News – Page 1628 – EEJournal

STMicroelectronics Reveals Best-In-Class Devices with the Highest Available Qualification for the Worldwide Aerospace Market

June 26, 2014

Geneva, June 26, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance components for space applications, has extended its portfolio of radiation-hardened (rad-hard) devices by adding a series of LVDS^{^[1]} drivers, receivers, and multiplexers carrying the US 300krad QML-V qualification^{^[2]}.

ST’s new rad-hard devices exceed … Read More → "STMicroelectronics Reveals Best-In-Class Devices with the Highest Available Qualification for the Worldwide Aerospace Market"

Agilent Technologies’ New Multi-Channel PXI-based Test Solution Speeds LTE/LTE-Advanced Waveform Creation and Analysis

June 26, 2014

SANTA CLARA, Calif., June 25, 2014 – Agilent Technologies Inc. (NYSE: A) today announced the LTE/LTE-Advanced multi-channel PXI-based test solution, which accelerates the setup of multi-channel test system configurations and enables engineers to gain deeper insight into complex carrier aggregation and spatial multiplexing MIMO designs.

Designing and characterizing components and RF subsystems for base stations, microcells, picocells, repeaters and mobile devices is becoming more complex as multi-antenna designs require increasingly complex multi-channel test configurations. Agilent’s new test solution provides tools to generate complex LTE/LTE-A multi-channel/MIMO … Read More → "Agilent Technologies’ New Multi-Channel PXI-based Test Solution Speeds LTE/LTE-Advanced Waveform Creation and Analysis"

eSilicon GDSII quoting portal now available

June 26, 2014

SAN JOSE, Calif. — June 26, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the production release of its GDSII portal, which provides fast, automated quoting for TSMC technologies. Building on the successful introduction of its instant online quoting system for multi-project wafer (MPW) shuttle services, eSilicon’s GDSII quoting portal offers the ability to fully specify the manufacturing process requirements for submission of a GDSII design to … Read More → "eSilicon GDSII quoting portal now available"

CEA-Leti and CORIMA Team up on Force Sensors Integrated in Cycle Wheels to Measure Rider Power Output

June 26, 2014

GRENOBLE, France – June 26, 2014 – CEA-Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

While there are a variety of ways to measure this key parameter for serious riders, they typically use sensors affixed to pedals or the rear-wheel axis. The compact, ultra-light force sensor developed in this collaboration will be lighter, more precise and more easily integrated in the rear wheel, assuring reliable data in all types of weather and on all … Read More → "CEA-Leti and CORIMA Team up on Force Sensors Integrated in Cycle Wheels to Measure Rider Power Output"

Altium and In-Circuit Design partner to provide new extensions for Altium Designer to respond to challenges in high-speed design

June 26, 2014

Sydney, Australia – June 26, 2014 – Altium Limited <http://www.altium.com/> , a global leader in Smart System Design Automation, 3D PCB design (Altium Designer <http://products.live.altium.com/> ) and embedded software development (TASKING <http://www.tasking.com/> ), in cooperation with Australian based In-Circuit Design Pty Ltd (ICD), … Read More → "Altium and In-Circuit Design partner to provide new extensions for Altium Designer to respond to challenges in high-speed design"

RGS Debuts Digital Learning System for the 21st Century Classroom

June 26, 2014

ISTE 2014

PHOENIX— June 26, 2014 — RGS, a business unit of Avnet, Inc. (NYSE: … Read More → "RGS Debuts Digital Learning System for the 21st Century Classroom"

Microchip Releases the RN4020 Bluetooth® Smart Module

June 25, 2014

CHANDLER, Ariz., June 24, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo its first Bluetooth^® 4.1 Low Energy module. The RN4020 builds on the Company’s deep Bluetooth Classic experience and carries both worldwide regulatory certifications and is Bluetooth Special Interest Group (SIG) certified. The integrated Bluetooth Low Energy (BTLE) stack and onboard support for the common SIG low-energy profiles speeds time to market while ensuring Bluetooth compatibility, eliminating expensive certification costs and reducing … Read More → "Microchip Releases the RN4020 Bluetooth® Smart Module"

Ultra compact 15 Watt AC-DC power supply targets medical applications

June 25, 2014

XP Power today announced the EML15 series of 15 Watt single output AC-DC power supplies suitable for use in medical equipment. Complying with 3rd edition EN60601-1, ES60601-1, CSA-C22.2 No. 60601-1, IEC60601-1 medical safety standards, this extremely compact power supply is believed to be the smallest device at this power rating available in the industry. The supply provides two means of patient protection (MOPP) between primary and secondary. Measuring just 2.44 x 1.21 x 0.95 inches (62.0 x 30.7 x 24.4 mm) for the open-frame pcb mount version, the EML15 occupies very little board space and also offers a very high power density … Read More → "Ultra compact 15 Watt AC-DC power supply targets medical applications"

Agilent Technologies’ NFC Forum-Approved Test System for LLCP and SNEP Selected by AT4 wireless

June 25, 2014

SANTA CLARA, Calif., June 23, 2014 – Agilent Technologies Inc. (NYSE: A) today announced that AT4 wireless authorized test lab will useAgilent’s T3111S NFC Conformance Test System to test NFC Forum LLCP and SNEP protocols.

“We are delighted that AT4 wireless will use the Agilent T3111S to extend its range of testing services to include LLCP and SNEP,” said Joe DePond, vice president and general manager … Read More → "Agilent Technologies’ NFC Forum-Approved Test System for LLCP and SNEP Selected by AT4 wireless"

First 7-channel, NMOS low-side driver replaces Darlington transistor arrays in high-voltage systems

June 25, 2014

DALLAS (June 25, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first seven-channel, NMOS low-side driver, replacing standard Darlington transistor arrays with a power-efficient, drop-in compatible integrated circuit (IC). The TPL7407L replaces half of the transistor arrays required to drive high current loads, providing a new option for high voltage systems that previously required a number of transistor arrays or a motor driver. Reducing power by 40 percent, this new device efficiently drives the LED matrix, relay … Read More → "First 7-channel, NMOS low-side driver replaces Darlington transistor arrays in high-voltage systems"