News – Page 1658 – EEJournal

Nordic flagship Bluetooth Smart protocol stack enables sophisticated Bluetooth Smart wearable hub networks with wireless sensors that don’t need smartphones

July 3, 2014

Oslo, Norway – July 3, 2014 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the launch of its most advanced, feature-rich Bluetooth® Smart (formerly known as Bluetooth low energy) protocol stack to date – the S130 SoftDevice – that allows the development of Nordic nRF51 Series SoC-based advanced wearable Bluetooth Smart hub network topologies such as smart watches with peripheral wireless sensors that don’t always need a smartphone present to operate.

The S130 SoftDevice is a Bluetooth v4.1 compliant protocol stack and includes all … Read More → "Nordic flagship Bluetooth Smart protocol stack enables sophisticated Bluetooth Smart wearable hub networks with wireless sensors that don’t need smartphones"

4DSP Delivers Complete Data Acquisition, Signal Processing and Storage Solution in the XMC Form Factor

July 3, 2014

Austin, TX – 4DSP’s new FM788 is a FPGA-based COTS card designed to deliver unparalleled performance for a variety of applications, including beamforming, direction finding, RADAR, and satellite communications. This XMC module is based on Xilinx’s Virtex-7 and features eight 16-bit A/D channels running up to 250Msps each. Its design provides the largest channel count in this frequency range and the most available onboard … Read More → "4DSP Delivers Complete Data Acquisition, Signal Processing and Storage Solution in the XMC Form Factor"

Highly Secure Advantech AIMB-503 MicroATX with Rich I/O for ATMs and KIOSKs

July 2, 2014

July 1, 2014, Irvine, CA – Advantech, the embedded platform and integration services provider today introduced AIMB-503, a new industrial-grade MicroATX motherboard with 4th generation Intel^®Core™ i processor, providing better graphic and computing performance. Equipped with abundant I/O, AIMB-503 also enables extended connectivity to handle multiple peripherals. Integrated with the newRead More → "Highly Secure Advantech AIMB-503 MicroATX with Rich I/O for ATMs and KIOSKs"

GE’s Compact DC-DC Converters Provide Board Designers with a Single Power Module to Provide Bipolar Dual Output Voltages

July 2, 2014

Bipolar Dual Output and Reduced Footprint Provides Board Designers with a Compact Power Option
Modules Equipped with Built-in Current, Voltage and Temperature Protection

DALLAS—July 2, 2014—GE’s Critical Power business(NYSE: GE) has launched its new SHHN000A3CL isolated DC-DC converters, providing board designers with a bipolar dual-output module in a compact (1 … Read More → "GE’s Compact DC-DC Converters Provide Board Designers with a Single Power Module to Provide Bipolar Dual Output Voltages"

LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor

July 1, 2014

SAN JOSE, Calif., USA, and STAINES UPON THAMES, UK, 24 June 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and NextG-Com, an expert in embedded software products and services for LTE, M2M and satellite communications, today announced that NextG-Com has completed its port of the ALPS520 LTE Layer 2 and 3 protocol to the Cadence® Tensilica® ConnX BSP3 processor core. This combined hardware/software solution can be used to speed the design of LTE modems for cellular phones, tablets and other end-user equipment.

The NextG-Com ALPS520 LTE protocol stack implements Layers 2 … Read More → "LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor"

Molex Backplane Pin Map Configurator Makes Designing Custom Products Easy

July 1, 2014

LISLE, IL – June 24, 2014 – Molex Incorporated recently launched a new online tool for backplane product design. TheBackplane Pin Map Configurator guides users through a series of inputs to identify backplane parameters and quickly generate a pin map for their backplane application. Available free … Read More → "Molex Backplane Pin Map Configurator Makes Designing Custom Products Easy"

Synapse Design tapes out 33 SOCs in 12 months

July 1, 2014

San Jose, Calif. – June 25, 2014 – Synapse Design today announced that, together with its top tier semiconductor and systems customers, the Company has taped out 33 SOCs in 12 months and 20 SOCs in the first six months of 2014. These SOCs address applications in the automotive, multimedia, mobile, data storage, networking and Internet-of-Things (IoT) markets.

The 33^rd SOC is a 200 sq. mm die developed for the networking market. This complex SOC design includes more than 30 blocks; digital, analog and mixed signal content; … Read More → "Synapse Design tapes out 33 SOCs in 12 months"

Space-qualified 3U CompactPCI SBC from Aitech Ready for Orbit

July 1, 2014

Chatsworth, Calif. June 2014 – Aitech Defense Systems Inc., a pioneer in true embedded and mission critical computing technologies for environmentally-demanding, mission-critical applications, announces that the SP0 3U CompactPCI SBC has passed final 100 kRad (Si) testing for use in low (LEO) and medium (MEO) orbits and has demonstrated high confidence for geostationary orbits (GEO).

The SP0 was tested at the world-renowned Indiana University Cyclotron Facility (IUCF) that provides proton … Read More → "Space-qualified 3U CompactPCI SBC from Aitech Ready for Orbit"

World-first miniaturized fiber-optical monitoring system embedded in composite material

July 1, 2014

Leuven (Belgium) — June 30, 2014 — Nanoelectronics research center imec, Ghent University, and their partners in the European FP7 project SMARTFIBER have demonstrated the world’s first miniaturized fiber-optical sensor system than can be fully embedded in a composite material. This achievement paves the way toward smart composites that enable continued and automatic monitoring of the structural health of the composite material in -for example- tidal blades, wind turbines, airplanes (fuselage, wings, …) or marine structures (masts, antennas, hulls of sail yachts, navy ships, propellers).

The sensor system was assembled by Optocap on an electronic board designed by Xenics. The optical … Read More → "World-first miniaturized fiber-optical monitoring system embedded in composite material"

Agilent Technologies Introduces ADS DDR4 Compliance Test Bench for Solving the Simulation-Measurement Correlation Challenge

July 1, 2014

SANTA CLARA, Calif., June 30, 2014 – Agilent Technologies Inc. (NYSE: A) today introduced Advanced Design System DDR4 Compliance Test Bench, which enables a complete workflow for DDR4 engineers from simulation of a candidate design through measurement of the finished prototype. The solution is ideal for semiconductor companies developing DDR controller IP; those developing DRAM chips and DIMMs; and OEMs integrating the controller and DIMM into a system using PCB technology.

The compliance test bench is available as an add-on to Read More → "Agilent Technologies Introduces ADS DDR4 Compliance Test Bench for Solving the Simulation-Measurement Correlation Challenge"