News – Page 1544 – EEJournal

Xilinx and its Ecosystem to Showcase All Programmable Smarter Solutions for Professional Broadcast Systems at IBC 2013

September 12, 2013

SAN JOSE, Calif., Sept 12, 2013 – Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem will showcase All Programmable smarter solutions for professional broadcast systems. Demonstrations include UltraHD video solutions, Real Time Video Engine (RTVE), SMPTE 2022 video over IP, the Zynq®-7000 All Programmable SoC Video Development Kit, and several demonstrations from multiple Xilinx® Alliance Program members.

Technical Paper Presentations

Visit the IBC ‘Future Zone’ area and hear ‘poster’ presentations from Xilinx and Alliance Program members:

“Fully Scalable and Configurable Video Processing,” Bob Feng, system architect for Xilinx … Read More → "Xilinx and its Ecosystem to Showcase All Programmable Smarter Solutions for Professional Broadcast Systems at IBC 2013"

Latest Release of Synopsys’ CODE V Enables Faster, More Robust Optical Design Optimization

September 12, 2013

MOUNTAIN VIEW, Calif., Sept. 12, 2013 /PRNewswire/ —

Highlights:

Unique optimization algorithm speeds design of optical systems with superior image quality
Customizable charts provide enhanced system performance visualization
Ease of use improvements simplify design and analysis

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of Synopsys’ CODE V^® Optical Design Software, version 10.6. Further enhancing the industry-leading design … Read More → "Latest Release of Synopsys’ CODE V Enables Faster, More Robust Optical Design Optimization"

Industry-unique Faroudja® Transcoding Technology from STMicroelectronics Connects Digital Homes to Everything, Everywhere, All the Time

September 12, 2013

Geneva, September 12, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the industry’s first transcoding engine that enables a home gateway to distribute any type of content to any type of connected device in the home. Initially implemented in the popular STiH416 (‘Orly’) and fully supported in the recently introduced Read More → "Industry-unique Faroudja® Transcoding Technology from STMicroelectronics Connects Digital Homes to Everything, Everywhere, All the Time"

Microsemi 750 Watt GaN on SiC RF Power Transistor Delivers Unparalleled High-power Performance for Aviation Applications

September 12, 2013

ALISO VIEJO, Calif.—Sept. 12, 2013—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today expanded its family of radio frequency (RF) power transistors based on gallium nitride (GaN) high electron mobility transistor (HEMT) on silicon carbide (SiC) technology with a new 750 watt (W) RF transistor. The MDSGN-750ELMV delivers outstanding, highest power performance in a full range of air traffic control and collision avoidance equipment. Targeted applications include commercial secondary surveillance radar (SSR), which is used globally to … Read More → "Microsemi 750 Watt GaN on SiC RF Power Transistor Delivers Unparalleled High-power Performance for Aviation Applications"

Plug-and-play: New low-cost MSP430™ USB LaunchPad and NFC BoosterPack let developers tap into the Internet of Things (IoT)

September 12, 2013

DALLAS (September 12, 2013) – Designed with input from the engineering and maker communities, Texas Instruments (TI) (NASDAQ: TXN) today announced the highly anticipated MSP430™ USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for its portfolio of USB microcontrollers. The MSP-EXP430F5529LP LaunchPad, based on the ultra-low power MSP430F5529 microcontroller (MCU), provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications.</ … Read More → "Plug-and-play: New low-cost MSP430™ USB LaunchPad and NFC BoosterPack let developers tap into the Internet of Things (IoT)"

Soitec launches new solar-energy module featuring 31.8% efficiency – The highest of any commercial module being mass produced today

September 12, 2013

Bernin (Grenoble), France, September 11, 2013 — Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced its newest concentrated photovoltaic (CPV) module featuring a record power-generating efficiency of 31.8 percent. Soitec’s new module, which is already in industrial volume production, has the highest efficiency of any commercial product available for multi-megawatt installations.

Using an optimized anti-reflective coating, Soitec’s CX-M500 module increases nominal peak power output over previous generations from 2,335 Wp to 2,450 Wp. The new module has been certified according to the International Electrotechnical Commission’s (IEC)</ … Read More → "Soitec launches new solar-energy module featuring 31.8% efficiency – The highest of any commercial module being mass produced today"

New PCB Design Libraries for Linear Technology feature Altium 3D CAD Data and Real Time Supply Chain Information

September 12, 2013

Shanghai, China – 12 September 2013 – Altium Limited, a global leader in Smart System Design Automation and provider of solutions for 3D PCB design (Read More → "New PCB Design Libraries for Linear Technology feature Altium 3D CAD Data and Real Time Supply Chain Information"

ADLINK Launches Latest ATCA Blade with Refreshed Intel® Xeon® E5-2600 v2 processor and Intel® Communications Chipset 8920

September 11, 2013

September 10, 2013 – San Francisco, CA – Intel Developer Forum – ADLINK Technology, Inc., a leading provider of trusted telecom computing products, today announced availability of its latest high performance AdvancedTCA^® (ATCA) processor blade, the aTCA-9700. Featuring dual Intel® Xeon® E5-2600 v2 product family (formerly “Ivy Bridge-EP”) processors paired with Intel® Communications Chipset 8920 series (formerly codenamed “Crystal Forest Server Refresh”), the aTCA-9700 offers enhanced thermal and power management capabilities for exceptional energy efficiency, while still supporting the intensive computing requirements of carrier-grade media server, networking, and wireless infrastructure applications.

“The aTCA-9700 … Read More → "ADLINK Launches Latest ATCA Blade with Refreshed Intel® Xeon® E5-2600 v2 processor and Intel® Communications Chipset 8920"

HDL Design House MIPI CSI-2 TX IP core successfully integrated into Fujitsu APIX® Companion Chip

September 11, 2013

Belgrade, Serbia – September 11^th, 2013 – HDL Design House, provider of high performance digital and analog IP cores and SoC design and verification services, today announced that its MIPI CSI-2 Transmitter (HIP 3900) digital IP core, compliant with the MIPI Alliance CSI-2 Specification, has been successfully integrated into Fujitsu Semiconductor Europe GmbH’s APIX^®Read More → "HDL Design House MIPI CSI-2 TX IP core successfully integrated into Fujitsu APIX® Companion Chip"

Real Intent to Exhibit at SNUG Designer Community Expo in Austin on Sept. 18

September 11, 2013

SUNNYVALE, CALIF. – (MARKET WIRE) Sept. 11, 2013 –

Who

Real Intent, whose advanced verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness.

What

Will exhibit its Ascent™ and Meridian™ products for advanced SoC sign-off at the Synopsys® Designer Community Expo at the Synopsys Users Group ( … Read More → "Real Intent to Exhibit at SNUG Designer Community Expo in Austin on Sept. 18"

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