WIXOM, Mich., Jan. 14, 2014 /PRNewswire/ — Acromag’s new XMC-6260 and XMC-6280 mezzanine modules provide a Read More → "Acromag’s New XMC modules interface 10-Gigabit Ethernet to PCI Express with ultra-fast TCP/IP offload engine"
Leuven, Belgium – Jan. 13, 2014 – Nanoelectronics research center imec and AlixPartners, a leading global business advisory firm, announced today that the two companies are co-developing a cost modeling solution to assess the cost of advanced semiconductor technology options. The work is aimed at assisting the semiconductor industry in improving the operational intelligence around costs of future technology nodes.
This modeling will assess the cost of various patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory – all topics with big impacts on the price-tag of future consumer electronics. Imec and AlixPartners will be … Read More → "Imec and AlixPartners to Develop Model Aimed at Lowering Costs of Advanced Semiconductor Technology"
January 13, 2014 – Mouser Electronics, Inc. has entered into an agreement with Read More → "Mouser Electronics Now Stocking Axiomtek, Member of Intel® Intelligent Systems Alliance"
Fremont, CA — Jan 13, 2014 / (http://www.myprgenie.com) — i2a Technologies announced today the completion of its wafer UBM expansion, which will more than double its UBM and bumping services from its Silicon Valley — US based facility. Previously, i2aTechnologies has offered both solder and Au bumping. However, because of a recent surge in demand for wafer UBM for Cu wire bonding as well as solder micro-bumping for flip chip, i2a Technologies has converted Au bumping to support … Read More → "i2a Technologies Increases Capacity to Meet Rising Orders for Wafer Bumping Services"
Chesham, UK – 13th January 2014. Sundance Multiprocessor Technology, a pioneer in scalable and modular computing modules for embedded solutions, has launched the SMT166 dual-FPGA platform for R&D into the use of large FPGAs for high-performance reconfigurable computing and large-scale embedded systems applications as well as system-on-chip (SoC) simulation. At the same time, Sundance has announced that the SMT166 has been chosen as the prototyping platform for the European Union’s FP7 FlexTiles 3D SoC project, placing it at the heart of leading research into self-adaptive, high-performance computing.
Headed by Thales Research & Technology, The … Read More → "Sundance launches SMT166 dual-FPGA development platform; powers EU’s FP7 FlexTiles 3D SoC project"
Lyon, France – January 13th, 2013 – Yole said it, FLIR did it! Several months after Yole Développement’s forecast, FLIR Systems, IR Imaging market leader, announced on January 7th the introduction of FLIR OneTM, the first thermal imager designed for smartphones.
According to Yole Développement’s report, “Uncooled Infrared Imaging Technology & Market Trends”, published in September 2013, smartphones are becoming a new business driver for the IR imaging market. Yole Développement’s analysts anticipated this market entry and plan a very significant growth in the next 5 years.
In … Read More → "Yole said it, FLIR did it: FLIR announced the introduction of the first thermal imager"
MILPITAS, CA – January 13, 2014 – Linear Technology announces the LTM4644 quad output step-down µModule® (micromodule) regulator configurable as a single (16A), dual (12A, 4A or 8A, 8 … Read More → "16A µModule Regulator Configurable as Quad, Triple, Dual or Single Output Powers FPGAs, ASICs & Microprocessors"
SAN JOSE, Calif., Jan. 13, 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced a new version of the Incisive® functional verification platform, once again setting a new standard for overall verification performance and productivity. Addressing both intellectual property (IP) block-to-chip and system-on-chip (SoC) verification challenges, the Incisive 13.2 platform offers orders of magnitude faster performance with two new engines and additional automation features to speed SoC verification closure.
For IP block-to-chip verification, enhancements include:
MILPITAS, Calif. – Jan. 13, 2014 – Greenvity Communications is now offering total turn-key solutions comprising system-on-chips (SoC), modules, software and mobile apps that enable any home device or Internet of Things (IoT) device to be smart and controllable for energy-saving and home and building automation purposes. At the core of these solutions are Greenvity’s patented Hybrii® SoCs, which integrateHomePlug® Green PHY™ powerline communication (PLC) and ZigBee® wireless for … Read More → "Greenvity introduces scalable IoT system solutions for smart LED lighting and home and building automation"
Geneva, January 13, 2014 – New dual-configuration Schottky silicon-carbide (SiC) diodes from STMicroelectronics are the first such devices in the industry with a voltage rating of 650V per diode in a choice of common-cathode or series configurations allowing use in interleaved or bridgeless power-factor correction (PFC) circuits.
ST is a leading innovator of SiC power semiconductors that have inherently higher energy efficiency and ruggedness compared to ordinary silicon alternatives. ST’s STPSC6/8/10TH13TI and STPSC8/12/16/20H065C devices[1] combine … Read More → "650V SiC Diodes from STMicroelectronics Offer Unique Dual Configurations for Increased Safety, Energy Efficiency, and Space Savings"
