News – Page 1545 – EEJournal

The Quest for Efficiency in Thermoelectric Nanowires

February 2, 2015

ALBUQUERQUE, N.M. — Efficiency is big in the tiny world of thermoelectric nanowires.

Researchers at Sandia National Laboratories say better materials and manufacturing techniques for the nanowires could allow carmakers to harvest power from the heat wasted by exhaust systems or lead to more efficient devices to cool computer chips.

Sandia researchers published a paper, “Using Galvanostatic Electroforming of Bi1-xSbxNanowires to Control Composition, Crystallinity and Orientation,” in the Jan. 28 edition of the Materials Research Society’s MRS Bulletin. The authors are W. Graham Yelton, Steven … Read More → "The Quest for Efficiency in Thermoelectric Nanowires"

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography

January 30, 2015

SPIE Advanced Lithography 2015 will highlight critical technologies including EUV and 3D integration in transistor scaling, and strategies for managing and maximizing the Internet of Things. In its 40th year in 2015, the meeting, sponsored by SPIE, the international society for optics and photonics, will draw leaders from throughout the global community to hear the latest on research findings and industry developments.

BELLINGHAM, Washington, USA — Extreme ultraviolet lithography (EUV), 3D integration, and the Internet of Things will be among critical technologies featured at SPIE Advanced Lithography 2015 Read More → "EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography"

Allegro MicroSystems, LLC Announces New Multiple-Output Regulator For Automotive LCD Displays

January 30, 2015

Worcester, MA – January 29, 2015 – Allegro MicroSystems, LLC announces a new AEC-Q100 qualified, multiple-output regulator for powering automotive LCD displays. Allegro’s A8603 operates with fixed switching frequency that can be either programmed or synchronized with an external clock signal between 350 kHz and 2.25 MHz. This will minimize interference with AM and FM radio bands. An I²C™-compliant serial interface allows a system … Read More → "Allegro MicroSystems, LLC Announces New Multiple-Output Regulator For Automotive LCD Displays"

TE Connectivity’s Revolutionary New ARISO Contactless Connectivity System Now Available from Mouser

January 30, 2015

January 30, 2015- Mouser Electronics, Inc. is now stocking the new, revolutionary Read More → "TE Connectivity’s Revolutionary New ARISO Contactless Connectivity System Now Available from Mouser"

Synopsys’ New DesignWare Medium Density NVM IP Family Reduces Die Cost by Up to 25 Percent

January 29, 2015

MOUNTAIN VIEW, Calif., Jan. 29, 2015 /PRNewswire/ —

Highlights:

Reprogrammable DesignWare Medium Density NVM IP delivers flash-like functionality without additional masks or processing steps, reducing die cost by up to 25 percent
Provides up to 64 Kbytes of on-chip memory with more than 5X the density compared to lower bit-count NVM solutions
Enables microcontroller integration with on-chip reprogrammable NVM in 180-nm 5V CMOS and BCD processes, where embedded flash capabilities are unavailable
Provides integrated Error Checking and Correction (ECC) … Read More → "Synopsys’ New DesignWare Medium Density NVM IP Family Reduces Die Cost by Up to 25 Percent"

512Kbyte STM32F3 MCUs from STMicroelectronics Raise the Bar in System Integration

January 29, 2015

Geneva, January 29, 2015 – STMicroelectronics has extended its STM32F3 microcontroller series for applications that require high performance and innovative features at affordable cost. The new devices add larger memory densities up to 512Kbyte Flash and 80KB SRAM, as well as richer peripherals for high-speed control and off-chip storage.

The STM32F3 series defines the entry point to ST’s ARM^® Cortex^®-M4 microcontroller portfolio. The proven M4 core with DSP and floating-point unit, running up to 72MHz, executes deterministic routines such as … Read More → "512Kbyte STM32F3 MCUs from STMicroelectronics Raise the Bar in System Integration"

Bluetooth Smart mesh network lighting platform claims to be 5x faster than competing solutions by combining Bluetooth Smart and proprietary 2.4GHz

January 29, 2015

Developed by Finnish lighting specialist, Casambi, this award-winning third-party platform based on the dual-protocol Nordic nRF51822 SoC is designed to bring smart lighting to mainstream consumers by making it easy to install, simple to use, and affordable, and can be integrated directly into LED smart bulbs and drivers, as well as lighting fixtures.

Oslo, Norway – January 29, 2015 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Finnish smart lighting specialist, Casambi Technologies Oy, is employing the Nordic nRF51822 System-on-Chip (SoCs) to provide the Bluetooth® Smart (formerly known as Bluetooth … Read More → "Bluetooth Smart mesh network lighting platform claims to be 5x faster than competing solutions by combining Bluetooth Smart and proprietary 2.4GHz"

New Artesyn Embedded Technologies Compact ATCA System Platform Offers Highest Power and Cooling Performance

January 28, 2015

Artesyn Embedded Technologies today announced the Centellis^® 2100, a two-slot 40G AdvancedTCA^® (ATCA^®) system platform designed to support the latest high performance payload blades. With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements.

The Centellis 2100 ATCA system … Read More → "New Artesyn Embedded Technologies Compact ATCA System Platform Offers Highest Power and Cooling Performance"

PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, and 100 GHz Oscilloscope Capabilities Showcased at DesignCon 2015

January 28, 2015

Chestnut Ridge, NY and Santa Clara, CA, January 28, 2015 – Teledyne LeCroy, a longtime Diamond Sponsor of DesignCon, will once again be showcasing the latest innovations in test technology on the exhibition floor in Santa Clara, January 28-29. Product exhibits include the world’s first 100 GHz bandwidth real-time oscilloscope; the first 12-bit, 8-channel high definition oscilloscope; and the only receiver/transmitter test instrument capable of PCIe link equalization testing. These pioneering technologies are the building blocks of unique test and analysis tools such as PAM4 Analysis, USB 3.1 Compliance, DDR Debug, and PCI … Read More → "PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, and 100 GHz Oscilloscope Capabilities Showcased at DesignCon 2015"

4DSP’s Sensuron Unit Announces Revolutionary 3D Shape Sensing for Medical Applications

January 28, 2015

AUSTIN, TX – 4DSP announces the release of groundbreaking 3D shape sensing technology that will change the landscape for medical instrumentation developers and physicians. Through its new Sensuron unit, 4DSP is the leading global … Read More → "4DSP’s Sensuron Unit Announces Revolutionary 3D Shape Sensing for Medical Applications"