industry news
Subscribe Now

Nordic flagship Bluetooth Smart protocol stack enables sophisticated Bluetooth Smart wearable hub networks with wireless sensors that don’t need smartphones

Oslo, Norway – July 3, 2014 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the launch of its most advanced, feature-rich Bluetooth® Smart (formerly known as Bluetooth low energy) protocol stack to date – the S130 SoftDevice – that allows the development of Nordic nRF51 Series SoC-based advanced wearable Bluetooth Smart hub network topologies such as smart watches with peripheral wireless sensors that don’t always need a smartphone present to operate.

The S130 SoftDevice is a Bluetooth v4.1 compliant protocol stack and includes all Bluetooth Smart protocol layers up to and including GATT/GAP. It supports multi-link central, peripheral, observer and broadcaster roles, GATT server and client, and event-driven, asynchronous and thread safe GATT/GAP and L2CAP APIs. The S130’s ability to support concurrent multi-link central and peripheral roles makes it an ideal choice for Bluetooth Smarthubs that are not smartphones or tablets.

Other S130 SoftDevice features include an Over-The-Air Device Firmware Upgrade (OTA-DFU) capability that leverages the Nordic nRF51 Series SoCs’ flash architecture for in-the-field product firmware updates.

A SoftDevice is Nordic’s self-contained software stack for nRF51 Series SoCs that incorporates a unique separation of RF protocol and application code. Since Nordic’s nRF51 Series’ launch in June 2012, SoftDevice performance has been increasingly enhanced by successive revisions. The SoftDevice is a key element of the unique software architecture of Nordic’s multiple award-winning nRF51 Series SoCs.

Employing an architecture that cleanly separates the Bluetooth Smart, ANT or 2.4GHZ proprietary SoftDevice from the developer’s application code removes the need for the engineer to struggle with integration of their code as part of a vendor-imposed application development framework. This separation ensures the stack and application software operate independently, but communicate when necessary via event-driven APIs. 

“The S130 protocol stack is all about advanced Bluetooth Smart connectivity with our nRF51 Series SoCs,” comments Thomas Embla Bonnerud, Director of Product Management at Nordic Semiconductor. “It supports all Bluetooth Smart roles in combination with the relaxed role restriction features in Bluetooth 4.1 enabling, for example, a Bluetooth Smart device to be connected to a smartphone and multiple sensors at the same time. We believe support for complex network topologies is a key enabling technology for our nRF51 Series SoCs for the next wave of wearable devices and emerging applications like home and industrial automation.”

S130 alpha release is available now, with full production release scheduled for Q4 this year.

The S130 is delivered as a SoftDevice for Nordic’s nRF51 Series ICs and as such it is a pre-compiled binary with no link time dependencies to application code, and will be made available as a download for customers.

About Nordic Semiconductor ASA

About Bluetooth low energy, Bluetooth Smart, and Bluetooth Smart Ready

About nRF51822

About nRF51 Series 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
11,339 views