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World’s First High-Dynamic-Range Audio Processor from STMicroelectronics Delivers Whispers and Screams with Amazing Clarity

Geneva, June 25, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and a pioneer in ICs for audio processing, has introduced the world’s first audio processor to incorporate the innovative HDR (High Dynamic Range) audio-signal acquisition technology. This highly integrated device combines all the leading-edge audio-processing technologies into a powerful, flexible, and easy-to-use solution.

Audio processors are key components of home systems such as active speakers, docking stations, and digital media players. The high level of integration offered by the new Read More → "World’s First High-Dynamic-Range Audio Processor from STMicroelectronics Delivers Whispers and Screams with Amazing Clarity"

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop

GRENOBLE, France – June 25, 2014 – CEA-Leti will highlight advanced technologies to meet future challenges for microelectronics designers and manufacturers at its annual LetiDay San Francisco workshop during SEMICON West in San Francisco, Calif., July 8-10.

In addition, Leti experts will present on lithography developments at the Semiconductor Technology Symposium and on silicon photonics at TechXPOT North on July 9.

This year, LetiDay San Francisco will focus on its technological platforms targeting future industry demands. The event will be from5-7 p.m. on July 8 in the W Hotel Great Room, 181 3rd St. 

Workshop topics … Read More → "Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop"

ARM and Sensor Platforms Deliver an Open Source Framework for Sensor Devices

Cambridge, UK, 1200BST, June 24, 2014 – ARM® and Sensor Platforms Inc. are extending their collaboration to the Open Sensor Platform (OSP) to simplify development of embedded sensor-based products utilizing ARM architecture. Contributions to the OSP framework will enable ARM CMSIS, the ARM RTX RTOS, and compatibility with the ARM mbed™ SDK and mbed platforms.

OSP provides a framework for the deployment of sensor fusion hubs for ARM-based solutions in mobile computing, wearables and IoT devices. This allows developers to rapidly create intelligent products enabled by standards-based software and hardware which are … Read More → "ARM and Sensor Platforms Deliver an Open Source Framework for Sensor Devices"

New Easy-to-Use STM32 Tools from STMicroelectronics Add Support for Mixed-Signal and Entry-Level Microcontrollers

Geneva, June 24, 2014 – New STM32 microcontroller design tools from STMicroelectronics bring the efficiency of the STM32Cube™ software platform, and the convenience of STM32Nucleo development boards, to projects targeting STM32 F3 mixed-signal and STM32 F0 entry-level devices.

For STM32 F3[1] and Read More → "New Easy-to-Use STM32 Tools from STMicroelectronics Add Support for Mixed-Signal and Entry-Level Microcontrollers"

Altium Releases Next Generation Vault for Collaboration and ECAD Design Data Management

Sydney, Australia – June 24, 2014 – Altium Limited <http://www.altium.com/> , a global leader in Smart System Design Automation, 3D PCB design (Altium Designer <http://products.live.altium.com/> ) and embedded software development (TASKING <http://www.tasking.com/> ), has announced the release of the next generation of Altium’ … Read More → "Altium Releases Next Generation Vault for Collaboration and ECAD Design Data Management"

Texas Instruments ushers in a new era of ultra-low power with new MSP430™ FRAM microcontrollers

DALLAS (June 24, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today announced its comprehensive ultra-low power FRAM microcontroller (MCU) platform with all the necessary hardware and software tools, and support for developers to reduce energy budgets, minimize product size and enable a battery-free world. TI’s new MSP430FR59x/69x FRAM MCU families with EnergyTrace++™ real-time power profiler and debugger range from 32 to 128 KB embedded FRAM. These MSP430™ MCUs are ideal for smart utility metering, wearable electronics, … Read More → "Texas Instruments ushers in a new era of ultra-low power with new MSP430™ FRAM microcontrollers"

Synopsys Announces Immediate Availability of Broad Portfolio of IP for TSMC 28HPC Process

MOUNTAIN VIEW, Calif., June 24, 2014 /PRNewswire/ —

Highlights:

  • Synopsys DesignWare® IP portfolio for TSMC 28HPC includes interface, analog, embedded memory and logic library IP
  • Production-ready IP portfolio enables fast time-to-market by leveraging compatibility with silicon-proven DesignWare IP for TSMC 28HPM process
  • Both the process and IP have been optimized for cost-sensitive mobile applications such as tablets, smartphones and LTE basebands as well as ultra low-power IoT applications

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing … Read More → "Synopsys Announces Immediate Availability of Broad Portfolio of IP for TSMC 28HPC Process"

IAR Systems provides support for Texas Instruments’ new EnergyTrace technology

Uppsala, Sweden—June 24, 2014—Today, IAR Systems® announces that early support for Texas Instruments new EnergyTrace technology is available in the world-leading development toolchain IAR Embedded Workbench for MSP430. By combining IAR Systems’ excellent Power Debugging technology with Texas Instruments’ EnergyTrace, developers are able to investigate and optimize power consumption and fully take advantage of the ultra-low-power capabilities of the MSP430 microcontrollers. 

Power Debugging provides software developers with information about how the software implementation in an embedded system affects system level power consumption. Because software … Read More → "IAR Systems provides support for Texas Instruments’ new EnergyTrace technology"

Imec Joins Graphene Flagship

To coincide with Graphene Week 2014, the Graphene Flagship is proud to announce that today one of the largest-ever European research initiatives is doubling in size. 66 new partners are being invited to join the consortium following the results of a €9 million competitive call. While most partners are universities and research institutes, the share of companies, mainly SMEs, involved is increasing. This shows the growing interest of economic actors in graphene. The partnership now includes more than 140 organisations from 23 countries. It is fully set to take ‘wonder material’ graphene and related layered materials from academic laboratories to everyday use.</ … Read More → "Imec Joins Graphene Flagship"

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