News – Page 1747 – EEJournal

ISA to develop a new certification program as part of a $23 million grant to fund degree programs and prepare workers for careers in “Mission Critical Operations”

December 11, 2013

Research Triangle Park, North Carolina, USA (10 December 2013) — The International Society of Automation (ISA) announces today that it will begin developing a new certification program as part of a recently announced $23 million federal grant to fund two-year degree programs in “Mission Critical Operations” at five North Carolina colleges.

The grant, administered through the US Department of Labor, is designed to prepare tomorrow’s workforce to compete for increasingly demanding, high-wage and high-skill jobs in industrial operations and information technology, particularly those defined as mission critical—“operations requiring round-the-clock supervision of systems” and those “aimed at … Read More → "ISA to develop a new certification program as part of a $23 million grant to fund degree programs and prepare workers for careers in “Mission Critical Operations”"

Bruker Launches ContourSP 3D Optical Microscope for PCB Industry

December 11, 2013

TUCSON, Arizona – December 10, 2013 – Bruker announced today that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capableContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led … Read More → "Bruker Launches ContourSP 3D Optical Microscope for PCB Industry"

Texas Instruments introduces the industry’s most flexible haptics and capacitive touch combo solution enabling “Haptics for Everyone”

December 11, 2013

DALLAS (Dec. 10, 2013) – Expanding its broad portfolio of capacitive touch solutions, Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s most flexible haptics and capacitive touch combo solution on one chip. The new MSP430TCH5E haptics-enabled microcontrollers allow users to add vibrational feedback to all capacitive touch buttons, sliders and wheels on mobile computing and gaming devices, smart TV remotes, cameras, printers, industrial control panels, point-of-sale terminals and toys. Featuring a license for Immersion TouchSense^® 2200 software, MSP430TCH5E MCUs allow developers to easily add and … Read More → "Texas Instruments introduces the industry’s most flexible haptics and capacitive touch combo solution enabling “Haptics for Everyone”"

Synopsys Demonstrates Industry’s First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer

December 11, 2013

MOUNTAIN VIEW, Calif., Dec. 10, 2013 /PRNewswire/ —

Highlights:

Demonstrated 10 Gbps USB 3.1 Host-Device data transfers at over 900 MBps enables increased performance for storage devices and PCs
Demonstration uses backward-compatible USB 3.0 connectors, cables and software drivers
Data transfer speeds of more than 900 MBps validated by the Ellisys Protocol Analyzer, the industry’s first USB 3.1 protocol analyzer
Consumer products with integrated USB 3.1 Hosts benefit from high-performance external data access speeds that match internal data access speeds, allowing consumers to add storage without sacrificing performance.

Synopsys, Inc. ( … Read More → "Synopsys Demonstrates Industry’s First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer"

Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology

December 11, 2013

Geneva, December 10, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Harvesting ambient light or thermal energy to power small electronic devices such as wireless sensors, smart-building and industrial equipment controls, wellness and wearable monitors, protects the environment by reducing CO₂ emissions, while eliminating batteries and power cabling, so finally enabling the Internet of Things (IoT) ecosystem. … Read More → "Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology"

DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP

December 11, 2013

SAN JOSE, CA–(Marketwired – December 10, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Digital Voice Systems, Inc. (DVSI) AMBE® Advanced Multi-Band Excitation wideband decoder software has been ported to the Cadence® Tensilica® HiFi Audio/Voice DSP family to enhance high-quality voice compression at low bit rates.

“The Cadence Tensilica HiFi Audio/Voice DSP family is an ideal, efficient platform for our AMBE voice compression products,” said Robert Maher, director of sales & marketing, DVSI. “It … Read More → "DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP"

Imec Demonstrates Strained Germanium FinFETs at IEDM 2013

December 10, 2013

Washington D.C., USA – December 10, 2013 – At this week’s IEEE International Electron Devices Meeting (IEDM 2013), imec reported the first functional strained germanium (Ge) quantum-well channel pMOS FinFETs, fabricated with a Si Fin replacement process on 300mm Si wafers. The device shows a possible evolution of the FinFET/trigate architecture for 7nm and 5nm CMOS technologies.

Since the 90nm technology, embedded SiGe source/drain has been a popular stressor method to produce strained Si that enhances pMOS devices. With diminishing device dimensions, the … Read More → "Imec Demonstrates Strained Germanium FinFETs at IEDM 2013"

Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology

December 10, 2013

Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead

December 10, 2013

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced a new record breaking 4.4M logic cell device, more than doubling its industry leading highest capacity Virtex®-7 2000T device, achieving two consecutive generations of high-end leadership, and delivering an extra node worth of customer value. As the highest end device of Xilinx’s All Programmable UltraScale™ portfolio, also announced today, the Virtex® UltraScale™ VU440 3D … Read More → "Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead"

Micron’s High-Density 45nm Serial NOR Flash Doubles Programming Speed for Embedded Applications

December 10, 2013

BOISE, Idaho, December 10, 2013 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface. These new MT25Q SPI NOR devices offer a cost-effective solution with high performance, enhanced security and drop-in compatibility with legacy NOR devices, enabling high-density SPI NOR adoption in consumer, automotive, industrial and networking applications.

Micron’s MT25Q devices satisfy embedded application requirements with best-in-class 2 MB/s programming speed. In addition, MT25Q devices offer improved erase performance and 66 MB/s read … Read More → "Micron’s High-Density 45nm Serial NOR Flash Doubles Programming Speed for Embedded Applications"

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