GRENOBLE, France – June 25, 2014 – CEA-Leti will highlight advanced technologies to meet future challenges for microelectronics designers and manufacturers at its annual LetiDay San Francisco workshop during SEMICON West in San Francisco, Calif., July 8-10.
In addition, Leti experts will present on lithography developments at the Semiconductor Technology Symposium and on silicon photonics at TechXPOT North on July 9.
This year, LetiDay San Francisco will focus on its technological platforms targeting future industry demands. The event will be from5-7 p.m. on July 8 in the W Hotel Great Room, 181 3rd St.
Workshop topics include:
- “CEA-Leti, a unique set of technical platforms and expertise to address future industrial challenges”. Leti CEO Laurent Malier
- “M3D, a disruptive approach for further scaling”. Olivier Faynot, Devices Department Director
- “New Non-Volatile Memory Technologies”. Luca Perniola, Advanced Memory Technology Laboratory Manager
- “Generic MEMS Platform”. Philippe Robert, MEMS Department Director
- “Cost-effective lithography solutions for the future”. Laurent Pain, Lithography Laboratory Manager, and
- “Wafer bonding solutions for new applications”. Chrystel Deguet, Surface and Interfaces Department Director
Leti presentations:
- Semiconductor Technology Symposium, 2:15-2:35 p.m., July 9, Moscone North, Hall E, Room 131. Leti Lithography Program Manager Serge Tedesco will present at the session on “Readiness of Advanced Lithography Technologies for HVM.”His topic is “Leti Lithography Programs Toward Cost-effective Solutions for 1X Nodes.”
- TechXPOT North, 11:50-12:10 p.m., July 9. Leti Vice President of Strategic Partnerships Hughes Metras will present at the session on “Bringing Silicon Photonics to Market”. His topic is “Scaling the Silicon Photonics Toolbox for Optical Communications with Denser Integration Requirements.”
Leti will be exhibiting during Semicon West at booth 2028, South Hall, European Pavilion.
About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit www.leti.fr for more information.
