industry news
Subscribe Now

ADLINK Launches Powerful Embedded Vision System, EOS-1220

SAN JOSE, CA – April 23, 2013 – ADLINK Technology, Inc., a leading provider of machine vision platforms and boards, announced the release of its new EOS-1220 GigE Vision-compliant embedded vision system, featuring 3rd generation Intel® Core™ i7 quad-core processors, four independent PoE (power over Ethernet) ports, full compatibility with GigE Vision cameras and support for smart PoE APIs, allowing remote switching of PoE status. With high-end CPUs and multi-channel connectivity in a compact housing, the EOS-1220 is ideally suited to multi-camera imaging applications such as 3D robot guidance.

Combining PoE and IEEE 1588 support, which enables single-cable transmission of power, signal and data synchronization, ADLINK’s EOS-1220 dramatically cuts cabling requirements by as much as 60%, significantly reducing maintenance burdens. In addition, the EOS-1220 further provides smart PoE APIs, allowing remote switching of PoE status. With this feature, camera power consumption is more easily monitored and controlled, stabilizing camera temperature and significantly extending system lifetime.

Since accuracy and speed of 3D robot guidance performance improve proportionately with the quantity and quality of collected 3D data, enhanced computing power is essential. Commensurately, vision inspection, a critical asset on the production line, is more efficiently provided in multi-camera systems that also lower system costs. The use of PoE technology dramatically improves flexibility in optimizing system configuration,” said Neil Chen, product manager of digital imaging at ADLINK. “4-CH Gigabit PoE ports, superior multi-core processing performance and rich I/O functions all make the EOS-1220 an ideal solution for 3D vision robotic guidance.”

Additionally, the EOS-1220’s rich I/O interface, including four RS-232/422/485 ports, two USB 3.0 ports, 32 PNP/NPN isolation digital I/Os, dual storage (two SATA interface and one CFAST slot), an internal USB port, and 1 kbit programmable EEPROM, make the EOS-1220 simple to integrate and deploy, providing management of copy protection and software license authentication for system development. Driver support includes Windows 8/7/XP and Windows Embedded Standard 7, and File-Based Write Filter (FBWF), providing a stable, secure and high performance software operating environment.

For more information, visit www.adlinktech.com. 

About ADLINK Technology

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of rugged by design Extreme Rugged™ and Rugged product lines, including single board computers, COMs and systems. 

ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Intelligent System Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, an Executive Member of PC/104 Consortium, and a Strategic Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
18,285 views