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Lattice Semiconductor And Leopard Imaging, Texas Instruments Design Network Members, Announce Dual Camera Kit For Black Box Car Drive Recorders

HILLSBORO, OR  July 12, 2012  Lattice Semiconductor Corporation (NASDAQ: LSCC) and Leopard Imaging today announced the release of a dual camera module kit that allows the DaVinci™ TMS320DM368 video processor from Texas Instruments Incorporated (TI) to interface to two 720p image sensors.  This kit is ideal for customers who are designing black box car drive recorders or other applications that require two cameras.  For black box car drive recorder applications, one camera can be pointed out the front of the vehicle, … Read More → "Lattice Semiconductor And Leopard Imaging, Texas Instruments Design Network Members, Announce Dual Camera Kit For Black Box Car Drive Recorders"

Xylon now shipping upgraded logiCAN CAN2.0B Bus Controller IP Core

Zagreb, Croatia, July 13, 2012 – Xylon d.o.o., a leading provider of advanced FPGA application solutions and IP cores, has upgraded the logiCAN CAN2.0B Compatible Network Controller with new features. The logiCAN IP core now has ARM® AXI4-Lite bus interface which allows easy implementation on the latest Xilinx FPGA families, including the 7 series Artix®-7, Kintex®-7 and Virtex®-7 devices. It can be also used in Xilinx ZynqTM-7000 EPP devices integrating < … Read More → "Xylon now shipping upgraded logiCAN CAN2.0B Bus Controller IP Core"

New Cree XLamp® XP-G2 LEDs Deliver 20 Percent Efficiency Increase in the XP Footprint

DURHAM, N.C.–(BUSINESS WIRE)– Cree, Inc. (Nasdaq: CREE) introduces the XLamp® XP-G2 LED to deliver luminaire manufacturers up to 20 percent more lumens per watt and 2.5 times the lumens-per-dollar over the original XP-G LED. The brighter, more efficient XP-G2 LED provides customers an immediate boost in performance and enables manufacturers to use fewer LEDs to get the same brightness at lower cost or increase brightness levels using the same LED count and power.

Characterized and binned at 85°C, the new XP-G2 LED leverages the same footprint (3.45mm x 3.45mm) and is compatible optically with the original XP-G … Read More → "New Cree XLamp® XP-G2 LEDs Deliver 20 Percent Efficiency Increase in the XP Footprint"

Ricoh Adopts EVE’s ZeBu to Enable ESL Co-Emulation for Early Development of Embedded Software

SAN JOSE, CALIF. –– July 11, 2012 –– EVE, the leader in hardware/software co-verification, today announced that Ricoh Company, Ltd., of Tokyo, Japan, has selected its ZeBu hardware-assisted verification platform to accelerate its application specific integrated circuit (ASIC) and system-on-chip (SoC) development.

ZeBu systems are being combined with Synopsys® Virtualizer™-based virtual prototypes to create a co-emulation environment that enables early embedded software development.

The increase in size and complexity of … Read More → "Ricoh Adopts EVE’s ZeBu to Enable ESL Co-Emulation for Early Development of Embedded Software"

Avnet Embedded and Intel Present Technical Training on the Intel® Xeon® E5 Family of Processors to Americas Customers

PHOENIX — Avnet Embedded, a division of Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), joins Intel in an in-depth technical training session on the new Intel Xeon® E5 family of processors. This free, Web-based training covers the Intel® Xeon® processor E5-2600/2400 families including a platform overview and technical highlights of each. This training … Read More → "Avnet Embedded and Intel Present Technical Training on the Intel® Xeon® E5 Family of Processors to Americas Customers"

LAPIS Semiconductor Announces an Ultra-Low Power, Ultra-Compact Sensor Hub Microcontroller for Smartphones & Accessories

SAN DIEGO, Calif. – June 5, 2012 – LAPIS Semiconductor (formerly OKI Semiconductor), a ROHM Group company, announces the development of the ML610Q792 Sensor Hub Microcontroller—the industry’s smallest microcontroller designed for integrated, low-power control of multiple sensors in smartphones.

The ML610Q792 makes it possible to deploy new cloud-based features and services in smartphones that would otherwise … Read More → "LAPIS Semiconductor Announces an Ultra-Low Power, Ultra-Compact Sensor Hub Microcontroller for Smartphones & Accessories"

Renesas Electronics 7th-Generation 650V and 1250V IGBT Series Sets a New Technology Benchmark Enabling High-Efficiency Solutions in Industrial Applications such as Inverters for Solar Power and Industrial Motors

TOKYO, Japan, July 11, 2012 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced 13 new products in its 7th-generation Insulated Gate Bipolar Transistor (IGBT) lineup with industry-leading high performance. The new IGBTs include the RJH/RJP65S series for 650V and RJP1CS series for 1250V. The new IGBTs are power semiconductor devices used in systems that convert DC into AC power, and are designed for applications that handle high voltages and large currents, such as power conditioners (power converters) for solar power generators and industrial motors. The 7th-generation technology, based on enhanced thin wafer process, sets … Read More → "Renesas Electronics 7th-Generation 650V and 1250V IGBT Series Sets a New Technology Benchmark Enabling High-Efficiency Solutions in Industrial Applications such as Inverters for Solar Power and Industrial Motors"

Zuken gathers innovative minds from more than 800 global companies

12 July, 2012 – Munich, Germany and Westford, MA, USA – Zuken announces the launch of a new annual conference for their user community. A technology leader in electrical and electronic design, and data management solutions, Zuken welcomes attendees from a diverse range of industries to eight locations worldwide. Users of Zuken’s tools, their managers and industry media alike will find sessions to interest, inform and inspire at each event.

Steve Chidester, Zuken’s Head of International Marketing, says: “We’ve listened to attendee feedback from all of our local events and incorporated new ideas to create Zuken Innovation … Read More → "Zuken gathers innovative minds from more than 800 global companies"

12.1-in Open-Frame Panel PC for Industrial Applications

July 12, 2012, Arlington, TX – Today WinSystems introduced a 12.1-inch open frame, color flat panel PC and 1.66GHz single board computer (SBC) based on the Intel® Atom processor.  The PPC3-12 panel PC is a compact, ready-to-mount flat panel display subsystem that also includes a resistive touchscreen integrated into a chassis less than three inches deep.  The open frame (i.e. without a front bezel) chassis permits flexible mounting of the system for OEMs and … Read More → "12.1-in Open-Frame Panel PC for Industrial Applications"

Cadence Adds Powerful New Capabilities to Its PCI Express Verification IP Including PIPE4 Support

PCI-SIG® DEVELOPERS CONFERENCE — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced powerful new capabilities in its PCI Express® Verification IP (PCIe® VIP) which result in more in-depth verification of the most current PCI Express specification at both the block and system-on-chip (SoC) levels. The comprehensive Cadence technology includes … Read More → "Cadence Adds Powerful New Capabilities to Its PCI Express Verification IP Including PIPE4 Support"

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