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Intercept Technology Announces Major New Pantheon Layout Software Release

Atlanta, GA – March 5, 2013 – Intercept Technology, Inc., a leader in EDA engineering and layout applications, today announces a major new enhancement release of its Pantheon PCB layout software, which includes specialized RF and Hybrid design flows. Following version 7’s award-winning debut*, Intercept continues to make great strides forward with its latest version, 7.0_02C.

“With Pantheon’s new user interface reaching maturity, the engineering team is now making great strides in core functionality,” said John Towers, Engineering Manager. “Our focus this year is to increase usability for all technology areas while continuing to forge new ground … Read More → "Intercept Technology Announces Major New Pantheon Layout Software Release"

TI introduces industry’s first 48-V constant on-time synchronous step-down converter for automotive and industrial applications

DALLAS (Mar. 5, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced three new 48-V synchronous buck regulators with integrated high-side and low-side MOSFETs for single- and multi-output power supplies. The 650-mA LM25017, 300-mA LM25018 and 100-mA LM25019 Fly-Buck™ converters feature constant on-time (COT) control architecture that reduces board space by up to 40 percent when compared with traditional designs that require multiple DC-DC converters. Used in conjunction with TI’s award-winning Read More → "TI introduces industry’s first 48-V constant on-time synchronous step-down converter for automotive and industrial applications"

Tanner EDA Provides Leap in Design Team Productivity with Release v16 of Widely-installed HiPer Silicon Full-flow Analog, Mixed-signal Design Suite

MONROVIA, California – March 5, 2013 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs), has released version 16 of the company’s HiPer Silicon full-flow design suite, offering designers a complete analog and mixed-signal design flow from digital (HDL) and analog (Spice, Verilog-A) electrical design and simulation, through synthesis to physical layout and verification. HiPer Silicon v16 contains new features and functionality, including:

New capabilities for back-end (layout):

Brighter, clearer images from mobile phone cameras as ams introduces intelligent flash LED driver

Unterpremstaetten, Austria (March 4, 2013) — ams AG (SIX: AMS), a leading worldwide designer and manufacturer of high-performance analog ICs for consumer & communications, industrial  & medical and automotive applications, today introduced a new intelligent LED driver for mobile phone cameras that maximizes the brightness of the flash without causing the phone’s battery to fall below its minimum operating voltage.

The AS3649 LED driver uses an innovative “diagnostic pulse” – a burst of controlled high current lasting a few milliseconds – immediately before every flash operation. During this pulse the device measures the momentary voltage across the terminals of the phone’ … Read More → "Brighter, clearer images from mobile phone cameras as ams introduces intelligent flash LED driver"

Fairchild Semiconductor’s BLDC/PMSM Motor Controller with Parallel Processing Cores Provides Simple Conversion of AC Motor Control Designs

SAN JOSE, Calif. – March 4, 2013 – Motor control application designers are now moving away from the traditional universal or AC motor design to a more sophisticated brushless DC (BLDC) motor or permanent magnet synchronous motor (PMSM) design. However, choosing either of these methods can be challenging if the designer has limited access to advanced, complex motor control algorithms. This can lead to significant spending of research and development resources and longer design times.

To help designers with these cost and software burdens, Fairchild Semiconductor (NYSE: FCS) developed the Read More → "Fairchild Semiconductor’s BLDC/PMSM Motor Controller with Parallel Processing Cores Provides Simple Conversion of AC Motor Control Designs"

InvenSense® Introduces the World’s Lowest Power 9-Axis MotionTracking Device

SUNNYVALE, California, February 25, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ devices, announced its third generation 9-axis MotionTracking device with the lowest power and best-in-class performance. The world’s smallest 9-axis solution, the MPU-9350 combines an accelerometer, gyroscope, and electronic compass into a 3x3x1mm QFN package. At 6.7mW, the MPU-9350 has 28% lower power consumption than its predecessor and comes with the industry’s only integrated Digital Motion Processor™ (DMP). The DMP, together with an embedded FIFO, offloads high-frequency motion … Read More → "InvenSense® Introduces the World’s Lowest Power 9-Axis MotionTracking Device"

DigitalOptics Corporation Launches mems|cam

SAN JOSE, Calif.– DigitalOptics Corporation (DigitalOptics or DOCTM), a wholly owned subsidiary of Tessera Technologies, Inc. (TSRA), today introduced mems|cam, a microelectromechanical system (MEMS) autofocus camera module for smartphones.

The mems|cam modules harness the performance advantages of MEMS technology to deliver dramatically improved speed, power, and precision in smartphone cameras. DigitalOptics has demonstrated that mems|camoffers significantly faster autofocus, at 1 percent of the power consumption of traditional voice coil motor (VCM) autofocus technology. DOC’s mems|cam components provide micron-level … Read More → "DigitalOptics Corporation Launches mems|cam"

InvenSense® Unveils World’s Lowest Profile 3-Axis Gyroscope for MotionTracking Applications

SUNNYVALE, California, February 25, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ devices, announced the world’s lowest profile and lowest power 3-axis MEMS gyroscope designed for Smartphones, Tablets, Smart TVs, and Gaming devices. The trend toward thinner devices in the consumer electronics market has created demand for components with a maximum height of 0.8mm to allow flexible board placement. Low profile components also offer the advantage of allowing for thicker batteries with extended operating time. The ITG-3501, with an industry first 0.75 … Read More → "InvenSense® Unveils World’s Lowest Profile 3-Axis Gyroscope for MotionTracking Applications"

Xilinx Solutions Target Growing ASIC and ASSP Gaps for Next-Generation Smarter Networks and Data Centers

SAN JOSE, Calif., March 4, 2013 – Xilinx, Inc. (NASDAQ: XLNX) today announced

solutions for significant and growing gaps in ASIC and ASSP offerings targeting next-generation smarter networks and data centers.  In order to fill these gaps, Xilinx has been acquiring and developing a SmartCORE™ IP portfolio and a critical mass of application specialists and services that leverage Xilinx’s All Programmable FPGAs, SoCs, and 3D ICs.  These solutions target customers who need to rapidly create, differentiate, and evolve intelligent, fabric-centric data centers and software defined networks (SDN), ‘many-band’ self-organizing networks (SON) for LTE and … Read More → "Xilinx Solutions Target Growing ASIC and ASSP Gaps for Next-Generation Smarter Networks and Data Centers"

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