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Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes

June 23, 2014

MOUNTAIN VIEW, Calif., June 23, 2014 /PRNewswire/ —

Highlights:

  • HAPS Connect Program enables prototypers to leverage proven solutions from hardware and service vendors for fast prototype bring-up
  • Network of approved third party hardware and service vendors provides daughter boards that are optimized for HAPS systems
  • The initial partners of the HAPS Connect Program include Back9 Design, eInfochips, Fidus, Gigafirm, hd Lab and Sarokal

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used … Read More → "Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes"

Xilinx and Pico Computing Announce Industry’s First 15Gb/s Hybrid Memory Cube Interface

June 23, 2014

SAN JOSE, Calif., June 23, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) and Pico Computing, Inc., both members of the Hybrid Memory Cube Consortium (HMCC), today announced the industry’s first 15Gb/s Hybrid Memory Cube (HMC) interface for All Programmable UltraScale™ devices. The Xilinx® UltraScale™ devices support the full HMC bandwidth of 4 lanes, comprised of 64 transceivers running up to 15Gb/s. Pico Computing’s HMC controller IP yields exceptionally high memory bandwidth and outstanding performance/watt in a small … Read More → "Xilinx and Pico Computing Announce Industry’s First 15Gb/s Hybrid Memory Cube Interface"

Long-life Paper-Thin Batteries from STMicroelectronics to Power Tomorrow’s Tiny Tech

June 23, 2014

Geneva, June 23, 2014 – STMicroelectronics has begun limited production of its EnFilm™ advanced rechargeable batteries that are less than 0.25mm thick. These paper-thin batteries free designers from the constraints of standard battery sizes and are ideal for use in powering the next generation of personal technology and Internet-of-Things (IoT) devices.

At just 220µm thick and measuring 25.7mm x 25.7mm, ST’s EFL700A39 EnFilm™ solid-state lithium thin-film battery is perfectly suited for use in ultra-low-profile devices. Surface-mount terminals allow direct attachment to the circuit board, which simplifies assembly and … Read More → "Long-life Paper-Thin Batteries from STMicroelectronics to Power Tomorrow’s Tiny Tech"

Hillcrest Labs Selected by Coolpad for Low Power Sensor Hub in New Smartphones

June 23, 2014

Rockville, MD — June 23, 2014 — Hillcrest Labs today announced that Coolpad Group (previously China Wireless), the seventh-largest global smartphone OEM[1], is using Hillcrest’s sensor hub software to enable always on sensing on Coolpad smartphones. Specifically, Hillcrest’s Freespace(R) software will run on Atmel’s low-power microcontroller solutions to provide high performance sensor fusion, gesture recognition, and always on context awareness capabilities, with dramatically lower power consumption and extended battery life. Additional details, such as smartphone models or pricing, were not disclosed.

“Coolpad … Read More → "Hillcrest Labs Selected by Coolpad for Low Power Sensor Hub in New Smartphones"

Altera and Cavium Deliver Pre-Verified Packet Classification Solution for Networking Appliances

June 23, 2014

San Jose, Calif., June 23, 2014—Altera Corporation (NASDAQ: ALTR) today announced its Interlaken Look-Aside intellectual property (IP) core has been tested and is compatible with Cavium’s NEURON Search™ Processor. This deployment-ready, pre-verified solution provides networking OEMs a low-latency, high-performance packet interface for use in networking appliances, including routers, switches, firewalls, and security storage. The Interlaken Look-Aside IP core is offered today as part of Altera’s portfolio of best-in-class IP cores which are optimized to provide superior performance, latency and area utilization when integrated within Altera’ … Read More → "Altera and Cavium Deliver Pre-Verified Packet Classification Solution for Networking Appliances"

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control

June 23, 2014

SAN JOSE, Calif., 23 Jun 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and QNX Software Systems, a subsidiary of BlackBerry and a world leader in software platforms for in-car electronics, today announced that QNX has ported its QNX® Acoustics for Active Noise Control (ANC) software to the Cadence® Tensilica® HiFi Audio/Voice digital signal processing (DSP) core. The Tensilica HiFi Audio/Voice DSP from Cadence is available immediately.

QNX Acoustics for ANC is a high-performance software solution … Read More → "Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control"

X-FAB to Exhibit 3-Axis Inertial Sensor Technology at Sensors Expo 2014

June 20, 2014

ERFURT, Germany – Jun. 20, 2014 –

Who

X-FAB, the leading analog/mixed-signal and MEMS foundry

What

Will exhibit its open-platform MEMS 3-axis inertial sensor process that is now available for volume manufacturing. This MEMS technology is suitable for a wide range of applications such as mobile devices, consumer goods, games and toys, automotive and robotics applications, and industrial and medical equipment that use 3D accelerometers or gyroscopes. The 3-axis inertial sensor technology comes with a complete set of design rules, … Read More → "X-FAB to Exhibit 3-Axis Inertial Sensor Technology at Sensors Expo 2014"

Detect road hazards with TI’s AFE sensor technology for automotive radar applications

June 20, 2014

DALLAS (June 19, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s fastest and lowest power baseband receiver analog front end (AFE) for ADAS applications.  The 4-channel AFE5401-Q1 is designed for the next generation of automotive radar applications where space constraints and increasing radar performance are driving a need for greater bandwidth, high integration and low power.

Delivering twice the sampling rate and bandwidth spectrum of existing solutions, the AFE5401-Q1 enables quick position and speed discrimination of even the fastest moving scenes. It also requires 30 percent less power and 20 percent less board space enabling a … Read More → "Detect road hazards with TI’s AFE sensor technology for automotive radar applications"

Davra Networks Introduces End-to-End Platform for IoT Offering Breakthrough Capabilities

June 19, 2014

Sunnyvale, Calif. – June 17, 2014 – In the midst of massive industry focus on the emerging and revolutionary Internet of Things (IoT) and M2M market, Davra Networks (www.davranetworks.com) has come out of stealth mode to launch an end-to-end platform offering new capabilities for system integrators and network VARs wishing to quickly and easily provide a wide range of useful solutions for this burgeoning market. With its RuBAN™ platform, Davra Networks covers everything from utilizing ‘fog computing’ to collect data from sensors to presenting it as usable business intelligence on the desktop. In … Read More → "Davra Networks Introduces End-to-End Platform for IoT Offering Breakthrough Capabilities"

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