ROUND ROCK, Texas – January 14, 2014 – Toppan Printing Co., Ltd. today announced it plans to expand its flip-chip ball grid array (FC-BGA) substrate business by establishing a new production line at the company’s Niigata plant in (Shibata City, Niigata Prefecture, Japan). Slated for launch in late 2014, the new line will enable a 2.5x increase in FC-BGA substrate production capacity to meet rising demand for these thinner substrates associated with ongoing advancements in semiconductor technology. The company will invest approximately 10 Billion JPY in this new cutting-edge production line.
As LSI devices shrink in size and grow in complexity, chipmakers’ need to increase speed, reduce power consumption and employ high-density interconnects (which enable more functionality in a smaller area) continues to escalate. FC-BGA substrates are typically thinner than conventional wire-bonded substrates, improving device size and weight, as well as allowing superior data transmission.
“Customer response to our precision FC-BGA offerings has been phenomenal,” said Akihiko Furuya, Engineering Team General Manager with Toppan Printing. “With the growth of wireless, automotive and gaming applications showing no signs of slowing, installing an additional production line is essential to ensuring we have ample capacity available to meet their needs.”
The new line will generate state-of-the-art coreless FC-BGA substrates utilizing advanced materials co-developed with Toppan R&D Laboratories. The omission of core material, together with fully rationalized, in-line manufacturing process, will allow the production line to run faster and more efficiently.
Toppan Printing estimates the company’s FC-BGA revenue will grow in the near future to 20 Billion JPY.
About Toppan Printing
Formed in 1900, Toppan Printing Co. Ltd. has recorded record growth and become a leader in the global printing industry. The company has used the know-how acquired through nearly a century of experience to expand the scope of its business operations in the fields of securities and cards, commercial printing, publications printing, packaging, high-performance components, decor materials, displays, and semiconductors. For more information, visit www.toppan.co.jp.
