Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
ROCKVILLE, MD., – February 10, 2026 – The explosive growth of IoT and smart home markets is driving demand for highly integrated, power-efficient connectivity solutions that simplify design and accelerate time-to-market. Addressing this need, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that Renesas Electronics Corporation has integrated Read More → "Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home"
Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance
MILPITAS, Calif. – February 10, 2026 – Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The Read More → "Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance"
Same Sky Adds Slide Potentiometers to Potentiometers Product Line
LAKE OSWEGO, Ore. — February 10, 2026 — Same Sky’s Motion and … Read More → "Same Sky Adds Slide Potentiometers to Potentiometers Product Line"
Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making
Chandler, Ariz., February 10, 2026 — A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks. Microchip Technology (Nasdaq: MCHP) has extended its edge AI offering with full-stack solutions that streamline development of production-ready applications using its microcontrollers (MCUs) and microprocessors (MPUs) – the devices that are located closest to the many sensors at the edge that gather sensor data, control motors, trigger alarms and actuators, and more.</ … Read More → "Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making"
TDK presents DC link capacitors for up to +125 °C in demanding automotive and industrial applications
February 10, 2026
TDK Corporation (TSE: 6762) announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable energy buffering even in tightly packed inverter environments. This performance is particularly relevant for xEV traction inverters, onboard chargers, and DC-DC converters, where elevated ambient temperatures and continuous ripple loads are common.
SEGGER Announces New, Competitively Priced 4-Channel Flasher ATE2
Monheim am Rhein, Germany — February 10, 2026
Samtec Achieves CMMC Level 2 Certification
New Albany, IN: Samtec, Inc., the service leader in the connector industry, has achieved Cybersecurity Maturity Model Certification (CMMC) Level 2 certification.
The U.S. Department of Defense (DoD) established the Cybersecurity Maturity Model Certification (CMMC) program to strengthen the security of the defense industrial base and protect sensitive information. The final rule making CMMC contractually enforceable was issued by the DoD in September 2025, with implementation starting on November 10, 2025.
Samtec achieving certified CMMC level 2 compliance further strengthens the company’s cybersecurity posture by confirming alignment with NIST SP 800-171. The certification confirms the implementation of 110 security … Read More → "Samtec Achieves CMMC Level 2 Certification"
Infineon launches its first isolated gate driver ICs with opto-emulator input supporting next-generation SiC applications
Munich, Germany – 05 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the EiceDRIVER™ 1ED301xMC12I product family, a series of high-performance isolated gate driver ICs with opto-emulator input. The devices are pin-compatible with existing opto-emulators and optocouplers, offering high common-mode transient immunity (CMTI), a robust output stage, and more precise timing than currently available solutions. This enables engineers to migrate to SiC technology without redesigning opto-based control schemes. The family is ideal for demanding applications where fast, reliable, and … Read More → "Infineon launches its first isolated gate driver ICs with opto-emulator input supporting next-generation SiC applications"
