News – Page 1703 – EEJournal

Semtech’s PCI Express® 3.0 PHY IP Platform is Fully Compliant and Included on PCI-SIG® Integrators List

January 15, 2014

CAMARILLO, Calif., January 15, 2014 — Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced its PCI Express® (PCIe®) 3.0 PHY IP, part of the Snowbush^® IP platform, successfully completed the rigorous testing of the PCI-SIG^® and is now on the PCIe 3.0 Integrators List.

The PCI-SIG integrators list maintains the gold standard by which companies developing PCI™ products make IP purchasing decisions.

PCI-SIG Compliance Workshop testing includes electrical, configuration and protocol testing against the PCI-SIG PCIe 3.0 golden test suites as well as interoperability testing with PCIe 3.0 products available in the … Read More → "Semtech’s PCI Express® 3.0 PHY IP Platform is Fully Compliant and Included on PCI-SIG® Integrators List"

Vicor Corporation Delivers First ChiP Power Modules

January 15, 2014

Andover, MA – January 15, 2014 – Vicor Corporation (NASDAQ: VICR) today unveiled the first module utilizing its Converter housed in Package (ChiP) power component platform. Vicor’s new ChiP bus converter modules (BCM®) supply 1.2 kW at 48 V with 98% peak efficiency and 1880 W/in3 power density. Breakthrough performance – 4X the density of competing solutions – enables efficient, high voltage DC distribution infrastructure in datacenter, telecom, and industrial applications.

Converter housed in Package (ChiP) Platform

Vicor’s ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect ( … Read More → "Vicor Corporation Delivers First ChiP Power Modules"

Mentor Graphics announces GENIVI 5.0 Compliant Linux-based Automotive Technology Platform to bring consumer electronics experiences to IVI systems

January 15, 2014

WILSONVILLE, Ore., January 15th, 2014 —Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of the latest release of its Mentor Embedded Automotive Technology Platform (ATP) for Linux based in-vehicle infotainment (IVI) system development. Automotive Tier One suppliers can speed the development of rich and responsive user interfaces or HMIs, similar to those seen in consumer electronics devices, with the new graphics development and optimization functionality added to this GENIVI 5.0 compliant release. In addition, by combining ATP with the recently announced Mentor® Embedded Hypervisor automotive OEMs can … Read More → "Mentor Graphics announces GENIVI 5.0 Compliant Linux-based Automotive Technology Platform to bring consumer electronics experiences to IVI systems"

Industry’s first discrete serial link aggregators support data rates up to 10 Gbps

January 15, 2014

DALLAS (Jan. 15, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first pair of 10-Gbps serial link aggregator ICs. The TLK10081 1- to 8-channel and TLK10022 dual-channel ICs allow system designers to reduce the number of gigabit serial links required for communications, video, imaging and many other end equipment. They aggregate and de-aggregate point-to-point serial data streams for transmission over backplanes, copper cables and optical links. With TI aggregator ICs, designers can avoid the costly and time-consuming development of custom aggregator IP for high-performance FPGAs or ASICs. Both … Read More → "Industry’s first discrete serial link aggregators support data rates up to 10 Gbps"

Toppan Printing to Launch New Production Line for FC-BGA Substrates

January 14, 2014

ROUND ROCK, Texas – January 14, 2014 – Toppan Printing Co., Ltd. today announced it plans to expand its flip-chip ball grid array (FC-BGA) substrate business by establishing a new production line at the company’s Niigata plant in (Shibata City, Niigata Prefecture, Japan). Slated for launch in late 2014, the new line will enable a 2.5x increase in FC-BGA substrate production capacity to meet rising demand for these thinner substrates associated with ongoing advancements in semiconductor technology. The company will invest approximately 10 Billion JPY in this new cutting-edge production line.

Coilcraft Launches New Design Tool App for Smart Phones

January 14, 2014

Cary, IL, USA – Coilcraft has announced its new Read More → "Coilcraft Launches New Design Tool App for Smart Phones"

Cadence C-to-Silicon Compiler Helps Renesas Realize Quick HEVC IP Development

January 14, 2014

SAN JOSE, Calif., January 14, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Renesas Electronics Corporation shortened its design and verification time by 70 percent by utilizing Cadence® C-to-Silicon Compiler to develop High Efficiency Video Coding (HEVC) intellectual property (IP), targeting consumer 4K video devices. This enabled the company to quickly offer their customers IP supporting this next-generation video codec.

Renesas established its own coding style and reduced code size by almost half with SystemC to … Read More → "Cadence C-to-Silicon Compiler Helps Renesas Realize Quick HEVC IP Development"

Avnet Electronics Marketing Launches Design Seminars for Embedded Applications Using Xilinx Zynq-7000 All Programmable SoCs

January 14, 2014

PHOENIX— January 14, 2014 — Avnet Electronics Marketing, an operating group of Read More → "Avnet Electronics Marketing Launches Design Seminars for Embedded Applications Using Xilinx Zynq-7000 All Programmable SoCs"

World’s Lowest Profile Active and Passive Antennas from Parsec Technologies Make Perfect Companions to Mini GPS Receiver from Telit and Achieve Best-in-Class Position Accuracy, Sensitivity

January 14, 2014

RALEIGH, N.C. – January 14, 2014 – Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services and Plano, Texas based Parsec Technologies, Incorporated, a global supplier of advanced amplifier technology communications products, solutions, and services, today announced that a combination of the companies’ technologies results in the world’s lowest profile companion solution for GPS receiver and antenna. For host devices able to accommodate higher volumetric symmetry, assembly of the components can be made to fit a 6x16x8 … Read More → "World’s Lowest Profile Active and Passive Antennas from Parsec Technologies Make Perfect Companions to Mini GPS Receiver from Telit and Achieve Best-in-Class Position Accuracy, Sensitivity"

Microchip Updates MPLAB® Device Blocks for Simulink® With Multi-Rate and Interrupt Capabilities; Makes Sophisticated Algorithm Design Easy

January 14, 2014

CHANDLER, Ariz., Jan. 14, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced Version 3.30 of its MPLAB^® Device Blocks for Simulink^®, which make it easy to develop complex designs using Microchip’s dsPIC30 and dsPIC33 digital signal controllers (DSCs). This software provides a set of user interfaces to MathWorks’ Simulink graphical environment for simulation and model-based design, where code for the application is generated, compiled … Read More → "Microchip Updates MPLAB® Device Blocks for Simulink® With Multi-Rate and Interrupt Capabilities; Makes Sophisticated Algorithm Design Easy"