News – Page 1568 – EEJournal

Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform

July 16, 2013

SAN JOSE, CA–(Marketwired – July 16, 2013) – Cadence Design Systems (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Hitachi reduced development time and accelerated time to market for new IT products by utilizing the Cadence® Rapid Prototyping Platform. Hitachi collaborated with Cadence as a strategic partner on an integrated verification and early software development environment to enhance quality and shorten turnaround time for Hitachi’s new IT products. Hitachi successfully implemented a system-level … Read More → "Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform"

Neonode Launches Circular Multi-Touch and Proximity Platform for Wearable Tech

July 16, 2013

SANTA CLARA, Calif., July 16, 2013 (GLOBE NEWSWIRE) — Neonode Inc., (Nasdaq:NEON), the optical touch technology company, today announced the release of a new, unique and versatile Circular Multisensing® platform developed for wearable electronics and accessories. The solution is especially developed for a wide range of fast-growing new market segments, such as fashion-tech, sports & fitness, medical, gaming & lifestyle, and portable infotainment.

The new waterproof and cost-efficient solution is specifically engineered to add enhanced … Read More → "Neonode Launches Circular Multi-Touch and Proximity Platform for Wearable Tech"

Compact 400 Watt power supply capable of 700 Watt peak

July 16, 2013

XP Power today announced the SDL400 series of 400 Watt single and dual output AC-DC power supplies. These compact units, suitable for 1U applications, are available in four mechanical formats: U channel, U channel with cover (-C option), top fan cover (-F option) and end fan cover (-E option). All of the formats apart from the top fan mounted version are less than 1.6 inches (39.9 mm) high. A variable speed fan is used to reduce audible noise at lower load conditions and extend fan life in the –E and –F models. For applications without a fan or forced air flow, … Read More → "Compact 400 Watt power supply capable of 700 Watt peak"

UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node

July 16, 2013

SAN JOSE, CA–(Marketwired – July 16, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS

New flows incorporate the industry’s leading DFM prevention, analysis, and signoff capabilities
Cadence technologies selected after extensive benchmark testing
DFM solutions to boost productivity and enhance yield for customers

Cadence Design Systems, Inc. (NASDAQ: CDNS</ … Read More → "UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node"

STMicroelectronics to Showcase its Latest Solutions for Sense and Power Applications at TECHNO-FRONTIER 2013

July 16, 2013

Tokyo, July 16, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will be exhibiting at TECHNO-FRONTIER 2013. At the ST Booth 1D-201, you can witness various demonstrations and see the development boards that focus on the power solutions that promote an effective use of resources, and the sensing solutions that improve user experiences, increase customer benefits, and contribute to the realization of a new lifestyle for people.

Sensing Solutions

Sensing our surroundings and the environmental information in our homes so that the info can improve our lives … Read More → "STMicroelectronics to Showcase its Latest Solutions for Sense and Power Applications at TECHNO-FRONTIER 2013"

EMA Announces a New Enhanced Version of CircuitSpace

July 16, 2013

Rochester, NY (July 16, 2013) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced CircuitSpace 5.0 with enhanced features to improve the usability and productivity for circuit board design placement, replication, and design reuse in Cadence® Allegro® PCB Designer. “CircuitSpace enables engineers to expedite the PCB design requirements with a higher level of quality and reproducibility from the placement phase of the design cycle through design review and verification,” said Manny Marcano, president and CEO of EMA. “We strive to … Read More → "EMA Announces a New Enhanced Version of CircuitSpace"

Micron Unveils 16-Nanometer Flash Memory Technology

July 16, 2013

Boise, Idaho, July 16, 2013 – Micron Technology, Inc., (Nasdaq:MU) today announced that it is sampling next-generation, 16-nanometer (nm) process technology, enabling the industry’s smallest 128-gigabit (Gb) multi-level cell (MLC) NAND Flash memory devices. The 16nm node is not only the leading Flash process, but it is also the most advanced processing node for any sampling semiconductor device. It solidifies Micron’s leadership position in storage technology development and delivers on the company’s vision to provide the most advanced semiconductor solutions.

Micron’s 128Gb MLC NAND Flash memory devices are targeted at applications like consumer SSDs, removable … Read More → "Micron Unveils 16-Nanometer Flash Memory Technology"

Altium releases Maxim Integrated Board-Level Design Content Online

July 16, 2013

Shanghai, China – 16 July 2013 – Altium Limited, a global leader in Smart System Design Automation and provider of solutions for 3D PCB design (Read More → "Altium releases Maxim Integrated Board-Level Design Content Online"

DAS Achieves World’s First Point-of-Use Abatement of Harmful Gases in Wet Bench Semiconductor Processes

July 15, 2013

DRESDEN, Germany, July 15, 2013 – Responding with a breakthrough approach to a major semiconductor customer request, DAS Environmental Expert GmbH of Dresden, Germany, developed and installed SALIX – the world’s first and only commercially available point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications – and, after six months of evaluation, today announced it is proven fully effective. DAS believes its unique approach of using a high-efficiency, small footprint point-of-use system … Read More → "DAS Achieves World’s First Point-of-Use Abatement of Harmful Gases in Wet Bench Semiconductor Processes"

Leti and Partners in SOCRATE Project Focusing on Miniature Antennas with Super-Directivity Radiation Properties

July 15, 2013

GRENOBLE, France – July 15, 2013 – CEA-Leti said today that it and three partners in the SOCRATE project are developing innovative conceptsto significantly improve the directivity of electrically small antennas.

These antennas are generally limited to omnidirectional radiation, which is suitable for many wireless applications for communicating objects, such as UHF RFID, wireless telemetry and home automation. Nonetheless, the increase in small antennas’ directivity could create new wireless applications with improved spectral efficiency, reduced environmental electromagnetic impact and usage features that increase functionality.

The SOCRATE Project is based on an analysis of the fundamental limits of radiation properties … Read More → "Leti and Partners in SOCRATE Project Focusing on Miniature Antennas with Super-Directivity Radiation Properties"

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