News – Page 1569 – EEJournal

Over 15,000 Microsemi Space Products Deployed on 10-year-long Rosetta Spacecraft Mission

November 19, 2014

ALISO VIEJO, Calif.—Nov. 18, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today extends its congratulations to the European Space Agency (ESA), NASA and their partners for the success in the Rosetta Spacecraft reaching its mission objective to examine Comet 67P/Churyumov-Gerasimenko.

Over 15,000 of Microsemi’s innovative and highly reliable space products such as FPGAs, diodes, transistors and integrated circuits (ICs) spanning multiple technologies are used in mission critical applications during the 10 year, four billion mile mission and continue to support the mission as it conducts a wide … Read More → "Over 15,000 Microsemi Space Products Deployed on 10-year-long Rosetta Spacecraft Mission"

Holst Centre, imec and CARTAMUNDI Join forces to Create the Near Field Communication Chip of the Future

November 19, 2014

Eindhoven, the Netherlands and Leuven, Belgium—Nov. 19, 2014—Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV, worldwide leader in production and sales of playing cards, promotional cards, casino cards, collector card games, and board games, have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags. The partners will develop these new NFC tags using metal-oxide (IGZO) … Read More → "Holst Centre, imec and CARTAMUNDI Join forces to Create the Near Field Communication Chip of the Future"

Rockchip Debuts Intel Jointly-Developed Game-Changing 3G Processor for Android Devices

November 18, 2014

LOS ANGELES – Nov. 17, 2014 – Rockchip Electronics™ today announced the North American availability of its system-on-a-chip (SoC) processor with 3G communications it jointly developed with Intel®. The SoC is Rockchip’s XMM™6321 and it’s aimed at Android® tablet, phablet and smartphone design manufacturers seeking to develop products for entry-level markets. The device tightly integrates two processors into one complete lowest-cost, fastest-to-market platform solution. This high level of integration is market-changing since competing solutions require three, to as many as five, integrated chips.

Use of the XMM6321 could reduce OEM production times by as much as half and could … Read More → "Rockchip Debuts Intel Jointly-Developed Game-Changing 3G Processor for Android Devices"

ams schedules 2015 multi-project wafer starts for analog foundry customers

November 18, 2014

Unterpremstaetten, Austria (November 17, 2014), The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule for 2015. The prototyping service, which combines several designs from different customers onto a single wafer, offers significant cost advantages for foundry customers as the costs for wafers and masks are shared among a number of different shuttle participants.

Renesas Electronics Delivers Productivity Boost in Industrial Applications with the RZ/T1 Real-Time Processor Solution

November 18, 2014

Düsseldorf, 18 November 2014 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the RZ/T1 Group, a new factory automation solution with built-in industrial network functionality for use in many industrial applications such as AC servo drives, motion controllers, inverter control and general industrial equipment that require high speed, responsiveness, and excellent real-time performance.

“Increased demand for productivity in today’s factories requires improvements in performance and network connectivity,” said Niels Trapp, Senior Manager, Industrial & Communications Business Group, Renesas Electronics Europe. “The new RZ/T1 … Read More → "Renesas Electronics Delivers Productivity Boost in Industrial Applications with the RZ/T1 Real-Time Processor Solution"

AVX Releases New SMPS Capacitor Simulation Software

November 18, 2014

GREENVILLE, S.C. (November 17, 2014) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new version of its SpiCalci simulation software, an engineering tool that calculates performance characteristics and parameters for its switch mode power supply (SMPS) capacitors. Featuring enhanced part selection and including nearly all of the new SMPS devices that AVX has introduced over the past two years, many of which are sole-sourced, SpiCalci 9.0 allows engineers to input raw data and generate output information and graphs that will help them choose which of AVX’s advanced multilayer ceramic (MLC) SMPS capacitors will … Read More → "AVX Releases New SMPS Capacitor Simulation Software"

Xilinx Demonstrates All Programmable Solutions for Industrial Automation Applications at SPS/IPC/Drives 2014

November 18, 2014

SAN JOSE, Calif., Nov. 13, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will demonstrate All Programmable solutions for industrial automation applications at SPS/IPC/Drives 2014. Xilinx, systems companies and ecosystem partners will demonstrate how Xilinx All Programmable FPGAs and SoCs enable differentiated, highly integrated, and system cost optimized solutions for Industry 4.0 factories. Applications include motor control, multilevel inverters, industrial networking, machine vision and functional safety. Visit the Xilinx Stand in Hall 4 #169 at SPS/IPC/Drives 2014, November 25-27, at Nuremberg Messe.

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IAR Systems reveals support for RZ/T1 factory automation network solution from Renesas Electronics

November 18, 2014

Tokyo, Japan / Uppsala, Sweden—November 18, 2014—IAR Systems® announces support for the new RZ/T1 group from Renesas® Electronics Corporation. The RZ/T1 group is a factory automation solution with built-in industrial network functionality for use in industrial control equipment. Thanks to a close relationship with Renesas, IAR Systems supports RZ/T1 on an early stage through the world-leading C/C++ compiler and debugger toolchain IAR Embedded Workbench®.

IAR Systems is the only tools vendor to provide development tools for the entire line-up of … Read More → "IAR Systems reveals support for RZ/T1 factory automation network solution from Renesas Electronics"

MegaChips Joins Imec and Holst Centre’s R&D program on Ultra-low Power Radio

November 18, 2014

Imec Technology Forum Japan (Tokyo, Japan)—Nov. 17, 2014—Nanoelectronics research center imec/Holst Centre and MegaChips, a fabless company focusing on the development of system LSIs and products that incorporate original algorithms and architecture, announced today that they have signed a strategic partnership for joint R&D on ultra-low power (ULP) short radio technology for smart homes and buildings.

Following the growth of mobile devices the rapidly upcoming Internet-of-Things (IoT), the market for connected devices will know an impressive growth in the coming years, with small, battery-operated sensors devices integrated everywhere—from homes and … Read More → "MegaChips Joins Imec and Holst Centre’s R&D program on Ultra-low Power Radio"

STMicroelectronics Supports Drive for Inverters in Smaller Boxes Everywhere, from PHEV Battery Chargers to Solar Generators

November 18, 2014

Geneva, November 18, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top-ranking supplier of power components, has revealed new automotive-qualified silicon-carbide (SiC) diodes for advanced on-board battery chargers (OBCs) in electric vehicles such as Plug-in Hybrids (PHEVs) that demand high power-handing capability within a confined space.

These diodes allow designers to build smaller power modules, which is good for automotive applications and makes them also a strong choice for tackling the Little Box Challenge presented by Google and IEEE. … Read More → "STMicroelectronics Supports Drive for Inverters in Smaller Boxes Everywhere, from PHEV Battery Chargers to Solar Generators"

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