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New VPX Chassis Manager from LCR Embedded Systems Allows Open Source In-field Code Upgrades; Manufactured in the USA

Technical Highlights:

  • In-field code upgrades using open source software
  • Deployment and development mount configurations
  • Management via graphical user interface
  • Designed for VPX / SOSA chassis applications
  • Meets VITA 46.11 requirements

October 2025 – Audubon, PA – LCR Embedded Systems, a leader in rugged integrated systems and enclosures for defense electronics, today announced the release of its VITA 46.11 compliant Read More → "New VPX Chassis Manager from LCR Embedded Systems Allows Open Source In-field Code Upgrades; Manufactured in the USA"

Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is introducing the LPKF CuttingMaster 2240 Cx, an advanced automated laser depaneling system designed to be fully inline, to maximise efficiency and reduce costs in high-volume PCB production.
Developed by LPKF Laser and Electronics SE, the CuttingMaster 2240 Cx represents a major advancement in laser depaneling technology. The system eliminates the need for circulating workpiece carriers, simplifying automation and lowering operational costs while maintaining LPKF’s hallmark precision and reliability. Its integrated clamping device and product-specific fork handling and unloading capabilities streamline the depaneling … Read More → "Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up"

Onspring Ushers in the Next Era of GRC with New Intelligent AI Capabilities

OVERLAND PARK, Kansas — October 14, 2025 — Onspring, a leading provider of integrated GRC software, today announced the launch of Onspring AI, a suite of embedded artificial intelligence capabilities designed to address the escalating demands faced by governance, risk and compliance (GRC) teams. By intelligently managing routine tasks and providing context-specific insight, Onspring AI empowers professionals to transcend manual tasks and refocus time on forward-thinking priorities.

Read More → "Onspring Ushers in the Next Era of GRC with New Intelligent AI Capabilities"

ST introduces new image sensors for industrial automation, security and retail applications

  • Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips
  • New device family is ideal for high-speed automated manufacturing processes and object tracking
  • New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers … Read More → "ST introduces new image sensors for industrial automation, security and retail applications"

Infineon presents XENSIV™ TLE4971/TLI4971, the most accurate coreless magnetic current sensor on the market

Munich, Germany – 20 October 2025 – Accurate current measurement is key to efficient, safe, and reliable power electronics. To address this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its XENSIV™ magnetic current sensor family with the new TLE4971/TLI4971 sensors, housed in a 300-mil package. These new products offer the highest accuracy in magnetic coreless current sensors on the market, with a total error of only 0.7 percent over temperature and lifetime. Combined with the characteristics of the 300-mil package, the high accuracy … Read More → "Infineon presents XENSIV™ TLE4971/TLI4971, the most accurate coreless magnetic current sensor on the market"

New HUBER+SUHNER SYNCRO family simplifies optical timing integration for data center operations

Nanosecond accurate time synchronisation is essential for global trade, stock exchanges, mobile communications, navigation, and geodesy. Now data center operators requiring precise time synchronisation can integrate optical timing into existing fiber architectures – enhancing performance and reducing costs – with the new SYNCRO solution from HUBER+SUHNER.

The SYNCRO family is an integrated, modular timing and Global Navigation Satellite System (GNSS) distribution portfolio designed for rapid deployment and reliable performance by extending transmission distances, reducing the number of required GNSS antennas, and eliminating many limitations of coaxial cabling.

GNSS provides the reference time used across modern networks … Read More → "New HUBER+SUHNER SYNCRO family simplifies optical timing integration for data center operations"

Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access

  • The world’s first Armv9 edge AI platform, optimized for IoT and edge AI workloads, will be available through Arm Flexible Access, giving innovators low-cost, easy access to advanced AI performance and security at the edge
  • With more than 400 tape-outs and 300 active members, Arm Flexible Access continues to fuel rapid innovation across the ecosystem, helping startups and OEMs accelerate the next generation of intelligent edge devices

The next wave of AI computing innovation will unfold at the … Read More → "Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access"

New AEC-Q200 Compliant, Automotive Grade 4-Terminal Type Shunt Resistors Now Available from Bourns

RIVERSIDE, Calif., October 16, 2025 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its CSS4C-1216 Series 4-terminal current sense resistors. … Read More → "New AEC-Q200 Compliant, Automotive Grade 4-Terminal Type Shunt Resistors Now Available from Bourns"

BOPLA BoVersa: A New Enclosure Concept for Wireless, Embedded, and Instrumentation Systems

BOPLA , a leading specialist in electronic enclosures, has introduced BoVersa,  an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems. Combining modern design with robust engineering, BoVersa delivers maximum … Read More → "BOPLA BoVersa: A New Enclosure Concept for Wireless, Embedded, and Instrumentation Systems"

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