News – Page 1568 – EEJournal

Renesas Electronics Europe Announces Detect it! Solution Kit Based on New Low-Power RL78/I1D MCU for Detector Applications

February 18, 2015

Dusseldorf, February 18, 2015 – Renesas Electronics Europe, a premier supplier of advanced semiconductor solutions, today announced the availability of its new Detect it! solution kit. The Detect it! is designed for detector applications and provides ready to use demonstrators for the most typical detectors used in security and fire protection systems. Detect it! has four hardware boards, a motion detector demonstrator, a smoke detector demonstrator, a carbon monoxide demonstrator, and a glass-break detector demonstrator.

The new solution kit provides a complete solution platform for Renesas’ new RL78/I1D microcontroller … Read More → "Renesas Electronics Europe Announces Detect it! Solution Kit Based on New Low-Power RL78/I1D MCU for Detector Applications"

e2v inc releases enhanced microprocessor and memory devices offering extended temperature range and performance

February 18, 2015

2v inc has announced the availability of enhanced product (EP) versions of its high-reliability PC8548-EP microprocessor and the EV25Q128-EP 128Mb NOR Flash memory, offering an extended temperature range from -55°C to +125°C, as well as the ability to perform to electrical specifications in environments that require extended temperatures.

The PC8548-EP is an integrated microprocessor based on a Power Architecture e500 core delivering more than 3000 MIPS at 1333 MHz. Offering a wide range of high-speed connectivity options, including Gigabit Ethernet (GbE), PCI Express® and Serial RapidIO® it’s an ideal general … Read More → "e2v inc releases enhanced microprocessor and memory devices offering extended temperature range and performance"

Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools

February 18, 2015

Santa Clara, Calif., Feb 18, 2015 – Achronix Semiconductor Corporation today announced the immediate availability of its latest tool suite, the Achronix CAD Environment (ACE) version 5.4, which now contains support for incremental compilation.

Incremental compilation dramatically increases productivity by allowing FPGA designers to compile portions of their design that have changed while leaving the remainder of their design intact. Incremental changes to a design can be passed through the entire tool flow efficiently, providing up to 58% speed-up compared to a non-incremental flow.

Compilation times are a critical consideration for FPGA designers. During both the design and prototype phases … Read More → "Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools"

IAR Systems presents C-STAT: powerful add-on product for extended code analysis possibilities

February 18, 2015

Uppsala, Sweden—February 18, 2015—Today, IAR Systems® announces a new tool for code quality control. As the leading vendor of embedded development tools, the company provides the high-performance toolchain IAR Embedded Workbench®, which in 2014 was complemented by the runtime analysis add-on product C-RUN®. The latest product innovation, C-STAT®, further extends the code analysis possibilities by adding powerful static code analysis directly within the development toolchain.

The embedded industry’s challenge of delivering more complex software at an ever-increasing pace raises the risks of software errors, which can affect … Read More → "IAR Systems presents C-STAT: powerful add-on product for extended code analysis possibilities"

Epson Improves GPS Watch Battery Life with Cadence Tensilica Xtensa Processor

February 18, 2015

SAN JOSE, Calif., 17 Feb 2015 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Epson has switched from its previous GPS subsystem to one using the Cadence® Tensilica® Xtensa® processor to extend the battery life of its wrist watch GPS running monitors from 14 hours to up to 30 hours when the GPS function is activated. Epson took advantage of the highly flexible Xtensa processor architecture to optimize the design for the best power, performance and area results, which greatly contributed to the overall subsystem power savings.

For more information … Read More → "Epson Improves GPS Watch Battery Life with Cadence Tensilica Xtensa Processor"

eWBM Selects Elliptic’s Secure Root of Trust Technology for Newest IoT Chipset

February 18, 2015

February 18, 2015 – Ottawa, Canada: Elliptic Technologies, a leading provider of security for the connected world, today announced that SoC solution provider eWBM has selected Elliptic’s tRoot™ technology, a future-proof secure hardware root of trust enabling unique identification and authentication, for their newest IoT chipsets.

IoT devices with sensors, actuators and other data sources transfer information into aggregation points and gateways that can funnel through limitless paths with varied levels of complexity. Addressing security concerns in this challenging environment … Read More → "eWBM Selects Elliptic’s Secure Root of Trust Technology for Newest IoT Chipset"

Green Hills Software to Showcase Its Innovative Security and Safety-Critical Solutions at embedded world

February 17, 2015

SANTA BARBARA, CA — February 17, 2015 — Green Hills Software, the largest independent software vendor for the Internet of Things (IoT), will present technical sessions in the embedded world conference in Nuremberg, Germany, and demonstrate optimized solutions on our stand (Hall 4, Stand 325). We will also present in our in-stand theatre to help embedded designers build and deploy software with maximum performance, absolute security, in the fastest time-to-market. Green Hills will present and demonstrate its leading support for today’s latest processors.

Theatre Presentation

< … Read More →

eBeam Initiative Announces Education and Collaboration Focus on Reactivating Density Benefits of Moore’s Law

February 17, 2015

SAN JOSE, Calif., February 17, 2015–The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore’s Law through eBeam technology. Efforts to educate, collaborate and promote this theme to the photomask and lithography community will include focusing on how new developments in multi-beam mask writing and model-based mask data preparation (MB-MDP), coupled with complex inverse lithography technology (ILT), can reverse the trend of rectilinear constraints on mask designs and enable continued … Read More → "eBeam Initiative Announces Education and Collaboration Focus on Reactivating Density Benefits of Moore’s Law"

TE Connectivity Brings Consumer Antenna Capabilities to Aerospace and Defense

February 17, 2015

HARRISBURG, Pa. – Feb. 17, 2015 – TE Connectivity (TE), a world leader in connectivity, and a leading supplier of standard and custom antennas for consumer applications, is bringing its expertise to military and aerospace markets in the form of moldable composites and selective metallization. TE is delivering antennas that are smaller and lighter, and offer higher performance and increased functionality in flight and ground applications.

Advancements in materials science are enabling next-generation technologies like low-profile conformal antennas and antennas integrated into housings that help reduce complexity, simplify manufacturing and provide consistent performance.

“TE is continually working to … Read More → "TE Connectivity Brings Consumer Antenna Capabilities to Aerospace and Defense"

GLOBALFOUNDRIES Joins imec to Develop Innovative RF Solutions for Internet of Things Applications

February 17, 2015

Santa Clara, Calif., February 17, 2015 – Collaboration to address critical challenges in radio architecture design in multiband, multimode mobile radios and ultra-low power (ULP) wireless devices. Cooperation on critical digital-intensive RF architectures and analog circuits for mobile communications and IoT sensor nodes. Research will leverage GLOBALFOUNDRIES CMOS technology platforms optimized to boost RF performance of IC’s. GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced a partnership with imec, a leading nanoelectronics research center, for joint research … Read More → "GLOBALFOUNDRIES Joins imec to Develop Innovative RF Solutions for Internet of Things Applications"

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