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Greenvity introduces scalable IoT system solutions for smart LED lighting and home and building automation

  • Greenvity to demo green Internet of Things solutions at Distributech
  • Turn-key solutions include HomePlug Green PHY PLC and ZigBee Wireless Hybrii SoCs, modules, software and mobile apps

MILPITAS, Calif. – Jan. 13, 2014 – Greenvity Communications is now offering total turn-key solutions comprising system-on-chips (SoC), modules, software and mobile apps that enable any home device or Internet of Things (IoT) device to be smart and controllable for energy-saving and home and building automation purposes. At the core of these solutions are Greenvity’s patented Hybrii® SoCs, which integrateHomePlug® Green PHY™ powerline communication (PLC) and ZigBee® wireless for … Read More → "Greenvity introduces scalable IoT system solutions for smart LED lighting and home and building automation"

650V SiC Diodes from STMicroelectronics Offer Unique Dual Configurations for Increased Safety, Energy Efficiency, and Space Savings

Geneva, January 13, 2014 – New dual-configuration Schottky silicon-carbide (SiC) diodes from STMicroelectronics are the first such devices in the industry with a voltage rating of 650V per diode in a choice of common-cathode or series configurations allowing use in interleaved or bridgeless power-factor correction (PFC) circuits.

ST is a leading innovator of SiC power semiconductors that have inherently higher energy efficiency and ruggedness compared to ordinary silicon alternatives. ST’s STPSC6/8/10TH13TI and STPSC8/12/16/20H065C devices[1] combine … Read More → "650V SiC Diodes from STMicroelectronics Offer Unique Dual Configurations for Increased Safety, Energy Efficiency, and Space Savings"

Entropic Completes Integration of Cryptography Research CryptoFirewall(TM) Security Cores

LAS VEGAS, Jan. 8, 2014 (GLOBE NEWSWIRE) — (International Consumer Electronics Show) — Entropic (Nasdaq:ENTR), a world leader in semiconductor solutions for the connected home and Cryptography Research, Inc. (CRI), a division of Rambus Inc. (Nasdaq:RMBS), today announced Entropic has completed the integration of the Cryptography Research CryptoFirewall(TM) security core technology into its advanced line of multimedia set-top box (STB) system-on-a-chip (SoC) products. By incorporating CRI’s technology into its SoCs, Entropic can help ensure its products protect against signal theft and … Read More → "Entropic Completes Integration of Cryptography Research CryptoFirewall(TM) Security Cores"

Agilent Technologies Introduces Industry’s First USB 3.0 SSIC and MIPI CSI-3 Protocol-Decoding Software for Oscilloscopes

SANTA CLARA, Calif., Jan. 8, 2014 – Agilent Technologies Inc. (NYSE: A) today introduced the industry’s first software for decoding USB 3.0 SuperSpeed Inter-Chip (SSIC) and MIPI Camera Serial Interface 3 (CSI-3) protocols on oscilloscopes. The new protocol decoders provide design and validation engineers with a fast, easy way to validate and debug their SSIC and CSI-3 interfaces.

SSIC is used for point-to-point communication between chips using the USB 3.0 protocol. The SSIC standard was developed by the USB-IF standards body, leveraging the MIPI™ Alliance MIPI M-PHY electrical layer to transfer USB 3.0 protocol. It allows USB 3.0 intellectual property and designs to be … Read More → "Agilent Technologies Introduces Industry’s First USB 3.0 SSIC and MIPI CSI-3 Protocol-Decoding Software for Oscilloscopes"

Fairview Microwave Announces New Line of Variable RF Switch Attenuators

January  9, 2014 – Allen, TX – Fairview Microwave, Inc. a preeminent supplier of on-demand microwave and RF components, has released a new line of compact hot-switchable variable attenuators. RF attenuators are used to reduce the amplitude of an electronic signature in many common electronic scenarios including lab testing equipment, Distributed Antenna Systems (DAS) and power and signal monitoring systems.

Fairview Microwave’s new line of variable switch attenuators come in 3 and 6 GHz frequency models and several different connector configurations including SMA and N type connectors with side or rear mount positions.  Several of these attenuators are hot-switchable, … Read More → "Fairview Microwave Announces New Line of Variable RF Switch Attenuators"

DSP Group’s DECT SoC Enables CAT-iq 2.0 in Home Gateways

SAN JOSE, Calif., Jan. 7, 2014 (GLOBE NEWSWIRE) — DSP Group(R), (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that DSP Group’s DECT/CAT-iq 2.0 DCX81 System-on-a-Chip (SoC) is integrated in Swisscom’s new gateway products.

DSP Group’s DCX family of highly-integrated single-chip DECT solutions cost effectively delivers full home coverage with multi-line, multi-handset support and crystal clear high definition voice (HD Voice). The SoC is embedded with certified CAT-iq 2.0 firmware, offering … Read More → "DSP Group’s DECT SoC Enables CAT-iq 2.0 in Home Gateways"

Quintic to Demonstrate the Industry’s Top Performance for Bluetooth Smart Wearable Platforms at CES

Las Vegas, NV. – CES – Jan. 7, 2014 – Quintic, the leading developer of integrated nano-power wearable platforms, is demonstrating its wearable platform’s superior capabilities at CES. The demonstrations will highlight Quintic’s new 9020 Bluetooth Smart wearable platform and will showcase some enhanced wearable applications driven by synergistic co-developments with Quintic’s reference design partner, Linear Dimensions Semiconductor. The 9020 provides the industry’s lowest power consumption, highest wireless performance, and best processing capabilities. 

The 9020 is Quintic’s first product from its wearable platform roadmap. The 9020,as well as Quintic’s proceeding … Read More → "Quintic to Demonstrate the Industry’s Top Performance for Bluetooth Smart Wearable Platforms at CES"

What are the challenges for MEMS sensors in the next 5 years?

Lyon, France – January 9, 2013: Yole Développement organizes a MEMS & Imaging Technology Seminar in Korea on January 16, 2014. Dedicated to MEMS devices & manufacturing technologies areas, followed by Imaging, the seminar is made up of Yole Développement presentations on the related market area, System Plus Consulting tools presentations (Reverse Costing and Cost Simulation). The French consulting company also invites industrials speakers to present their vision of the Industry: Bosch Sensortec, CMOSIS and GMEMS.

Discover below Yole Technology Seminar’s agenda and register now on www.i-micronews.com or click < … Read More → "What are the challenges for MEMS sensors in the next 5 years?"

HBM Adds Real Time Data Calculation Capabilities (True RMS) to its 1kV Card

Marlborough, Massachusetts  — January 6, 2014 — HBM, Inc. (www.hbm.com), a leading manufacturer of data acquisition systems, analysis and calibration software, strain gauges, and transducers and sensors, has added real time data calculation capabilities to its 1kV card.  A new isolated 1kV data acquisition card lets the data recorders perform real time calculations on the fly, while allowing users to view results immediately. In contrast, other devices require the use of post-processing software to view analysis results later rather than in real-time.

Read More → "HBM Adds Real Time Data Calculation Capabilities (True RMS) to its 1kV Card"

New 3U CompactPCI Serial Carrier Card from MEN Micro Integrates M-Module Functionality

BLUE BELL, Pa. January 2014 – MEN Micro Inc., a world-renowned provider of embedded computing and I/O solutions for mission-critical industrial, mobile and harsh environment applications, recently released the G204, a 3U CompactPCI Serial carrier card with an M-Module slot

An easy way to integrate flexible I/O, the M-Module slot provides users with the ability to interchange more than 30 I/O functions within a system. The … Read More → "New 3U CompactPCI Serial Carrier Card from MEN Micro Integrates M-Module Functionality"

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