News – Page 1686 – EEJournal

Eight-Channel Configurable 1A Buck DC/DCs for Multi-Rail Systems

November 19, 2012

MILPITAS, CA – November 19, 2012 – Linear Technology Corporation announces the LTC3375, a highly-integrated general-purpose power management solution for systems requiring multiple low voltage power supplies. The device features eight independent 1A channels with I²C control, flexible sequencing and fault monitoring in a compact QFN package. Each channel is a high efficiency synchronous step-down regulator with its own independent 2.25V to 5.5 … Read More → "Eight-Channel Configurable 1A Buck DC/DCs for Multi-Rail Systems"

Xilinx Demonstrates Zynq-7000 All Programmable SoCs for Industrial Automation Applications at SPS/IPC/DRIVES 2012

November 19, 2012

NUREMBERG, Nov. 19, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced it will demonstrate advanced industrial automation applications and technology based on itsZynq™-7000 All Programmable SoCs at SPS/IPC/DRIVES 2012 being held in Nuremberg, Germany, November 27-29, 2012.

Demonstrations in Xilinx’s booth, H6-200, will highlight how its Zynq-7000 All Programmable SoCs provide developers with solutions to … Read More → "Xilinx Demonstrates Zynq-7000 All Programmable SoCs for Industrial Automation Applications at SPS/IPC/DRIVES 2012"

Agilent Technologies Ships Newest EMPro Software Release for Analyzing 3-D Electromagnetic Effects

November 16, 2012

SANTA CLARA, Calif., Nov. 15, 2012 – Agilent Technologies Inc. (NYSE: A) today announced shipment of EMPro 2012 , its 3-D electromagnetic simulation software.

EMPro 2012 allows designers to more easily create 3-D models and analyze the electrical performance of packages, connectors, antennas, and other RF and high-speed components. It delivers a number of critical features for new and existing EMPro users, including:

Enhanced integration between EMPro and Advanced Design System, enabling users to save EMPro projects as … Read More → "Agilent Technologies Ships Newest EMPro Software Release for Analyzing 3-D Electromagnetic Effects"

Digital barometric pressure sensor BMP280 from Bosch Sensortec sets market reference

November 16, 2012

Best-suited for mobile applications such as indoor navigation, fitness, weather forecast
Provides atmospheric pressure with high accuracy
Most accurate altitude due to sensor data fusion software

Based on the huge success of the predecessor in the mobile phone market, Bosch Sensortec releases the new BMP280 digital barometric pressure sensor with improved performance and the industry’s smallest footprint. The BMP280 provides the absolute pressure value along with temperature measurements.

Barometric pressure sensors enable a host of new mobile applications from indoor navigation with floor level … Read More → "Digital barometric pressure sensor BMP280 from Bosch Sensortec sets market reference"

Newark element14’s “Dev Kit HQ” advances design with new easy-to-use selector

November 16, 2012

CHICAGO—Nov. 15, 2012 – Committed to speeding the adoption of new technology for engineers, Newark element14, a business of Premier Farnell (LSE:pfl) and the leading distributor of electronic components and engineering solutions in the Americas, today expanded its Dev Kit HQ with a ‘quick find’ online product selector designed to help engineers source the latest products available by manufacturer and technology application.

Within Newark element14’s Dev Kit HQ, engineers have a wide, in-stock selection of the most requested … Read More → "Newark element14’s “Dev Kit HQ” advances design with new easy-to-use selector"

Microsemi’s New SiC Schottky Diodes Improve Electrical Power Conversion Efficiency

November 16, 2012

ALISO VIEJO, Calif., Nov. 15, 2012 ? Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced a new family of 1200 volt (V) Schottky diodes based on silicon carbide (SiC) material and technology. The new diodes are targeted at a wide range of industrial applications including solar inverters, welding, plasma cutters, fast vehicle charging, oil exploration, and other high power, high voltage applications where power density, higher performance and reliability are important.

SiC offers a number of benefits compared to silicon material (Si) including a higher breakdown field … Read More → "Microsemi’s New SiC Schottky Diodes Improve Electrical Power Conversion Efficiency"

Creonic Joins Aldec UNITE™ Partner Programme and Accelerates the Development of its IP Cores with Aldec Linting and Advanced Verification Tools

November 16, 2012

Basingstoke, United Kingdom – November 13th, 2012 – Aldec Europe is pleased to announce that fast-growing, Germany-based IP provider Creonic GmbH, active in the field of wired and wireless communications, has joined Aldec’s UNITE™ Programme as an IP Partner.

As a member of the programme, Creonic guarantees its customers interoperability with Aldec’s EDA tools – most notably Active-HDL™, Riviera-PRO™ and Read More → "Creonic Joins Aldec UNITE™ Partner Programme and Accelerates the Development of its IP Cores with Aldec Linting and Advanced Verification Tools"

Laird Technologies Launches New Version of AZTEC™ Thermoelectric Module Simulation Software

November 15, 2012

St. Louis, Missouri, USA – November 13, 2012 – Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the launch of a new version of AZTEC™, a thermoelectric module (TEM) simulation software.

AZTEC™ allows users to specify a given set of input variables based on application attributes and the program will select the optimal TEM(s) for trial. The program also contains an analysis worksheet, which simulates how the TEM(s) will function under a specific set of operating conditions. Available only online, the … Read More → "Laird Technologies Launches New Version of AZTEC™ Thermoelectric Module Simulation Software"

Atmel Introduces Miniature LIN Family with Lowest Power Consumption for Automotive Switch Scan and Ambient Lighting Applications

November 15, 2012

Heilbronn, Germany, November 15, 2012 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, today announced the availability of a new LIN family for automotive switch scan applications and in-vehicle ambient lighting control. The new devices, Atmel’s ATA664151 and ATA664251, include a broad range of on-chip functionalities that competing solutions can achieve only by combining multiple devices.

Available in ultra-small packages measuring just 5x5mm and 7x7mm, these new LIN devices significantly reduce the end-application footprint, cutting down the overall cost and development time for automotive ambient lighting applications.
… Read More → "Atmel Introduces Miniature LIN Family with Lowest Power Consumption for Automotive Switch Scan and Ambient Lighting Applications"

Agilent Technologies and Notre Dame Team Up on MIMO Wireless Technologies

November 15, 2012

SANTA CLARA, Calif., and SOUTH BEND, Ind., Nov. 14, 2012 – Agilent Technologies Inc. (NYSE: A) and the Wireless Institute at the University of Notre Dame today announced that they will establish a collaborative research initiative aimed at developing the next generation of multiple-input, multiple-output wireless technologies.

MIMO technologies involve multiple antenna systems as well as advanced signal-processing techniques. Agilent and researchers at the Wireless Institute have established a core test facility with real-time, broadband signal generation and channel emulation for MIMO wireless systems with up to four transmitter antennas and four receiver antennas.

“We are extremely grateful … Read More → "Agilent Technologies and Notre Dame Team Up on MIMO Wireless Technologies"

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