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World’s Lowest Profile Active and Passive Antennas from Parsec Technologies Make Perfect Companions to Mini GPS Receiver from Telit and Achieve Best-in-Class Position Accuracy, Sensitivity

January 14, 2014

RALEIGH, N.C. – January 14, 2014 – Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services and Plano, Texas based Parsec Technologies, Incorporated, a global supplier of advanced amplifier technology communications products, solutions, and services, today announced that a combination of the companies’ technologies results in the world’s lowest profile  companion solution for GPS receiver and antenna. For host devices able to accommodate higher volumetric symmetry, assembly of the components can be made to fit a 6x16x8 … Read More → "World’s Lowest Profile Active and Passive Antennas from Parsec Technologies Make Perfect Companions to Mini GPS Receiver from Telit and Achieve Best-in-Class Position Accuracy, Sensitivity"

Microchip Updates MPLAB® Device Blocks for Simulink® With Multi-Rate and Interrupt Capabilities; Makes Sophisticated Algorithm Design Easy

January 14, 2014

CHANDLER, Ariz., Jan. 14, 2014 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced Version 3.30 of its MPLAB® Device Blocks for Simulink®, which make it easy to develop complex designs using Microchip’s dsPIC30 and dsPIC33 digital signal controllers (DSCs).  This software provides a set of user interfaces to MathWorks’ Simulink graphical environment for simulation and model-based design, where code for the application is generated, compiled … Read More → "Microchip Updates MPLAB® Device Blocks for Simulink® With Multi-Rate and Interrupt Capabilities; Makes Sophisticated Algorithm Design Easy"

Imec and AlixPartners to Develop Model Aimed at Lowering Costs of Advanced Semiconductor Technology

January 14, 2014

Leuven, Belgium – Jan. 13, 2014 – Nanoelectronics research center imec and AlixPartners, a leading global business advisory firm, announced today that the two companies are co-developing a cost modeling solution to assess the cost of advanced semiconductor technology options. The work is aimed at assisting the semiconductor industry in improving the operational intelligence around costs of future technology nodes.

This modeling will assess the cost of various patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory – all topics with big impacts on the price-tag of future consumer electronics. Imec and AlixPartners will be … Read More → "Imec and AlixPartners to Develop Model Aimed at Lowering Costs of Advanced Semiconductor Technology"

i2a Technologies Increases Capacity to Meet Rising Orders for Wafer Bumping Services

January 13, 2014

Fremont, CA — Jan 13, 2014 / (http://www.myprgenie.com) — i2a Technologies announced today the completion of its wafer UBM expansion, which will more than double its UBM and bumping services from its Silicon Valley — US based facility.  Previously, i2aTechnologies has offered both solder and Au bumping. However, because of a recent surge in demand for wafer UBM for Cu wire bonding as well as solder micro-bumping for flip chip, i2a Technologies has converted Au bumping to support … Read More → "i2a Technologies Increases Capacity to Meet Rising Orders for Wafer Bumping Services"

Sundance launches SMT166 dual-FPGA development platform; powers EU’s FP7 FlexTiles 3D SoC project

January 13, 2014

Chesham, UK – 13th January 2014.  Sundance Multiprocessor Technology, a pioneer in scalable and modular computing modules for embedded solutions, has launched the SMT166 dual-FPGA platform for R&D into the use of large FPGAs for high-performance reconfigurable computing and large-scale embedded systems applications as well as system-on-chip (SoC) simulation. At the same time, Sundance has announced that the SMT166 has been chosen as the prototyping platform for the European Union’s FP7 FlexTiles 3D SoC project, placing it at the heart of leading research into self-adaptive, high-performance computing.

Headed by Thales Research & Technology, The … Read More → "Sundance launches SMT166 dual-FPGA development platform; powers EU’s FP7 FlexTiles 3D SoC project"

Yole said it, FLIR did it: FLIR announced the introduction of the first thermal imager

January 13, 2014

Lyon, France – January 13th, 2013 – Yole said it, FLIR did it! Several months after Yole Développement’s forecast, FLIR Systems, IR Imaging market leader, announced on January 7th the introduction of FLIR OneTM, the first thermal imager designed for smartphones.

According to Yole Développement’s report, “Uncooled Infrared Imaging Technology & Market Trends”, published in September 2013, smartphones are becoming a new business driver for the IR imaging market. Yole Développement’s analysts anticipated this market entry and plan a very significant growth in the next 5 years.

In … Read More → "Yole said it, FLIR did it: FLIR announced the introduction of the first thermal imager"

Cadence Incisive 13.2 Platform Sets New Standard for SoC Verification Performance and Productivity

January 13, 2014

SAN JOSE, Calif., Jan. 13, 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced a new version of the Incisive® functional verification platform, once again setting a new standard for overall verification performance and productivity. Addressing both intellectual property (IP) block-to-chip and system-on-chip (SoC) verification challenges, the Incisive 13.2 platform offers orders of magnitude faster performance with two new engines and additional automation features to speed SoC verification closure.

For IP block-to-chip verification, enhancements include:

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