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Saelig Introduces Pre-compliance EMC Probe Kits

Fairport, NY: Saelig Company, Inc. announces the availability of the TBPS01-TBWA2 EMC Probe Kit, which includes investigative near-field probes and a wideband amplifier to increase the versatility of economical spectrum analyzers to identify EMC issues.  The economical TBPS01-TBWA2 EMC Probe Kit consists of four rubber-handled near-field probes (three H-field and one E-field), a 20dB or a 40dB wideband amplifier, and associated cables, supplied in an attractive wooden case.  The shielded probes have built-in ferrites and insulated rubber handles to insure that measurements are insensitive to the human hand.   

Allegro MicroSystems, LLC Introduces New Hall-Effect Speed/Direction Sensor IC With Hysteresis Detection

Worcester, MA – February 17, 2015 – Allegro MicroSystems, LLC introduces a new Hall-effect speed and direction sensor IC with hysteresis detection. The A1232 is a highly sensitive, temperature stable, magnetic sensing device ideal for use in ring magnet based speed and direction systems in harsh automotive and industrial environments. It is the first device of its kind with the ability to detect when it powers … Read More → "Allegro MicroSystems, LLC Introduces New Hall-Effect Speed/Direction Sensor IC With Hysteresis Detection"

STMicroelectronics Shatters Performance Limitations for Ultra Low-Power Applications with New STM32L4 Microcontrollers

Geneva, February 19, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has combined its ultra low-power microcontroller technology with ARM® Cortex®-M4 know-how to create the STM32L4 series for next-generation energy-conscious consumer, industrial, medical, and metering applications.

The first two microcontrollers in the series, the STM32L476 and STM32L486, … Read More → "STMicroelectronics Shatters Performance Limitations for Ultra Low-Power Applications with New STM32L4 Microcontrollers"

Imec Reports Breakthrough Results on Directed Self-Assembly at SPIE Advanced Lithography 2015

Leuven (Belgium)–Feb. 19, 2015–At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 2226, imec will present breakthrough results on Directed Self-Assembly (DSA) process development. Together with semiconductor equipment supplier Tokyo Electron and Merck, a leading chemical and pharmaceutical company that acquired AZ Electronic Materials in May 2014, imec has significantly improved DSA defectivity in the past year, … Read More → "Imec Reports Breakthrough Results on Directed Self-Assembly at SPIE Advanced Lithography 2015"

Dual-band Wi-Fi and dual-mode Bluetooth offered in a small, powerful, stand-alone module by u-blox

Thalwil, Switzerland – February 19, 2015 – u-blox, a global leader in wireless and positioning modules and chips, announces ODIN-W262, a new stand-alone multiradio module designed for Internet-of-Things applications. The professional-grade (-40 °C to +85 °C) module makes adding wireless connectivity to any product quick and easy, with the added benefit that it is radio type-approved in countries across the world. A robust, built-in antenna provides flexibility with respect to the module’s installed position and orientation. Applications include cable replacement running in Wireless Multidrop and Extended Data Mode for advanced … Read More → "Dual-band Wi-Fi and dual-mode Bluetooth offered in a small, powerful, stand-alone module by u-blox"

STMicroelectronics and Flextronics Reveal World’s First Plug-In Charger Platform with Zero No-Load Power Consumption

Geneva, Switzerland; San Jose, CA, February 18, 2015– STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leader in ICs for Power Conversion, and Flextronics,an innovative supply chain solutions company that delivers design, engineering, manufacturing and logistics services to a wide range of industries and end-markets and the worldwide leader in smartphone and tablet power adapters, have jointly developed a plug-in charging platform based on an ST multi-mode power-management controller that delivers breakthrough technology for mobile devices. The new energy-efficient platform is designed with the industry’s most effective power-management architecture to … Read More → "STMicroelectronics and Flextronics Reveal World’s First Plug-In Charger Platform with Zero No-Load Power Consumption"

Artesyn Embedded Technologies Announces Open Compute Project (OCP) Platform for Network Functions Virtualization

Artesyn Embedded Technologies today announced its first high performance integrated computing system inspired by Open Compute Project (OCP) standards. The Centellis® OCP Platform is designed to help communication service providers dramatically lower the capital and operating expense associated with running their networks by leveraging open standard and open source hardware and software, and taking advantage of virtualization and cloud technologies. This new Centellis OCP Platform is a rack solution that integrates servers, storage and top-of-rack switches, and offers improvements in density, availability, flexibility, scalability, serviceability, … Read More → "Artesyn Embedded Technologies Announces Open Compute Project (OCP) Platform for Network Functions Virtualization"

Achronix Announces Production Availability of Speedster22i Product Family

Santa Clara, Calif., Feb 17, 2015 – Achronix Semiconductor Corporation today announced that the Speedster22i family of FPGAs has transitioned into production status. The Speedster22i FPGA family is built on Intel’s 22nm Tri-Gate process technology and consists of three device members, two of which have entered production – the HD680 with 660 thousand effective look-up-tables (LUTs) and the HD1000 with 1 million effective LUTs.

Speedster22i FPGAs combines the most advanced production process technology node with the greatest amount of hardened interface IP currently available. The HD1000 has two 100 Gigabit Ethernet controllers, two 120 gigabit Interlaken controllers, two PCIe Gen3 x8 … Read More → "Achronix Announces Production Availability of Speedster22i Product Family"

Xilinx and BEEcube Deliver World’s First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications

SAN JOSE, Calif.Feb. 17, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) and BEEcube today announced they have delivered the world’s first millimeter wave (mmWave) prototyping platform solution for pioneering development of 5G applications. Xilinx’s newest 256QAM 500MHz mmWave modem IP coupled with the BEEcube BEE7 baseband platform provides a complete “out of the box” solution addressing the 60GHz backhaul market thereby enabling designers to work on innovative mmWave designs immediately.

“5G will increase cellular network capacity by a factor of 1,000 … Read More → "Xilinx and BEEcube Deliver World’s First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications"

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