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Ericsson third-generation 25A digital point-of-load regulator embeds dynamic loop compensation

December 12, 2013
  • New 25A regulator offers very high power density of 28.44W/cm3 (465W/in3) and 25 percent more output current in the same footprint as second-generation 20A module
  • Dynamic Loop Compensation improves stability and shortens time-to-market
  • Paralleling of seven modules with phase spreading delivers 175A, while ripple-and-noise is reduced to the lowest possible level

The new Ericsson 3E series BMR463-25A is a third-generation digital point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC) and delivers a 25 percent increase in output current over the second-generation BMR463-20A, yet comes in … Read More → "Ericsson third-generation 25A digital point-of-load regulator embeds dynamic loop compensation"

Laird Offers New Tool to Simplify Selection of Bluetooth Products

December 12, 2013

December 10, 2013 — Laird, a leading global technology company, announced the release of the Laird Bluetooth Selection Tool. This simple online tool is an excellent resource for engineers to quickly narrow down Laird’s extensive Bluetooth offerings and choose the optimal Bluetooth module solution for their specific project requirements. 

TI redefines MCU performance in high-end industrial applications with C2000™ Delfino™ F2837xD series, industry’s highest performing dual-core MCUs

December 12, 2013

Houston, TX (Dec. 11, 2013) – Announcing the latest innovation in industrial real-time control, Texas Instruments (TI) (NASDAQ: TXN) today set the new performance standard with the new C2000™ Delfino™ 32-bit F2837xD microcontroller (MCU) in the F2837x series. With dual-core C28x processing capabilities and dual real-time control accelerators, also known as control law accelerators (CLAs), these new MCUs provide 800 MIPS of floating-point performance, enabling designers to develop low-latency systems in computationally demanding control applications. Designers can also reduce complexity by consolidating multiple embedded processors into a single … Read More → "TI redefines MCU performance in high-end industrial applications with C2000™ Delfino™ F2837xD series, industry’s highest performing dual-core MCUs"

Pasternack Releases New Lines of Multi-Octave Wilkinson Power Dividers

December 12, 2013

Irvine, CA – Pasternack Enterprises, Inc., an industry leading manufacturer and global supplier of RF and microwave products, introduces a brand new line of Wilkinson power dividers (also referred to as Wilkinson power splitters). These multi-octave power dividers cover popular communications bands from 0.5 to 2.7 GHz including 3G and 4G, plus WiFi bands and are well suited for applications such as in-building distributed antenna systems (DAS) or test environments.

Pasternack is offering two Wilkinson designs covering 0.5 to 2 GHz and 0.7 to 2.7 GHz bands. The 0.5 to 2 GHz band power dividers utilize SMA connectors and are available as 2-way, 4 … Read More → "Pasternack Releases New Lines of Multi-Octave Wilkinson Power Dividers"

New tutorial discusses diagnosing defects and variances on DDR memory buses and high-speed serial IO

December 12, 2013

Richardson, TX (Dec 12, 2013) ? Slight variances and defects on circuit boards are more difficult than ever to detect and diagnose. Plus, they can result in system crashes and degrade performance later on because their harmful effects are cumulative. A new tutorial by ASSET InterTech (www.asset-intertech.com) investigates how advanced test and debug tools based on instruments embedded in chips are able to identify the root causes of defects and variances in complex chips and circuit … Read More → "New tutorial discusses diagnosing defects and variances on DDR memory buses and high-speed serial IO"

STMicroelectronics Strengthens Presence in RF Power Market with New Moisture-Resistant Devices

December 11, 2013

Geneva, December 11, 2013 – STMicroelectronics unveils two new moisture-resistant radio-frequency (RF) power transistors that increase the ruggedness and reliability of applications operating in high-moisture environments.

The cavity of the two 50V RF DMOS devices is filled with gel, protecting the die from electro-migration such as silver dendrite migration, a well-known phenomenon that appears in standard ceramic packages due to a combination of high temperature, biasing and humidity. The use of gel-filled packages helps reduce the overall maintenance costs of the applications running in high-moisture environments.

ST’s 150 … Read More → "STMicroelectronics Strengthens Presence in RF Power Market with New Moisture-Resistant Devices"

Silicon Labs Targets Internet of Things with Lowest Power and Smallest Form Factor Wireless MCUs

December 11, 2013

AUSTIN, Texas – Dec. 11, 2013 – Silicon Labs (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today announced that it has expanded its family of 8-bit Si10xx wireless microcontrollers (MCUs) with two new options optimized for both cost-sensitive and performance-intensive designs. By combining its ultra-low-power MCU technology with its sub-GHz EZRadio® and EZRadioPRO® transceivers in a single-chip solution, Silicon Labs has created new energy-friendly wireless MCUs that achieve industry-leading RF performance with the lowest overall power consumption in their class. Supporting worldwide frequency bands from 142 to 1050 MHz … Read More → "Silicon Labs Targets Internet of Things with Lowest Power and Smallest Form Factor Wireless MCUs"

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