Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a “instrumented nanoscale indenter,” that makes sensitive measurements of the mechanical properties of thin films—ranging from auto body coatings to microelectronic devices—and biomaterials. The NIST instrument uses a unique technique for precisely measuring the depth of the indentation in a test surface with no contact of the surface other than the probe tip itself.*

Instead of dents in metal, says NIST’s Douglas Smith, “We are trying to get the most … Read More → "New NIST Nanoscale Indenter Takes Novel Approach to Measuring Surface Properties"

A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date.

Schematic of thermal management in electronics: Local temperature increases occur as a result of current flow in active regions of devices and can lead to degradation of device performance. Materials with high thermal conductivities are used in heat spreading and sinking to conduct heat … Read More → "NRL Researchers Discover Novel Material for Cooling of Electronic Devices"