industry news
Subscribe Now

New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide

Geneva, September 3, 2013 – STMicroelectronics has unveiled its second generation of tandem diodes, which enable designers to cost-effectively enhance the energy efficiency of equipment such as power supplies, solar inverters, and e-transportation charging points.

Compared to first-generation devices, the new diodes have even lower reverse-recovery charge (QRR) to minimize switching losses, further extending their efficiency advantage over standard ultrafast diodes. The lower QRR also speeds up the fine-tuning of circuit designs, enabling faster time to market. Performance approaches that of silicon-carbide diodes, which are typically at least 30% more expensive.

The second-generation devices joining ST’s 600V tandem diode range are the STTH8T06DI and STTH8ST06DI rated for 8A average forward current, and the STTH12T06DI is for applications up to 12A. The devices have peak forward surge-current ratings equivalent to those of ultrafast diodes, ensuring robustness and reliability, and a wide operating junction-temperature range of -40°C to 175°C.

All devices are in mass production now in the TO-220AC isolated-tab package, priced from $1.57 for the STTH8T06DI in quantities of over 1,000 pieces.

For further information please go to www.st.com/tandem_diodes

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
25,227 views