News – Page 1780 – EEJournal

Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits

October 10, 2013

Delft, the Netherlands and Leuven, Belgium – October 8, 2013 – Delft University of Technology (TU Delft) and nanoelectronics research center imec, today presented 3D-COSTAR, a new test flow cost modeling tool for 2.5/3D stacked integrated circuits (ICs). 3D-COSTAR aims to optimize the test flow of 3D stacked ICs (SICs), taking into account the yields and costs of design, manufacturing, packaging, test, and logistics.

Due to its many high-precision steps, semiconductor manufacturing is defect-prone. Consequently, every IC needs to undergo electrical tests to weed out defective parts and guarantee outgoing product quality to the customer. For TSV-based 2.5D- and 3D-SICs that … Read More → "Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits"

Digia and QNX to Provide Enhanced User Interface Capabilities for Enterprise Customers with Qt 5

October 10, 2013

BERLIN, Qt Developer Days, October 8, 2013 — QNX Software Systems Limited, a global leader in software platforms for connected embedded systems, and Digia Plc., the Helsinki-headquartered product, services and consulting powerhouse responsible for Qt, a leading cross-platform application and user interface (UI) development framework, today announced that Digia is ready to support Qt 5 on the QNX® Neutrino® Realtime Operating System and Read More → "Digia and QNX to Provide Enhanced User Interface Capabilities for Enterprise Customers with Qt 5"

Using NVDIMM as Storage, In-Memory Database Gains Durability & Keeps High Performance

October 10, 2013

Issaquah, WA — October 8, 2013 — In the industry’s first test of in-memory database system (IMDS) speed and recoverability using the emerging Non-Volatile DIMM (NVDIMM) technology, McObject® and AgigA Tech, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), announced McObject has successfully benchmarked its eXtremeDB® IMDS using AgigA Tech’s AGIGARAM® NVDIMM as main memory storage. The tests included “pulling the plug” mid-execution, which confirmed the AGIGARAM product’s ability to save data persistently in the event of system failure, and to facilitate recovery.

In addition, eXtreme</ … Read More → "Using NVDIMM as Storage, In-Memory Database Gains Durability & Keeps High Performance"

ADLINK Employs Latest Intel® Atom™ and Intel® Celeron® SoC for High Performance, Low Power Designs From SMARC Modules to Rugged Systems

October 10, 2013

October 8, 2013 – San Jose, CA – ADLINK Technology, Inc., a leading provider of embedded computing products and application-ready intelligent platforms, today announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed I/Os, an advanced graphics engine, and virtualization support — all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.

ADLINK’s new offerings include low … Read More → "ADLINK Employs Latest Intel® Atom™ and Intel® Celeron® SoC for High Performance, Low Power Designs From SMARC Modules to Rugged Systems"

Cadence Introduces New Family of Silicon-Proven High Performance Data Converter IP for Advanced 28nm Node

October 10, 2013

SAN JOSE, Calif., 10 Oct 2013

Highlights:

IP family delivers up to 10x faster conversion rate than available competing IP solutions
High-performance cores enable next-generation applications, such as WiGig (802.11ad)
Broad IP family offering for consumer, mobile, infrastructure and industrial markets

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced a suite of … Read More → "Cadence Introduces New Family of Silicon-Proven High Performance Data Converter IP for Advanced 28nm Node"

EV Group Introduces Roll-To-Roll Nanoimprint Lithography System For Biomedical, Optical And Flexible Electronics Applications

October 9, 2013

DRESDEN, Germany, Oct. 8, 2013 /PRNewswire/ –PLASTIC ELECTRONICS —EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG^®570R2R—the industry’s first roll-to-roll thermal nanoimprint lithography (NIL) tool. Jointly developed with the Industrial Consortium on Nanoimprint (ICON), helmed by A*STAR’s Institute of Materials Research and Engineering (IMRE), the EVG570R2R utilizes hot embossing to mass-produce … Read More → "EV Group Introduces Roll-To-Roll Nanoimprint Lithography System For Biomedical, Optical And Flexible Electronics Applications"

Xilinx Highlights All Programmable Packet Processing Solutions for Next Generation Smarter Networks at Linley Processor Conference 2013

October 9, 2013

SAN JOSE, Calif., Oct. 9, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will highlight its All Programmable packet processing solutions for next-generation Smarter Networks at the Linley Processor Conference, October 16-17, in Santa Clara, CA. Xilinx technology experts will present and demonstrate solutions that enable full line card data path services. Xilinx packet processing solutions empower system developers to shorten design cycles, while meeting rapidly changing connectivity standards, targeting the growing ASIC and ASSP gaps … Read More → "Xilinx Highlights All Programmable Packet Processing Solutions for Next Generation Smarter Networks at Linley Processor Conference 2013"

Analog MEMS accelerometer suits engine anti-vibration and electrically controlled suspension applications

October 9, 2013

Hoofddorp, Netherlands: Murata today announced the SCA720 series of analog MEMS accelerometers aimed specifically at electrically controlled suspension and engine anti-vibration applications. Measuring only 7.0 x 8.6 z 3.3 mm and constructed from a single crystal silicon, the sensor is mechanically robust and has no deformation up to 70 000g. The accelerometer’s 3D structure employs capacitive sensing techniques that give it extremely sensitive measurement characteristics and excellent offset stability. Internal inert gas damping of the MEMS sensing element provides a mechanical low-pass filter that cuts off above 115 Hz and provide a good stable amplitude output and noise filtering.

Get to Market Faster with an Accurate, Integrated Isolated Energy Measurement Chipset for Embedded Applications

October 9, 2013

San Jose, CA—October 9, 2013—Designers can now measure AC or DC power usage from any phase without the need for bulky sensors, optocouplers, or an extra power supply for the measurement subsystem. Just use the compact MAX78700/MAX78615 isolated energy measurement chipset with preloaded firmware from Maxim Integrated Products, Inc. (NASDAQ: MXIM).

Engineers face unique challenges when embedding high-voltage AC (or DC) measurement into their design. … Read More → "Get to Market Faster with an Accurate, Integrated Isolated Energy Measurement Chipset for Embedded Applications"

Announcing congatec’s first Qseven module with single-chip, quad-core Intel® AtomT processor E3800 family

October 9, 2013

San Diego, California, October 8^th, 2013 * * * congatec, Inc., a leading manufacturer of embedded computer modules, announces the immediate availability of the conga-QA3 Qseven module based on the Intel® AtomT processor E3845. All modules are fitted with ceramic capacitors making them ideal for industrial mobile applications in harsh environments. New features include an ample L2 cache, which can be shared by multiple cores, and a much faster Intel HD graphics unit compared with the previous generation. This turns new applications into visual experiences.

The modules support Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) set, which is … Read More → "Announcing congatec’s first Qseven module with single-chip, quad-core Intel® AtomT processor E3800 family"

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