News – Page 1801 – EEJournal

New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide

September 3, 2013

Geneva, September 3, 2013 – STMicroelectronics has unveiled its second generation of tandem diodes, which enable designers to cost-effectively enhance the energy efficiency of equipment such as power supplies, solar inverters, and e-transportation charging points.

Compared to first-generation devices, the new diodes have even lower reverse-recovery charge (Q_RR) to minimize switching losses, further extending their efficiency advantage over standard ultrafast diodes. The lower Q_RR also speeds up the fine-tuning of circuit designs, … Read More → "New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide"

Advanced Wireless Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs

September 3, 2013

WILSONVILLE, Ore., September 3, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced that Advanced Wireless Semiconductor Company (AWSC) has selected the Calibre® nmDRC™ and nmLVS™ products as their golden signoff physical verification solution for GaAs ICs targeted for mobile and other wireless applications. As part of their foundry offering, AWSC will provide the Calibre design rule decks to its customers to help them ensure their designs are error free and meet all foundry requirements before submitting them to AWSC manufacturing.

“We moved to Calibre … Read More → "Advanced Wireless Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs"

ARM Acquires Advanced Display Technology from Cadence

September 3, 2013

CAMBRIDGE, United Kingdom and SAN JOSE, Calif. – September 3, 2013 – ARM (LSE: ARM; NASDAQ: ARMH), the leading semiconductor IP supplier, and Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that the companies have signed a definitive agreement for the sale and transfer of Cadence PANTA display controller cores to ARM. The agreement enhances the companies’ long-standing ecosystem collaboration and strengthens their technical alignment.

Cadence’s PANTA family of high-resolution display processor and scaling coprocessor IP cores was co-developed in conjunction with … Read More → "ARM Acquires Advanced Display Technology from Cadence"

ams invests over €25m to create dedicated in-house production capacity for analog 3D ICs

September 3, 2013

Unterpremstaetten, Austria (3 September, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensor solutions, today announced that it has invested over €25m to create dedicated 3D IC production capacity at its wafer fabrication plant near Graz, Austria.

The investment provides for the installation of new 3D IC equipment in clean room space available at the plant, situated at the company’s headquarters.

The additional production capacity comes in response to a surge in demand outlook for ICs fabricated with 3D IC integration technology developed exclusively by ams. The patented technology enables … Read More → "ams invests over €25m to create dedicated in-house production capacity for analog 3D ICs"

ARCOL Resistors Provide Heat in Space Probe

September 3, 2013

UK based ARCOL Resistors, the long established specialists in resistor technology, has a great deal of experience of providing products for custom requirements but faced a unique challenge when asked to provide resistors for a space programme.

The THEMIS heliophysics constellation of satellites was commissioned by NASA to investigate what causes auroras in the Earth’s atmosphere to dramatically change from slowly shimmering waves of light to wildly shifting streaks of colour. Discovering what causes auroras to change is intended to provide scientists with important information on how the planet’s magnetosphere works and the important Sun-Earth … Read More → "ARCOL Resistors Provide Heat in Space Probe"

Samsung Widely Deploys Synopsys’ Design Compiler Graphical for Mobile SoC Designs

September 3, 2013

MOUNTAIN VIEW, Calif., Sept. 3, 2013 /PRNewswire/ —

Highlights:

Broad deployment of Design Compiler Graphical for Samsung Mobile SoCs
Reduced routing congestion leads to 10 percent smaller area for highly congested blocks
Minimal use of Low-Vt cells reduces leakage power while meeting frequency goals
Congestion optimization and physical guidance to IC Compiler deliver superior results and faster design closure

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips … Read More → "Samsung Widely Deploys Synopsys’ Design Compiler Graphical for Mobile SoC Designs"

congatec provides low-cost entry to 4th Generation Intel® Core™ processors on COM Express

September 2, 2013

Deggendorf, Germany, 1 September 2013 * * * congatec AG, a leading manufacturer of embedded computer modules, announces expanded processor support for the conga-TS87, a pin out Type 6 COM Express module based on the 4th Generation Intel® Core™ 2-chip solution. The most significant innovation is the introduction of Intel® Advanced Vector Extensions (Intel® AVX) 2.0 for improved floating point instructions in signal and image processing.

In addition to the existing quad-core Intel® Core™ i7-4700EQ processor, other variants such as Intel® Core™ i3-4100E (TDP 25W) are now also supported at an attractive entry price. Extended and consistent scalability is achieved … Read More → "congatec provides low-cost entry to 4th Generation Intel® Core™ processors on COM Express"

First DDC™ Transistor-Based Chip Enters Volume Production

August 30, 2013

LOS GATOS, Calif., and YOKOHAMA, JAPAN, September 3, 2013 — SuVolta, Inc. and Fujitsu Semiconductor Limited today announced volume production of the first Deeply Depleted Channel™ (DDC) transistor-based chip, MB86S22AA Milbeaut® image processor integrated circuit (IC). Manufactured on “CS250S” technology, which combines Fujitsu Semiconductor’s 55nm process with DDC technology, the IC has 30 percent lower power consumption and roughly twice the processing performance compared to the existing products, despite the new product having considerably more circuits with enhanced processing performance. MB86S22AA represents the culmination of a successful joint development program between the companies. Together, … Read More → "First DDC™ Transistor-Based Chip Enters Volume Production"

Sensor-enabled RFID tags extend wireless data-logging beyond identification

August 30, 2013

Unterpremstaetten, Austria (August 27, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced next-generation sensor-enabled RFID tags offering breakthroughs for medical, automotive safety and other applications where temperature, physiological or environmental data is required. The new devices, the SL13A and SL900A enable a simple, low-cost implementation of a new class of wireless data-logging applications.

The SL13A is an ISO15693-compliant tag for use with near field communications (NFC-V) and high-frequency radio-frequency identification (HF RFID) readers. The SL900A is an EPC Gen 2 Class 3 tag for use with RFID … Read More → "Sensor-enabled RFID tags extend wireless data-logging beyond identification"

ADLINK Introduces New PCIe-7360 PCI Express® Digital I/O Module with Data Rate up to 100 MHz

August 30, 2013

AUGUST 29, 2013 – San Jose, CA – ADLINK Technology, Inc., a leading provider of embedded computing products for test & measurement, today announced the release of its new high-speed digital I/O module, the PCIe-7360, which supports up to 100 MHz data rate and 400 MB/s throughput, with parallel and bi-directional 32-channel high-speed I/O lines and 8-channel application function I/Os. Ideally suited to large scale and high resolution digital pattern data acquisition and generation applications, the PCIe-7360 delivers market-leading support for complementary metal–oxide–semiconductor (CMOS) image sensor capture for image performance verification, ADC/DAC testing, digital image … Read More → "ADLINK Introduces New PCIe-7360 PCI Express® Digital I/O Module with Data Rate up to 100 MHz"

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