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Vishay Intertechnology Introduces New AEC-Q200 Qualified, Glass Protected NTC Thermistor in 0402 Case Size

Device Combines High B25/85 Value of 4311 K With R25 Value of 100 kΩ and Tolerances Down to ± 1 %
December 10, 2025

MALVERN, Pa. — Dec. 10, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified, glass protected NTC thermistor in the widely used 0.5 mm by 0.5 mm by 1 mm 0402 case size. The Vishay BCcomponents NTCS0402E3104*XT combines a high beta (B25/85) value of 4311 K with an electrical resistance value at +25 °C (R25) of 100 kΩ.

Fully glass coated and protected, the thermistor released today offer tolerances down to ± 1 % for both its R25 and B25/85 values for precise temperature sensing, protection, and compensation over a wide temperature range of -55 °C to +150 °C. The device offers ESD withstand of > 25 … Read More → "Vishay Intertechnology Introduces New AEC-Q200 Qualified, Glass Protected NTC Thermistor in 0402 Case Size"

Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications

New Dual-Band Solutions Support 2.4GHz and 5GHz on Renesas’ Low-Power RA MCU Architecture
December 10, 2025

TOKYO, Japan, December 10, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.

Ultra-Low-Power Operation for Always-Connected IoT 

Today’s IoT devices must stay always connected to … Read More → "Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications"

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare
December 10, 2025

LEUVEN (Belgium), DECEMBER 9, 2025— At this year’s IEEE International Electron Devices Meeting (IEDM 2025), imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents the first successful wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography. Solid-state nanopores are emerging as powerful tools for molecular sensing but haven’t been commercialized yet. This proof of concept is a crucial step towards their cost-effective (mass) production. 

Solid-state nanopores are tiny … Read More → "Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography"

IAR platform scales embedded software development for Renesas RH850 with cloud-enabled, container-ready toolchains

December 10, 2025
December 9, 2025 – Uppsala, Sweden – IAR, a global leader in software solutions for embedded systems, has announced new enhancements to its development toolchain for Renesas RH850 microcontrollers (MCUs). The RH850 architecture, widely adopted in automotive applications, now benefits from modern development capabilities as part of the IAR embedded development platform, including cloud-enabled licensing, container support, and CI/CD integration.

The RH850 family is central to advanced automotive systems, powering applications such as electrification, ADAS, and safety-critical ECUs. With the latest updates, developers gain streamlined access to DevOps workflows, cross-platform … Read More → "IAR platform scales embedded software development for Renesas RH850 with cloud-enabled, container-ready toolchains"

EMASS and Semtech Collaborate on Low-Power Edge AI

Integration brings LoRaWAN® connected intelligence to battery-powered industrial IoT
December 9, 2025

LOS ANGELES (Dec. 9, 2025) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced a strategic collaboration with Semtech to bring low-power edge AI solutions integrated with LoRaWAN® connectivity to market. EMASS’s ECS-DoT AI-enabled system-on-chips (SoCs) integrate Semtech’s LoRa® transceivers, enabling long-range, battery-efficient intelligence for industrial, IoT, and other connected applications. The integration enables systems to process data locally, reduce network load, and deliver actionable insights in real time, even in power-constrained environments.

“Combining ECS-DoT’s on-device AI with Semtech’s LoRaWAN connectivity enables autonomous sensing in environments … Read More → "EMASS and Semtech Collaborate on Low-Power Edge AI"

Korea University Researchers Develop Ultrasensitive Method to Detect Low-Frequency Cancer Mutations

An engineered high-fidelity FnCas9 variant enables a low-cost, ultra-precise liquid biopsy method that depletes wild-type DNA before sequencing
December 9, 2025

MUTE-Seq is a new liquid-biopsy method powered by an engineered ultra-precise CRISPR enzyme, FnCas9-AF2, which can distinguish single-base mismatches across all sgRNA positions with near-zero off-target activity. By selectively removing wild-type DNA before sequencing, it boosts true mutant signals up to tens of times and enables detection as low as ~0.005% VAF. The technique improves MRD monitoring and early-stage cancer detection while avoiding the need for costly ultra-deep sequencing.

Liquid biopsy is increasingly recognized as a promising tool for cancer detection and treatment monitoring, yet its effectiveness is often limited by the extremely low levels of tumor-derived … Read More → "Korea University Researchers Develop Ultrasensitive Method to Detect Low-Frequency Cancer Mutations"

TDK unveils physical AI technologies that enhance devices and experiences — “In Everything, Better” at CES 2026

December 9, 2025

  • TDK showcases new brand identity with the tagline “In Everything, Better” across AI, Automotive, ICT, and Industrial/Energy at Booth #15803, Jan 6–9

  • Highlights demos including AI smart glasses, haptic VR gloves, ML platforms, and next-gen sensor technologies

  • Noboru Saito, President and CEO of TDK, joins a panel at CES with a focus on how AI is better connecting communities to run more effectively

December 9, 2025

TDK Corporation (TSE: 6762) announces … Read More → "TDK unveils physical AI technologies that enhance devices and experiences — “In Everything, Better” at CES 2026"

Marvell Announces Adoption of Its PCIe Retimers by Leading AI and Data Center Infrastructure Providers

Industry Leaders Deploy Marvell Alaska P PCIe 6 Retimers to Scale Next-generation Accelerated AI Infrastructure
December 9, 2025

SANTA CLARA, Calif. – December 9, 2025 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced industry adoption of the Marvell® Alaska® P PCIe retimer product line, which scales connections between AI accelerators, GPUs, XPUs, CPUs, SSDs, CXL devices and other components inside advanced data center systems. Marvell PCIe retimers enable low-power, high-speed and low-latency connectivity that scales within servers and … Read More → "Marvell Announces Adoption of Its PCIe Retimers by Leading AI and Data Center Infrastructure Providers"

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