News – Page 1781 – EEJournal

Agilent Technologies Increases Production Efficiency with Fully Automated Inline In-Circuit Test Solution

October 9, 2013

SANTA CLARA, Calif., Oct. 8, 2013 – Agilent Technologies Inc. (NYSE: A) today introduced the fully automated Medalist i3070 Series 5i Inline In-Circuit Test System. With a compact chassis, the system uses 33 percent less floor space than conventional 3070 systems.

Designed to SMEMA specifications, the i3070 Series 5i seamlessly integrates into high-volume production lines. This minimizes the need for operator handling, thereby saving labor costs, reducing the risk of product damage due to electrostatic discharge, and improving product quality.

The system … Read More → "Agilent Technologies Increases Production Efficiency with Fully Automated Inline In-Circuit Test Solution"

Semtech Partners with IMST On New Radio Module Featuring Long Distance LoRaTM Technology

October 9, 2013

CAMARILLO, Calif., October 09, 2013 — Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced it has teamed up with IMST, an advanced RF technology specialist based near Dusseldorf, Germany, for the IM880A radio module featuring Semtech’s LoRa™ long distance technology.

IMST announced the iM880A, a compact, low power, bidirectional radio module for the 868 MHz frequency band, at the Innosecure 2013 conference in … Read More → "Semtech Partners with IMST On New Radio Module Featuring Long Distance LoRaTM Technology"

SWS Releases High Performance ASSPs for Gyroscopes and Accelerometers

October 9, 2013

CAIRO, Egypt – October 8, 2013 – Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, announces the SWS1120 and SWS1130 high performance

Application Specific Standard Products (ASSPs) for MEMS gyroscopes and accelerometers.

The SWS1120/30 are designed as ASSPs that are ready for integration with MEMS sensing elements. The ASSPs are full capacitive detection and interfaces for MEMS gyroscopes and accelerometers. The SWS1120/30 are designed to support a wide variety of MEMS gyroscope and accelerometer designs through OTPconfiguration only. The SWS1120/30’s capacitive front-end has a trimmable … Read More → "SWS Releases High Performance ASSPs for Gyroscopes and Accelerometers"

Cadence Introduces Spectre XPS, A New FastSPICE Simulator Delivering Up To 10X Faster Throughput

October 9, 2013

Highlights:

Spectre XPS (eXtensive Partitioning Simulator), featuring a breakthrough partitioning technology, enables higher capacity and faster simulation while requiring two to three times less system memory
High-performance simulator delivers uniquely accurate timing analysis required for advanced-node, low-power mobile applications
The new FastSPICE technology unites with the existing Spectre environment, methodologies and PDKs for rapid adoption

BANGALORE, India, Oct. 9, 2013— At CDNLive India 2013, Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, … Read More → "Cadence Introduces Spectre XPS, A New FastSPICE Simulator Delivering Up To 10X Faster Throughput"

Industry’s first digital current sensor and voltage monitor with simultaneous sampling

October 9, 2013

DALLAS (Oct. 9, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first digital current sensor and voltage monitor with simultaneous sampling and SPI interface. The LMP92064 integrates a precision current sense amplifier and two 12-bit analog-to-digital converter (ADC) channels that simultaneously capture voltage and current data, while the SPI interface transfers real-time data at up to 20 MHz. This enables the device to provide the highest precision power calculations of any device on the market today. The LMP92064 is used in applications where precise power monitoring is crucial, such … Read More → "Industry’s first digital current sensor and voltage monitor with simultaneous sampling"

Saelig Announces MakerBot Digitizer Desktop 3D Printer

October 9, 2013

Fairport, NY, USA: Saelig Company, Inc. – (www.saelig.com) announces the availability of theMakerBot Digitizer Desktop 3D Scanner, which uses laser line triangulation toscan an object to produce a ready-to-print 3D file usually without requiring any post-processing. It creates a digital 3D model of a physical object by taking a rapid sequence of pictures with a built-in camera as the object rotates automatically … Read More →

Imperas™ Provides Comprehensive ARM® TrustZone® Modeling Kit For OVP-Based Virtual Platforms

October 9, 2013

OXFORD, United Kingdom, October 8th, 2013 – Imperas Software Ltd. (www.Imperas.com), a pioneer of advanced embedded software development systems using virtual platforms, today made available a System Modeling Kit designed to simplify the creation of high-performance virtual platforms that incorporate the ARM TrustZone technology.

The System Modeling Kit provides four open source virtual platform reference models, together with an application note and video, to demonstrate best modeling practices for systems based on TrustZone. The kit is designed to accelerate the learning curve for modeling TrustZone-based hardware, to provide high-performance, accurate … Read More → "Imperas™ Provides Comprehensive ARM® TrustZone® Modeling Kit For OVP-Based Virtual Platforms"

New Xilinx Virtex-7 FPGA VC709 Connectivity Kit Accelerates Design Productivity for High-Bandwidth Applications

October 8, 2013

Oct 8, 2013

SAN JOSE, Calif., Oct. 8, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) announced availability of its Virtex®-7 FPGA VC709 Connectivity Kit, a 40 Gbps platform that enables designers to accelerate design productivity for high-bandwidth and high-performance applications, such as network interface cards for security, network monitoring, and high frequency trading appliances. Ideal for customers needing to prototype their low power, … Read More → "New Xilinx Virtex-7 FPGA VC709 Connectivity Kit Accelerates Design Productivity for High-Bandwidth Applications"

Imec demonstrates 25Gb/s silicon photonics devices on single platform

October 8, 2013

Leuven, Belgium – October 8, 2013 – Imec today announced the release of its fully integrated silicon photonics platform (iSiPP25G) for high-performance optical transceivers (25Gb/s and beyond). Imec’s portfolio includes low loss (2.5dB/cm) strip waveguides, highly efficient grating couplers (2.5dB insertion loss), high-speed (50GHz) Germanium waveguide photodiodes, 25Gb/s Mach-Zhender and Micro-ring modulators.

“Imec’s Silicon Photonics platform provides 25Gb/s performance for integrated photonics circuits for telecom and datacom industries. Companies can benefit from ou silicon photonics capability through established standard cells, or explore the functionality of their own designs in Multi-Project Wafer (MPW) runs,” stated … Read More → "Imec demonstrates 25Gb/s silicon photonics devices on single platform"

Jasper Design Automation to Host 2013 Jasper User Group Meeting Oct. 22-23 in Cupertino Calif.

October 8, 2013

MOUNTAIN VIEW, Calif. – Oct. 8, 2013 – Jasper Design Automation, the leading provider of advanced formal technology and methodology for design and verification, will host its 2013 Jasper User Group Meeting, October 22 and 23 in Cupertino.

This annual gathering of designers, verification engineers and engineering managers from around the world is an interactive, in-depth technical conference. It will provide a unique opportunity to hear presentations from several Jasper customers, including Broadcom, ARM, NVIDIA, as well as other key customers.

This year, Jasper has added “Birds of a Feather” sessions. … Read More → "Jasper Design Automation to Host 2013 Jasper User Group Meeting Oct. 22-23 in Cupertino Calif."

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