Power Module Enables Higher Performance, More Reliable and Lower Cost Power Conversion Systems Compared to State-Of-The Art Silicon Modules"

PICMG Enhances CompactPCI® Express Specification

May 14, 2013

WAKEFIELD, Mass., April 29, 2013, 2013 – PICMG, a leading standards organization for the communications, military and embedded computer industries, is pleased to announce a new revision and upgrade to the CompactPCI Express specification, Revision 2. The new revision to the CompactPCI Express specification adds 5 gigabits per second transfer rate and 8 gigabits per second transfer rate PCI Express operation. This provides up to 4 times the bandwidth while maintaining full backwards compatibility with previous CompactPCI and CompactPCI Express products. Also, this specification goes to great length to define how a product’s PCI Express signaling is … Read More → "PICMG Enhances CompactPCI® Express Specification"

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes

May 14, 2013

GRENOBLE, France – May 14, 2013 – CEA-Leti said today that Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently completed HELIOS program. The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.

HELIOS, which was coordinated by Leti, also demonstrated a complete design flow, integrating both silicon photonics device design and electronic/photonic system design in an EDA-compatible framework (see www.helios-project.eu)</ … Read More → "HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes"

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