News – Page 1571 – EEJournal

NASA Awards GrammaTech Contract for Eclipse Specification Editing and Discovery Tool for C/C++

July 9, 2013

ITHACA, NY–July 9, 2013–GrammaTech, Inc., a leading software developer specializing in software assurance tools and cybersecurity solutions, today announced that the company has received an award from NASA to prototype a specification editing and discovery tool (SPEEDY) for C/C++ code analysis.

Packaged as a plug-in to the Eclipse integrated development environment (IDE), the tool will assist software developers in modular formal verification tasks. SPEEDY will provide automated suggestions of specifications for given contexts, with user interface features aiding developers in generating, … Read More → "NASA Awards GrammaTech Contract for Eclipse Specification Editing and Discovery Tool for C/C++"

KLA-Tencor Announces New Additions to its Defect Inspection and Review Portfolio

July 9, 2013

MILPITAS, Calif., July 8, 2013—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced the new 2910 Series optical wafer defect inspection platform withNanoPoint^TM technology and the new eDR^TM-7100 electron-beam wafer defect review system. Meeting IC manufacturers’ need for accelerated defect sourcing on advanced devices, these two tools combine increased speed with seamless connectivity to quickly find and identify defects that inhibit yield and reliability. The 2910 Series’ improved defect capture and the eDR-7100’s enhanced review … Read More → "KLA-Tencor Announces New Additions to its Defect Inspection and Review Portfolio"

QA?C and QA?C++ certified by SGS-TÜV SAAR to highest safety levels

July 8, 2013

HERSHAM, UK, 8 July 2013 / — PRQA | Programming Research, a global leader in static analysis, announces that QA?C 8.0 and QA?C++ 3.0, with MISRA Compliance Modules have been certified by SGS-TÜV SAAR as “usable in the development of safety related software” for the key safety critical standards, IEC 61508, ISO 26262, EN 50128, IEC 60880 and IEC 63204.

“Developers working in the most extreme safety-critical applications need confidence in their tools,” said Evgueni Kolossov, PRQA’s R&D Director. “Certification provides evidence for them to have this … Read More → "QA?C and QA?C++ certified by SGS-TÜV SAAR to highest safety levels"

Avnet, Inc. Announces Intent to Acquire European Distributor MSC Investoren GmbH

July 8, 2013

PHOENIX— July 8, 2013 — Avnet, Inc. (NYSE:Read More → "Avnet, Inc. Announces Intent to Acquire European Distributor MSC Investoren GmbH"

ProTek Devices Intros its First Family of Overcurrent Electronics Chip Fuses

July 8, 2013

TEMPE, Ariz. – July 8, 2013 – ProTek Devices today introduced a family of overcurrent electronics chip fuses that add to the company’s extensive availability of overvoltage product lines. Now, the company can provide electronics design manufacturers (EDM) with a single source for advanced and cost-effective circuit protection solutions. The new overcurrent chip fuses cover a plethora of applications such as telecommunications, computing, consumer electronics and more.

The new surface mount device (SMD) overcurrent chip fuses consist of a variety of types and sizes. The part numbers for the 0603 package are PF0603F, PF0603S and PF0603H. The PF0603 … Read More → "ProTek Devices Intros its First Family of Overcurrent Electronics Chip Fuses"

Mouser signs global distribution agreement with Plessey

July 8, 2013

Plymouth, ENGLAND – 8 July 2013 – Mouser Electronics, Inc.has signed a global distribution agreement for Plessey’s complete range of innovative products including Plessey’s award winning products such as the EPIC™ sensor and MAGIC™ GaN LEDs.

“Mouser is pleased to partner with Plessey to distribute their innovative semiconductor products to our customers across the globe,” stated Mike Scott, Mouser Vice President of Semiconductors. “We always aim to provide design engineers with the latest technologies so that they can create state of the art solutions. Plessey has built its … Read More → "Mouser signs global distribution agreement with Plessey"

Applied Materials Unveils New Epitaxy Technology for High-Performance Transistors

July 8, 2013

SANTA CLARA, Calif., July 8, 2012 – Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura^® RP Epi system. This capability supports the industry’s move to extend epi deposition from PMOS transistors to NMOStransistors at the 20nm node, enabling chipmakers to build faster devices and deliver … Read More → "Applied Materials Unveils New Epitaxy Technology for High-Performance Transistors"

STMicroelectronics Sweeps Away Design Barriers with New STM32 Value-Line Microcontrollers Delivering 32 bits at 32 cents

July 8, 2013

Geneva, July 8, 2013 – Priced as low as $0.32 for high-volume orders, the latest STM32F030 Value Line microcontrollers from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, are ideal for lower-budget projects while offering access to a full portfolio of hardware- and software-compatible 32-bit microcontrollersideally suited for performance improvements and product extensions.

The new STM32F030 Value Line is based on the ARM^® Cortex™-M0 core … Read More → "STMicroelectronics Sweeps Away Design Barriers with New STM32 Value-Line Microcontrollers Delivering 32 bits at 32 cents"

TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform

July 8, 2013

HIGHLIGHTS:

TSMC to create and deliver native SKILL®-based PDKs in support of the Cadence® Virtuoso® platform to provide customers with the best user experience and highest level of accuracy
World’s leading foundry deploys Virtuoso platform for custom design needs in advanced nodes, including 16-nanometer FinFET designs
Key tools include Virtuoso Schematic Editor, Analog Design Environment, Virtuoso Layout Suite XL and advanced GXL technologies

SAN JOSE, Calif., July 8, 2013–In an effort to address … Read More → "TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform"

Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging

July 8, 2013

SEMICON WEST, San Francisco (USA) – July 8, 2013 – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

“This move is a natural and strategic step for … Read More → "Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging"

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